DE69624852T2 - Verfahren und Vorrichtung zur Unterstützung der Reparatur von defekten Substraten - Google Patents

Verfahren und Vorrichtung zur Unterstützung der Reparatur von defekten Substraten

Info

Publication number
DE69624852T2
DE69624852T2 DE69624852T DE69624852T DE69624852T2 DE 69624852 T2 DE69624852 T2 DE 69624852T2 DE 69624852 T DE69624852 T DE 69624852T DE 69624852 T DE69624852 T DE 69624852T DE 69624852 T2 DE69624852 T2 DE 69624852T2
Authority
DE
Germany
Prior art keywords
repair
supporting
defective substrates
defective
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69624852T
Other languages
English (en)
Other versions
DE69624852D1 (de
Inventor
Norihito Yamamoto
Koichi Tanaka
Atsushi Hisano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of DE69624852D1 publication Critical patent/DE69624852D1/de
Application granted granted Critical
Publication of DE69624852T2 publication Critical patent/DE69624852T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69624852T 1995-01-17 1996-01-17 Verfahren und Vorrichtung zur Unterstützung der Reparatur von defekten Substraten Expired - Lifetime DE69624852T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2224795 1995-01-17
JP10916995A JP3273401B2 (ja) 1995-01-17 1995-04-11 修正支援方法および装置

Publications (2)

Publication Number Publication Date
DE69624852D1 DE69624852D1 (de) 2003-01-02
DE69624852T2 true DE69624852T2 (de) 2003-07-03

Family

ID=26359424

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624852T Expired - Lifetime DE69624852T2 (de) 1995-01-17 1996-01-17 Verfahren und Vorrichtung zur Unterstützung der Reparatur von defekten Substraten

Country Status (6)

Country Link
US (1) US5831854A (de)
EP (1) EP0723390B1 (de)
JP (1) JP3273401B2 (de)
KR (1) KR100215945B1 (de)
DE (1) DE69624852T2 (de)
TW (1) TW348367B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59605926D1 (de) * 1995-11-06 2000-10-26 Macrotron Process Technologies Verfahren und anordnung zur prüfung von lötstellen
US6658375B1 (en) 1999-03-15 2003-12-02 Isola Laminate Systems, Inc. Compensation model and registration simulation apparatus and method for manufacturing of printed circuit boards
US6816749B2 (en) 2000-12-22 2004-11-09 Fuji Photo Film Co., Ltd. Method of and apparatus for manufacturing rolled medium products
US7089160B2 (en) * 2002-01-08 2006-08-08 International Business Machines Corporation Model for modifying drill data to predict hole locations in a panel structure
US20040015465A1 (en) * 2002-06-25 2004-01-22 Gill Susan P. Trace cognitive process model and knowledge processor
US7236693B2 (en) 2005-03-22 2007-06-26 Globaltec Fireplaces, Inc. Flame simulator for use in an electric heater
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
JP2007158052A (ja) * 2005-12-06 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置及び実装エラー修復方法
JP4813322B2 (ja) * 2006-10-17 2011-11-09 シャープ株式会社 基板修復システム、基板修復方法、プログラム及びコンピュータ読み取り可能な記録媒体
US8019456B2 (en) * 2007-02-27 2011-09-13 Kabushiki Kaisha Toshiba Product repair support system, product manufacturing system, and product manufacturing method
JP5625935B2 (ja) * 2011-01-18 2014-11-19 オムロン株式会社 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム
TWM421617U (en) 2011-06-09 2012-01-21 Bing Xu Prec Co Ltd Cable connector
JP6020275B2 (ja) * 2013-03-19 2016-11-02 富士通株式会社 医事支援プログラム、医事支援方法及び医事支援装置
JP2017133907A (ja) * 2016-01-27 2017-08-03 アークレイ株式会社 検査装置
US10049442B2 (en) * 2016-01-28 2018-08-14 Mentor Graphics Corporation Video inspection system with augmented display content
JP2019169608A (ja) * 2018-03-23 2019-10-03 株式会社ディスコ 研削装置
DE102018110742A1 (de) * 2018-05-04 2019-11-07 Liebherr-Werk Biberach Gmbh Verfahren und Vorrichtung zum Warten und/oder Reparieren einer Baumaschine

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3824558A (en) * 1969-09-19 1974-07-16 H Koshiba Automatic apparatus for sequencing repair work in optimum order on malfunctions of grouped operating machines
GB2086061B (en) * 1980-10-13 1985-05-22 Marconi Instruments Ltd Automatic test systems
US4454585A (en) * 1981-05-28 1984-06-12 Ele John H Printed wiring board inspection, work logging and information system
EP0214030A3 (de) * 1985-08-12 1987-05-13 Digital Equipment Corporation Automatisiertes Reparatursystem unter Verwendung von Oberflächenmontagetechnologie
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
DE3728818A1 (de) * 1987-08-28 1989-03-16 Muet Gmbh Anordnung zum ermitteln und beseitigen von fertigungsfehlern einer elektrischen baugruppe
US5513099A (en) * 1993-02-08 1996-04-30 Probot Incorporated Circuit board repair and rework apparatus

Also Published As

Publication number Publication date
DE69624852D1 (de) 2003-01-02
JP3273401B2 (ja) 2002-04-08
US5831854A (en) 1998-11-03
KR960030768A (ko) 1996-08-17
KR100215945B1 (ko) 1999-08-16
EP0723390A3 (de) 1996-08-14
JPH08256000A (ja) 1996-10-01
EP0723390B1 (de) 2002-11-20
EP0723390A2 (de) 1996-07-24
TW348367B (en) 1998-12-21

Similar Documents

Publication Publication Date Title
DE69226511T2 (de) Verfahren und Vorrichtung zur Belichtung von Substraten
DE69528217D1 (de) Vorrichtung und Verfahren zur Bearbeitung von Substraten
DE69535692D1 (de) Verfahren und Vorrichtung zur automatisierten Prüfung von Photomasken
DE69532091D1 (de) Verfahren und Vorrichtung zur Durchführung von Messungen
DE69527120D1 (de) Elektronisches Verfahren und System zum Suchen von Bezugsquellen
DE69735666D1 (de) Verfahren und vorrichtung zur herstellung von plasmaanzeige
DE69033130T2 (de) Verfahren und Gerät zur Prüfung von Substraten
DE68928468D1 (de) Vorrichtung und Verfahren zur Kühlung von Substraten
DE69233475D1 (de) Gerät und Verfahren zur Prüfung von elektronischen Elektrizitätszählern
DE69631428D1 (de) System und verfahren zur beschichtung der unterseite von flip chips
DE69624852D1 (de) Verfahren und Vorrichtung zur Unterstützung der Reparatur von defekten Substraten
DE69528266D1 (de) Verfahren und vorrichtung zum kontrollierten aufbringen von partikeln auf wafers
DE69837503D1 (de) Vorrichtung und Verfahren zur Prüfung von optischen Anordnungen
DE69710022T2 (de) Verfahren und Vorrichtung zum progressiven Biegen von Glasscheibe
DE69700993D1 (de) Verfahren und vorrichtung zur befestigung von bauelementen
DE59702419D1 (de) Verfahren und Vorrichtung zur Sputterbeschichtung
DE59807021D1 (de) Verfahren und vorrichtung zur reparatur defekter lotverbindungsstellen
DE69928852D1 (de) Vorrichtung und Verfahren zur Unterstützung der Programmierung
DE69624821D1 (de) Verfahren und vorrichtung zum beschichten von petrischalen
DE59813939D1 (de) Vorrichtung und verfahren zum getrennten transportieren von substraten
DE69413891D1 (de) Verfahren und vorrichtung zur intermittierenden beschichtung
DE69322213D1 (de) Vorrichtung und Verfahren zur Kompensation von Positionierfehlern
DE69837575D1 (de) Vorrichtung und Verfahren zur Inkubation von Teststreifen
DE59608859D1 (de) Vorrichtung und verfahren zum beschichten von metallbahnen
DE69419970D1 (de) Verfahren und Vorrichtung zur Elektroplattierung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition