DE69624847D1 - Herstellungsverfahren für speicherkarten - Google Patents

Herstellungsverfahren für speicherkarten

Info

Publication number
DE69624847D1
DE69624847D1 DE69624847T DE69624847T DE69624847D1 DE 69624847 D1 DE69624847 D1 DE 69624847D1 DE 69624847 T DE69624847 T DE 69624847T DE 69624847 T DE69624847 T DE 69624847T DE 69624847 D1 DE69624847 D1 DE 69624847D1
Authority
DE
Germany
Prior art keywords
cavity
adhesive
module
manufacturing process
memory cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69624847T
Other languages
English (en)
Other versions
DE69624847T2 (de
Inventor
Vincent Permingeat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Publication of DE69624847D1 publication Critical patent/DE69624847D1/de
Application granted granted Critical
Publication of DE69624847T2 publication Critical patent/DE69624847T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Holo Graphy (AREA)
DE69624847T 1996-08-05 1996-08-05 Herstellungsverfahren für speicherkarten Expired - Fee Related DE69624847T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FR1996/001245 WO1998006061A1 (fr) 1996-08-05 1996-08-05 Procede de realisation de cartes a memoire et cartes ainsi obtenues

Publications (2)

Publication Number Publication Date
DE69624847D1 true DE69624847D1 (de) 2002-12-19
DE69624847T2 DE69624847T2 (de) 2003-07-17

Family

ID=9488748

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624847T Expired - Fee Related DE69624847T2 (de) 1996-08-05 1996-08-05 Herstellungsverfahren für speicherkarten

Country Status (10)

Country Link
US (1) US6306240B1 (de)
EP (1) EP0917686B1 (de)
JP (1) JP2001505328A (de)
AT (1) ATE227866T1 (de)
AU (1) AU707831B2 (de)
BR (1) BR9612704A (de)
CA (1) CA2262597A1 (de)
DE (1) DE69624847T2 (de)
ES (1) ES2187688T3 (de)
WO (1) WO1998006061A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6174406B1 (en) * 1998-04-09 2001-01-16 International Business Machines Corporation Bonding together surfaces
EP0969409A3 (de) * 1998-07-02 2002-12-04 Orga Kartensysteme GmbH Varfahren zur Herstellung einer Chipkarte sowie nach dem Verfahren hergestellte Chipkarte
FR2838850B1 (fr) * 2002-04-18 2005-08-05 Framatome Connectors Int Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu
FR2895116B1 (fr) * 2005-12-16 2009-05-22 Oberthur Card Syst Sa Procede de fabrication de cartes a microcircuit
US20080073028A1 (en) * 2006-08-31 2008-03-27 Frank Yu Methods and apparatus to dispense adhesive for semiconductor packaging
EP2420960A1 (de) * 2010-08-17 2012-02-22 Gemalto SA Verfahren zur Herstellung einer elektronischen Vorrichtung, die ein nicht demontierbares Modul umfasst, und so erhaltene Vorrichtung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2768109A (en) * 1954-06-02 1956-10-23 Eastman Kodak Co Alcohol-catalyzed alpha-cyanoacrylate adhesive compositions
US4196271A (en) * 1975-12-24 1980-04-01 Toagosei Chemical Industry Co., Ltd. Adhesive composition
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
US4803124A (en) * 1987-01-12 1989-02-07 Alphasem Corporation Bonding semiconductor chips to a mounting surface utilizing adhesive applied in starfish patterns
FR2613510A1 (fr) * 1987-03-31 1988-10-07 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
ATE161033T1 (de) * 1992-09-04 1997-12-15 Tomas Meinen Verfahren und vorrichtung zum verarbeiten und auftragen von cyanacrylat-klebstoffen
FR2703806B1 (fr) * 1993-04-06 1995-07-13 Leroux Gilles Sa Objet portatif et procede de fabrication.
US5580410A (en) * 1994-12-14 1996-12-03 Delta Technology, Inc. Pre-conditioning a substrate for accelerated dispersed dye sublimation printing
JPH0948190A (ja) * 1995-08-04 1997-02-18 Dainippon Printing Co Ltd Icモジュールのカードに対する接着方法及びicカード

Also Published As

Publication number Publication date
AU707831B2 (en) 1999-07-22
AU4843097A (en) 1998-02-25
US6306240B1 (en) 2001-10-23
EP0917686A1 (de) 1999-05-26
EP0917686B1 (de) 2002-11-13
CA2262597A1 (fr) 1998-02-12
ES2187688T3 (es) 2003-06-16
WO1998006061A1 (fr) 1998-02-12
JP2001505328A (ja) 2001-04-17
ATE227866T1 (de) 2002-11-15
DE69624847T2 (de) 2003-07-17
BR9612704A (pt) 2001-01-02

Similar Documents

Publication Publication Date Title
ATE200715T1 (de) Verbesserung eines herstellungsverfahrens einer speicherkarte
EP0967571A3 (de) Kartenpackung gemäss PCMCIA-Standard
FI93156B (fi) Muistikorttien valmistusmenetelmä ja tällä menetelmällä aikaansaadut kortit
DE59711861D1 (de) Verfahren zur Herstellung eines Chip-Moduls
DE3587933T2 (de) Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen.
ATE100615T1 (de) Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben.
DE3573359D1 (en) Small step miniature connecting element, and process for manufacturing such a connecting element
AU583827B2 (en) Platinum co-ordination compounds
DE68928538T2 (de) Elektronisches Filter für ein Hörgerät
DE3684896D1 (de) Verfahren zur herstellung eines gehaeuses fuer ein elektronisches bauelement.
AU6619198A (en) Modular data medium
DE69615416D1 (de) Hybridvorrichtung mit oberflächigen kontakten und erzeugung von akustischen signalen und verfahren zur ihrer herstellung
DE69624847T2 (de) Herstellungsverfahren für speicherkarten
ES487571A1 (es) Procedimiento para la produccion de piedras para joyas indi-viduales, portantes de una capa de adhesivo fusible
EP1098000A3 (de) Eingebettete Metallabscheidungen, die als Elektroden eines elektrochemischen Sensors dienen
FR2668653B1 (fr) Procede de fabrication d'un element accumulateur electrochimique et d'un precurseur de celui-ci et precurseur ainsi obtenu.
SE9501609D0 (sv) Optisk kopplingsenhet
AU1652700A (en) Method for embedding an ic component into a foamed layer of a chip card
WO1999066445A8 (fr) Procede de fabrication d'une carte a circuit integre et carte obtenue
CZ313098A3 (cs) Elektronický štítek pro elektromagneticky ovlivněnou výměnu dat a způsob výroby takovéhoto štítku
EP0947866A3 (de) Glassubstrat und zwei Stuffen Giessverfahren
EP0744290A3 (de) Verfahren zur Herstellung von Ladungselektroden
JPS5878664U (ja) 時計などの回路ブロツク
SE9801934L (de)
JPS60435B2 (ja) 植物の葉を模した電型の製造方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee