DE69724101D1 - Aktive wärmesenke mit ringen zur erhöhung des durchflusses und verfahren zur wärmeabfuhr - Google Patents

Aktive wärmesenke mit ringen zur erhöhung des durchflusses und verfahren zur wärmeabfuhr

Info

Publication number
DE69724101D1
DE69724101D1 DE69724101T DE69724101T DE69724101D1 DE 69724101 D1 DE69724101 D1 DE 69724101D1 DE 69724101 T DE69724101 T DE 69724101T DE 69724101 T DE69724101 T DE 69724101T DE 69724101 D1 DE69724101 D1 DE 69724101D1
Authority
DE
Germany
Prior art keywords
rings
increasing
flow rate
heat
heat sinks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69724101T
Other languages
English (en)
Inventor
I Lemont
Jeffrey Radziunas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lemont Aircraft Corp
Original Assignee
Lemont Aircraft Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lemont Aircraft Corp filed Critical Lemont Aircraft Corp
Application granted granted Critical
Publication of DE69724101D1 publication Critical patent/DE69724101D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69724101T 1996-02-22 1997-02-20 Aktive wärmesenke mit ringen zur erhöhung des durchflusses und verfahren zur wärmeabfuhr Expired - Lifetime DE69724101D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1209896P 1996-02-22 1996-02-22
US08/763,483 US5896917A (en) 1996-02-22 1996-12-11 Active heat sink structure with flow augmenting rings and method for removing heat
PCT/US1997/002307 WO1997031236A1 (en) 1996-02-22 1997-02-20 Active heat sink structure with flow augmenting rings and method for removing heat

Publications (1)

Publication Number Publication Date
DE69724101D1 true DE69724101D1 (de) 2003-09-18

Family

ID=26683156

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69724101T Expired - Lifetime DE69724101D1 (de) 1996-02-22 1997-02-20 Aktive wärmesenke mit ringen zur erhöhung des durchflusses und verfahren zur wärmeabfuhr

Country Status (5)

Country Link
US (1) US5896917A (de)
EP (1) EP0882207B1 (de)
AU (1) AU1958397A (de)
DE (1) DE69724101D1 (de)
WO (1) WO1997031236A1 (de)

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US20020067596A1 (en) * 2000-12-05 2002-06-06 Searls Damion T. Conduited heat dissipation device
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US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
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US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6578625B1 (en) * 2002-03-08 2003-06-17 Raytheon Company Method and apparatus for removing heat from a plate
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US6637502B1 (en) 2002-04-16 2003-10-28 Thermal Corp. Heat sink with converging device
US6622786B1 (en) * 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs
US6972950B1 (en) 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
US7046515B1 (en) 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
US6827136B2 (en) * 2002-10-18 2004-12-07 Hon Hai Precision Ind. Co., Ltd. Heat dissipating apparatus and method for producing same
US6876550B2 (en) * 2002-12-13 2005-04-05 Hitachi Global Storage Technologies Netherlands B.V. Active heat sink for high power microprocessors
US6892800B2 (en) * 2002-12-31 2005-05-17 International Business Machines Corporation Omnidirectional fan-heatsinks
TWI241382B (en) * 2003-10-27 2005-10-11 Sunonwealth Electr Mach Ind Co Airflow guiding structure for a heat dissipating fan
US20050145365A1 (en) * 2003-12-24 2005-07-07 Hung-Shen Chang Guide flow heat sink
EP1701382A1 (de) * 2005-03-09 2006-09-13 ITer Networking Corporation CPU Kühler und Kühlmethode
JP2006269639A (ja) * 2005-03-23 2006-10-05 Denso Corp 放熱装置および車載電子機器
US20060237168A1 (en) * 2005-04-21 2006-10-26 Belady Christian L Air mover with thermally coupled guide vanes
US20070019386A1 (en) * 2005-07-24 2007-01-25 Matteo Gravina Encompassing Heat Sink
US7907403B2 (en) * 2005-10-25 2011-03-15 Hewlett-Packard Development Company, L.P. Active heat sink with multiple fans
US20070154314A1 (en) * 2005-12-29 2007-07-05 Minebea Co., Ltd. Reduction of tonal noise in cooling fans using splitter blades
US20070154309A1 (en) * 2005-12-29 2007-07-05 Minebea Co., Ltd. Cooling fan with integral housing and impeller
US20070160478A1 (en) * 2005-12-29 2007-07-12 Minebea Co., Ltd. Fan blade with non-varying stagger and camber angels
US20070152519A1 (en) * 2005-12-29 2007-07-05 Minebea Co., Ltd. Blade and yoke arrangement for cooling stator windings
US7658592B1 (en) 2005-12-29 2010-02-09 Minebea Co., Ltd. Slots in fan housing to reduce tonal noise
US7886816B2 (en) * 2006-08-11 2011-02-15 Oracle America, Inc. Intelligent cooling method combining passive and active cooling components
US20080073060A1 (en) * 2006-09-27 2008-03-27 Asia Vital Components Co., Ltd. Heat sink
US7896611B2 (en) 2007-01-03 2011-03-01 International Business Machines Corporation Heat transfer device in a rotating structure
US20090310302A1 (en) * 2008-06-17 2009-12-17 Enermax Technology Corporation Heat-dissipating structure having an external fan
US8459335B2 (en) * 2009-07-29 2013-06-11 Cpumate Inc Heat sink having heat-dissipating fins of large area and method for manufacturing the same
TWI410559B (zh) * 2011-11-15 2013-10-01 Univ Chienkuo Technology Engine cooling circulating water heat generating mechanism
US9417017B2 (en) 2012-03-20 2016-08-16 Thermal Corp. Heat transfer apparatus and method
TWI530243B (zh) * 2012-12-20 2016-04-11 仁寶電腦工業股份有限公司 電子裝置
US9385064B2 (en) * 2014-04-28 2016-07-05 Freescale Semiconductor, Inc. Heat sink having a through-opening
CN106438500B (zh) * 2015-08-06 2019-01-08 中国科学院声学研究所 一种用于风机的进风口声源的消声装置
JP6733484B2 (ja) * 2016-10-07 2020-07-29 株式会社デンソー 温度調節装置及びその製造方法
KR101920776B1 (ko) * 2017-06-08 2018-11-21 엘지이노텍 주식회사 열변환장치
US11859915B1 (en) * 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
EP3980863A1 (de) * 2019-06-10 2022-04-13 Telefonaktiebolaget Lm Ericsson (Publ) Kühleinheit zur kühlung einer wärmeerzeugenden komponente und verfahren dafür
EP4096376A1 (de) * 2021-05-24 2022-11-30 Aptiv Technologies Limited Kühlvorrichtung und wärmesenkenanordnung damit

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US4237521A (en) * 1979-02-05 1980-12-02 R. L. Drake Company Housing for electronic assembly including internally mounted heat sink
US4840225A (en) * 1987-04-10 1989-06-20 Digital Equipment Corporation Heat exchange element and enclosure incorporating same
DE3816242A1 (de) * 1987-05-15 1988-12-01 Aisin Seiki Motorkuehler fuer kraftfahrzeuge
JPH0273657A (ja) * 1988-09-09 1990-03-13 Hitachi Ltd 半径流ヒートシンクおよびこれを用いた半導体冷却装置
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Also Published As

Publication number Publication date
EP0882207A1 (de) 1998-12-09
AU1958397A (en) 1997-09-10
US5896917A (en) 1999-04-27
EP0882207A4 (de) 1999-07-07
EP0882207B1 (de) 2003-08-13
WO1997031236A1 (en) 1997-08-28

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Legal Events

Date Code Title Description
8332 No legal effect for de