DE69635083D1 - PREPARATION OF COMPOUNDS AND APPARATUSES USING A SURGERY SUBSTRATE - Google Patents
PREPARATION OF COMPOUNDS AND APPARATUSES USING A SURGERY SUBSTRATEInfo
- Publication number
- DE69635083D1 DE69635083D1 DE69635083T DE69635083T DE69635083D1 DE 69635083 D1 DE69635083 D1 DE 69635083D1 DE 69635083 T DE69635083 T DE 69635083T DE 69635083 T DE69635083 T DE 69635083T DE 69635083 D1 DE69635083 D1 DE 69635083D1
- Authority
- DE
- Germany
- Prior art keywords
- surgery
- apparatuses
- compounds
- substrate
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- G01R1/067—Measuring probes
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- G01R1/06727—Cantilever beams
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K2101/36—Electric or electronic devices
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/452,255 US6336269B1 (en) | 1993-11-16 | 1995-05-26 | Method of fabricating an interconnection element |
US452255 | 1995-05-26 | ||
US52624695A | 1995-09-21 | 1995-09-21 | |
US526246 | 1995-09-21 | ||
US08/533,584 US5772451A (en) | 1993-11-16 | 1995-10-18 | Sockets for electronic components and methods of connecting to electronic components |
US533584 | 1995-10-18 | ||
US554902 | 1995-11-09 | ||
US08/554,902 US5974662A (en) | 1993-11-16 | 1995-11-09 | Method of planarizing tips of probe elements of a probe card assembly |
PCT/US1995/014909 WO1996017378A1 (en) | 1994-11-15 | 1995-11-13 | Electrical contact structures from flexible wire |
WOPCT/US95/14909 | 1995-11-13 | ||
US558332 | 1995-11-15 | ||
US08/558,332 US5829128A (en) | 1993-11-16 | 1995-11-15 | Method of mounting resilient contact structures to semiconductor devices |
US518996P | 1996-05-17 | 1996-05-17 | |
US5189P | 1996-05-17 | ||
PCT/US1996/008107 WO1996037332A1 (en) | 1995-05-26 | 1996-05-24 | Fabricating interconnects and tips using sacrificial substrates |
Publications (2)
Publication Number | Publication Date |
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DE69635083D1 true DE69635083D1 (en) | 2005-09-22 |
DE69635083T2 DE69635083T2 (en) | 2006-05-18 |
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Application Number | Title | Priority Date | Filing Date |
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DE69635083T Expired - Fee Related DE69635083T2 (en) | 1995-05-26 | 1996-05-24 | PREPARATION OF COMPOUNDS AND APPARATUSES USING A SURGERY SUBSTRATE |
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EP (1) | EP0859686B1 (en) |
JP (1) | JP3058919B2 (en) |
KR (1) | KR100252457B1 (en) |
CN (1) | CN1151009C (en) |
AU (1) | AU6377796A (en) |
DE (1) | DE69635083T2 (en) |
WO (1) | WO1996037332A1 (en) |
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US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
JP4743945B2 (en) * | 2000-09-01 | 2011-08-10 | 株式会社神戸製鋼所 | Manufacturing method of connection device |
JP2003215161A (en) | 2002-01-22 | 2003-07-30 | Tokyo Electron Ltd | Probe, method of manufacturing probe, method and device for attaching probe, and probe card |
AU2002353582A1 (en) * | 2002-02-05 | 2003-09-02 | Oug-Ki Lee | Method for manufacturing electric contact element for testing electro device and electric contact element thereby |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
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KR101364538B1 (en) * | 2007-12-12 | 2014-02-18 | 삼성전자주식회사 | Method for mounting electronic components of at least two types and apparatus for performing the method |
AU2011332334B2 (en) * | 2010-11-22 | 2015-05-21 | Senseair Ab | Method for the wafer-level integration of shape memory alloy wires |
JP5683290B2 (en) | 2011-01-21 | 2015-03-11 | 三菱重工業株式会社 | Inter-board connection terminal, inverter using the same, and electric compressor |
JP2014082369A (en) * | 2012-10-17 | 2014-05-08 | Nippon Micrometal Corp | Bonding wire |
JP6387426B2 (en) * | 2017-01-25 | 2018-09-05 | 日鉄住金マイクロメタル株式会社 | Bonding wire |
CN112388253B (en) * | 2020-10-26 | 2021-09-14 | 山东聚鑫集团钢结构有限公司 | Manufacturing process of steel structure welding I-shaped steel |
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EP0002166A3 (en) * | 1977-11-18 | 1979-08-08 | International Business Machines Corporation | Carrier for mounting an integrated-circuit chip and method for its manufacture |
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JPS5988860A (en) * | 1982-11-12 | 1984-05-22 | Matsushita Electric Ind Co Ltd | Formation of metallic projection to metallic lead |
JPS6085545A (en) * | 1983-10-18 | 1985-05-15 | Matsushita Electric Ind Co Ltd | Method for formation of bump electrode for semiconductor element |
JPS6151838A (en) * | 1984-08-22 | 1986-03-14 | Hitachi Ltd | Semiconductor device |
JPS61144034A (en) * | 1984-12-17 | 1986-07-01 | Matsushita Electric Ind Co Ltd | Manufacture of transfer bump substrate |
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JP2810101B2 (en) * | 1989-04-17 | 1998-10-15 | 日本エー・エム・ピー株式会社 | Electric pin and method of manufacturing the same |
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EP0544305A3 (en) * | 1991-11-28 | 1993-10-06 | Nitto Denko Corporation | Method of forming a contact bump using a composite film |
JP3218414B2 (en) * | 1992-07-15 | 2001-10-15 | キヤノン株式会社 | Micro tip, method of manufacturing the same, probe unit and information processing apparatus using the micro tip |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
-
1996
- 1996-05-24 CN CNB961955597A patent/CN1151009C/en not_active Expired - Fee Related
- 1996-05-24 AU AU63777/96A patent/AU6377796A/en not_active Abandoned
- 1996-05-24 EP EP96923204A patent/EP0859686B1/en not_active Expired - Lifetime
- 1996-05-24 DE DE69635083T patent/DE69635083T2/en not_active Expired - Fee Related
- 1996-05-24 WO PCT/US1996/008107 patent/WO1996037332A1/en active IP Right Grant
- 1996-05-24 JP JP53594796A patent/JP3058919B2/en not_active Expired - Fee Related
- 1996-05-24 KR KR1019970700958A patent/KR100252457B1/en not_active IP Right Cessation
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DE69635083T2 (en) | 2006-05-18 |
AU6377796A (en) | 1996-12-11 |
KR970704546A (en) | 1997-09-06 |
EP0859686A1 (en) | 1998-08-26 |
WO1996037332A1 (en) | 1996-11-28 |
CN1208368A (en) | 1999-02-17 |
JP3058919B2 (en) | 2000-07-04 |
CN1151009C (en) | 2004-05-26 |
KR100252457B1 (en) | 2000-04-15 |
EP0859686B1 (en) | 2005-08-17 |
JPH10506238A (en) | 1998-06-16 |
EP0859686A4 (en) | 1998-11-11 |
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