ES2187688T3 - Procedimiento de realizacion de tarjetas con memoria. - Google Patents

Procedimiento de realizacion de tarjetas con memoria.

Info

Publication number
ES2187688T3
ES2187688T3 ES96946393T ES96946393T ES2187688T3 ES 2187688 T3 ES2187688 T3 ES 2187688T3 ES 96946393 T ES96946393 T ES 96946393T ES 96946393 T ES96946393 T ES 96946393T ES 2187688 T3 ES2187688 T3 ES 2187688T3
Authority
ES
Spain
Prior art keywords
cavity
adhesive
carrying
procedure
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96946393T
Other languages
English (en)
Inventor
Vincent Permingeat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2187688T3 publication Critical patent/ES2187688T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Holo Graphy (AREA)

Abstract

LA PRESENTE INVENCION SE REFIERE A UN PROCEDIMIENTO DE REALIZACION DE TARJETAS CON MODULO ELECTRONICO DEL TIPO QUE CONSISTE EN PROPORCIONAR UN CUERPO DE TARJETA (1) DOTADO DE UNA CAVIDAD (3,4), UN MODULO ELECTRONICO (5) DE DIMENSIONES QUE CORRESPONDEN A DICHA CAVIDAD, UNA COLA DE TIPO CIANOCRILATO Y QUE INCLUYE ETAPAS SEGUN LAS CUALES SE DEPOSITA DICHA COLA EN DICHA CAVIDAD, SE INSERTA DICHO MODULO EN LA CAVIDAD EN UNA POSICION SENSIBLEMENTE CENTRADA Y SE PRESIONA DICHA COLA ENTRE LA TARJETA Y EL MODULO. EL PROCEDIMIENTO SE CARACTERIZA PORQUE DICHA COLA ESTA DEPOSITADA EN UNA CANTIDAD QUE PERMITE CUBRIR UNA SUPERFICIE DE ADHESION COMPRENDIDA ENTRE EL 50 % Y EL 100 % DE LA SUPERFICIE DE DICHA CAVIDAD, DESPUES DE PRESIONAR, Y BAJO UNA TEMPERATURA COMPRENDIDA ENTRE EL 15 Y EL 30 °C Y UN NIVEL HIGROMETRICO ENTRE EL 50 Y EL 75 %. LA INVENCION SE REFIERE TAMBIEN A LAS TARJETAS OBTENIDAS EMPLEANDO ESTE PROCEDIMIENTO.
ES96946393T 1996-08-05 1996-08-05 Procedimiento de realizacion de tarjetas con memoria. Expired - Lifetime ES2187688T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FR1996/001245 WO1998006061A1 (fr) 1996-08-05 1996-08-05 Procede de realisation de cartes a memoire et cartes ainsi obtenues

Publications (1)

Publication Number Publication Date
ES2187688T3 true ES2187688T3 (es) 2003-06-16

Family

ID=9488748

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96946393T Expired - Lifetime ES2187688T3 (es) 1996-08-05 1996-08-05 Procedimiento de realizacion de tarjetas con memoria.

Country Status (10)

Country Link
US (1) US6306240B1 (es)
EP (1) EP0917686B1 (es)
JP (1) JP2001505328A (es)
AT (1) ATE227866T1 (es)
AU (1) AU707831B2 (es)
BR (1) BR9612704A (es)
CA (1) CA2262597A1 (es)
DE (1) DE69624847T2 (es)
ES (1) ES2187688T3 (es)
WO (1) WO1998006061A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6174406B1 (en) * 1998-04-09 2001-01-16 International Business Machines Corporation Bonding together surfaces
EP0969409A3 (de) * 1998-07-02 2002-12-04 Orga Kartensysteme GmbH Varfahren zur Herstellung einer Chipkarte sowie nach dem Verfahren hergestellte Chipkarte
FR2838850B1 (fr) * 2002-04-18 2005-08-05 Framatome Connectors Int Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu
FR2895116B1 (fr) * 2005-12-16 2009-05-22 Oberthur Card Syst Sa Procede de fabrication de cartes a microcircuit
US20080073028A1 (en) * 2006-08-31 2008-03-27 Frank Yu Methods and apparatus to dispense adhesive for semiconductor packaging
EP2420960A1 (fr) * 2010-08-17 2012-02-22 Gemalto SA Procédé de fabrication d'un dispositif électronique comportant un module indémontable et dispositif obtenu

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2768109A (en) * 1954-06-02 1956-10-23 Eastman Kodak Co Alcohol-catalyzed alpha-cyanoacrylate adhesive compositions
US4196271A (en) * 1975-12-24 1980-04-01 Toagosei Chemical Industry Co., Ltd. Adhesive composition
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
US4803124A (en) * 1987-01-12 1989-02-07 Alphasem Corporation Bonding semiconductor chips to a mounting surface utilizing adhesive applied in starfish patterns
FR2613510A1 (fr) * 1987-03-31 1988-10-07 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
ATE161033T1 (de) * 1992-09-04 1997-12-15 Tomas Meinen Verfahren und vorrichtung zum verarbeiten und auftragen von cyanacrylat-klebstoffen
FR2703806B1 (fr) * 1993-04-06 1995-07-13 Leroux Gilles Sa Objet portatif et procede de fabrication.
US5580410A (en) * 1994-12-14 1996-12-03 Delta Technology, Inc. Pre-conditioning a substrate for accelerated dispersed dye sublimation printing
JPH0948190A (ja) * 1995-08-04 1997-02-18 Dainippon Printing Co Ltd Ｉｃモジュールのカードに対する接着方法及びｉｃカード

Also Published As

Publication number Publication date
ATE227866T1 (de) 2002-11-15
DE69624847D1 (de) 2002-12-19
CA2262597A1 (fr) 1998-02-12
EP0917686A1 (fr) 1999-05-26
JP2001505328A (ja) 2001-04-17
BR9612704A (pt) 2001-01-02
AU4843097A (en) 1998-02-25
US6306240B1 (en) 2001-10-23
AU707831B2 (en) 1999-07-22
DE69624847T2 (de) 2003-07-17
WO1998006061A1 (fr) 1998-02-12
EP0917686B1 (fr) 2002-11-13

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