DE69804352D1 - Mikrostruktur mit einem verformbaren element durch einwirkung eines thermischen antriebes - Google Patents

Mikrostruktur mit einem verformbaren element durch einwirkung eines thermischen antriebes

Info

Publication number
DE69804352D1
DE69804352D1 DE69804352T DE69804352T DE69804352D1 DE 69804352 D1 DE69804352 D1 DE 69804352D1 DE 69804352 T DE69804352 T DE 69804352T DE 69804352 T DE69804352 T DE 69804352T DE 69804352 D1 DE69804352 D1 DE 69804352D1
Authority
DE
Germany
Prior art keywords
microstructure
intervention
deformable element
thermal drive
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69804352T
Other languages
English (en)
Other versions
DE69804352T2 (de
Inventor
Yves Fouillet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE69804352D1 publication Critical patent/DE69804352D1/de
Application granted granted Critical
Publication of DE69804352T2 publication Critical patent/DE69804352T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0024—Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/016—Switches characterised by the shape having a bridge fixed on two ends and connected to one or more dimples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/032—Bimorph and unimorph actuators, e.g. piezo and thermo
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H2037/008—Micromechanical switches operated thermally
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Thermally Actuated Switches (AREA)
DE69804352T 1997-12-16 1998-12-14 Mikrostruktur mit einem verformbaren element durch einwirkung eines thermischen antriebes Expired - Lifetime DE69804352T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9715931A FR2772512B1 (fr) 1997-12-16 1997-12-16 Microsysteme a element deformable sous l'effet d'un actionneur thermique
PCT/FR1998/002719 WO1999031689A1 (fr) 1997-12-16 1998-12-14 Microsysteme a element deformable sous l'effet d'un actionneur thermique

Publications (2)

Publication Number Publication Date
DE69804352D1 true DE69804352D1 (de) 2002-04-25
DE69804352T2 DE69804352T2 (de) 2002-10-10

Family

ID=9514668

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69804352T Expired - Lifetime DE69804352T2 (de) 1997-12-16 1998-12-14 Mikrostruktur mit einem verformbaren element durch einwirkung eines thermischen antriebes

Country Status (6)

Country Link
US (2) US6812820B1 (de)
EP (1) EP1040492B1 (de)
JP (1) JP2002509332A (de)
DE (1) DE69804352T2 (de)
FR (1) FR2772512B1 (de)
WO (1) WO1999031689A1 (de)

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FR2818795B1 (fr) * 2000-12-27 2003-12-05 Commissariat Energie Atomique Micro-dispositif a actionneur thermique
WO2003014789A2 (en) * 2001-07-05 2003-02-20 International Business Machines Coporation Microsystem switches
EP1419511B1 (de) 2001-08-20 2006-06-28 Honeywell International Inc. Thermischer schnappschalter
KR100421222B1 (ko) * 2001-11-24 2004-03-02 삼성전자주식회사 저전압 구동의 마이크로 스위칭 소자
KR100485787B1 (ko) * 2002-08-20 2005-04-28 삼성전자주식회사 마이크로 스위치
AU2003901253A0 (en) * 2003-03-17 2003-04-03 Zip Holdings Pty Ltd Temperature Sensing Devices, Systems and Methods
FR2857153B1 (fr) * 2003-07-01 2005-08-26 Commissariat Energie Atomique Micro-commutateur bistable a faible consommation.
FR2865724A1 (fr) * 2004-02-04 2005-08-05 St Microelectronics Sa Microsysteme electromecanique pouvant basculer entre deux positions stables
FR2868591B1 (fr) * 2004-04-06 2006-06-09 Commissariat Energie Atomique Microcommutateur a faible tension d'actionnement et faible consommation
US7239064B1 (en) 2004-10-15 2007-07-03 Morgan Research Corporation Resettable latching MEMS temperature sensor apparatus and method
US7283030B2 (en) * 2004-11-22 2007-10-16 Eastman Kodak Company Doubly-anchored thermal actuator having varying flexural rigidity
US7665300B2 (en) * 2005-03-11 2010-02-23 Massachusetts Institute Of Technology Thin, flexible actuator array to produce complex shapes and force distributions
US7339454B1 (en) * 2005-04-11 2008-03-04 Sandia Corporation Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
TW200728605A (en) * 2006-01-20 2007-08-01 Univ Tamkang Thermo-buckled micro-actuator unit made of polymer with high thermal expansion coefficient
JP2008039502A (ja) * 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
US8206025B2 (en) 2007-08-07 2012-06-26 International Business Machines Corporation Microfluid mixer, methods of use and methods of manufacture thereof
FR2930457B1 (fr) * 2008-04-24 2010-06-25 Commissariat Energie Atomique Procede de fabrication de microcanaux reconfigurables
US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
US11001494B2 (en) * 2011-06-23 2021-05-11 Duality Reality Energy, LLC Multi-zone microstructure spring
US9085454B2 (en) 2011-07-05 2015-07-21 Duality Reality Energy, LLC Reduced stiffness micro-mechanical structure
FR2982424B1 (fr) 2011-11-09 2014-01-10 Commissariat Energie Atomique Systeme de conversion d'energie thermique en energie electrique a efficacite amelioree
US9076961B2 (en) 2012-01-31 2015-07-07 Duality Reality Energy, LLC Energy harvesting with a micro-electro-machanical system (MEMS)
WO2013119834A1 (en) 2012-02-10 2013-08-15 Northeastern University Sealable microvalve that can be repeatedly opened and sealed
US9217755B2 (en) 2012-02-15 2015-12-22 Massachusetts Institute Of Technology Method and apparatus for building three-dimensional MEMS elements
US9573802B2 (en) 2012-02-15 2017-02-21 Massachusetts Institute Of Technology Method and apparatus for building three-dimensional MEMS elements
WO2013122585A1 (en) * 2012-02-15 2013-08-22 Massachusetts Institute Of Technology Method and apparatus for buidlling three-dimensional mems elements
US9511995B2 (en) 2012-02-15 2016-12-06 Massachusetts Institute Of Technology Method and apparatus for building three-dimensional MEMS elements
FR2988911A1 (fr) * 2012-04-02 2013-10-04 St Microelectronics Crolles 2 Plaque incurvee et son procede de fabrication
FR2988912A1 (fr) 2012-04-02 2013-10-04 St Microelectronics Crolles 2 Dispositif de recuperation d'energie
KR102019098B1 (ko) * 2013-04-19 2019-11-04 엘지이노텍 주식회사 멤스 소자
KR102085803B1 (ko) * 2013-06-28 2020-04-14 엘지이노텍 주식회사 멤스 소자 및 카메라 모듈
KR102107584B1 (ko) * 2013-08-29 2020-05-07 엘지이노텍 주식회사 멤스 소자
DE102016112762B4 (de) 2016-07-12 2019-07-11 Infineon Technologies Ag Schichtstruktur und Verfahren zum Herstellen einer Schichtstruktur
EP3301425B1 (de) * 2016-09-30 2021-01-20 Sciosense B.V. Drucksensorvorrichtung und verfahren zur herstellung einer drucksensorvorrichtung
US11693295B2 (en) * 2019-06-28 2023-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Auto-focusing device and method of fabricating the same

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Also Published As

Publication number Publication date
US20050046541A1 (en) 2005-03-03
EP1040492A1 (de) 2000-10-04
FR2772512A1 (fr) 1999-06-18
JP2002509332A (ja) 2002-03-26
DE69804352T2 (de) 2002-10-10
US7356913B2 (en) 2008-04-15
EP1040492B1 (de) 2002-03-20
FR2772512B1 (fr) 2004-04-16
US6812820B1 (en) 2004-11-02
WO1999031689A1 (fr) 1999-06-24

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