DE69619575D1 - Epoxyacrylatharze und ihre Verwendungen - Google Patents

Epoxyacrylatharze und ihre Verwendungen

Info

Publication number
DE69619575D1
DE69619575D1 DE69619575T DE69619575T DE69619575D1 DE 69619575 D1 DE69619575 D1 DE 69619575D1 DE 69619575 T DE69619575 T DE 69619575T DE 69619575 T DE69619575 T DE 69619575T DE 69619575 D1 DE69619575 D1 DE 69619575D1
Authority
DE
Germany
Prior art keywords
epoxy acrylate
acrylate resins
resins
epoxy
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69619575T
Other languages
English (en)
Other versions
DE69619575T2 (de
Inventor
Toshihiro Motoshima
Akio Karasawa
Keisuke Takuma
Akihiro Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Application granted granted Critical
Publication of DE69619575D1 publication Critical patent/DE69619575D1/de
Publication of DE69619575T2 publication Critical patent/DE69619575T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/922—Polyepoxide polymer having been reacted to yield terminal ethylenic unsaturation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
DE69619575T 1995-04-13 1996-04-03 Epoxyacrylatharze und ihre Verwendungen Expired - Fee Related DE69619575T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8797395 1995-04-13
JP13489395 1995-06-01

Publications (2)

Publication Number Publication Date
DE69619575D1 true DE69619575D1 (de) 2002-04-11
DE69619575T2 DE69619575T2 (de) 2002-09-12

Family

ID=26429193

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69619575T Expired - Fee Related DE69619575T2 (de) 1995-04-13 1996-04-03 Epoxyacrylatharze und ihre Verwendungen

Country Status (5)

Country Link
US (1) US5677398A (de)
EP (1) EP0737701B1 (de)
KR (1) KR100222286B1 (de)
CN (1) CN1092674C (de)
DE (1) DE69619575T2 (de)

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DE69714106T2 (de) * 1996-03-13 2003-01-23 Ibiden Co Ltd Resistzusammenzetzungen zum Metallabscheiden
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
EP1493313B1 (de) * 2002-04-11 2006-11-29 Si Group, Inc Wässrige beschichtungszusammensetzungen für leiterplatte
GB0221893D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
US20060146091A1 (en) * 2004-12-30 2006-07-06 Bertelsen Craig M Methods for reducing deformations of films in micro-fluid ejection devices
CN101012301B (zh) * 2006-12-15 2010-05-19 深圳市深赛尔实业有限公司 一种环氧丙烯酸树脂及其制备方法
EP2112181A4 (de) * 2007-02-14 2010-06-02 Hitachi Chemical Co Ltd Harzzusammensetzung für optisches material, harzfilm für optisches material und lichtwellenleiter damit
KR101220047B1 (ko) * 2009-10-12 2013-01-08 금호석유화학 주식회사 액정 표시 소자용 실란트 조성물
KR102032749B1 (ko) 2010-04-16 2019-10-16 에스더블유아이엠씨 엘엘씨 패키징 용품을 위한 코팅 조성물 및 코팅 방법
BR112013016006A2 (pt) * 2010-12-21 2018-07-10 Elantas Gmbh composições de resina epóxi contendo grupos epóxi e grupos viniléster
PL2673323T3 (pl) 2011-02-07 2018-08-31 Valspar Sourcing, Inc. Kompozycje powłokowe do pojemników i innych wyrobów i sposoby powlekania
CN103917899B (zh) 2011-10-12 2018-04-03 诺华股份有限公司 通过涂布制备uv吸收性眼用透镜的方法
JP2015503661A (ja) * 2011-12-29 2015-02-02 ダウ グローバル テクノロジーズ エルエルシー 硬化性水溶性エポキシアクリレート樹脂組成物
JP5884837B2 (ja) * 2012-02-07 2016-03-15 日立化成株式会社 感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
US9365685B2 (en) 2012-02-28 2016-06-14 Ut-Battelle, Llc Method of improving adhesion of carbon fibers with a polymeric matrix
WO2014025411A1 (en) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Container coating system
EP3831900A1 (de) 2012-08-09 2021-06-09 Swimc Llc Zusammensetzungen für behälter und andere gegenstände sowie verfahren zur verwendung davon
DE102012221446A1 (de) * 2012-11-23 2014-05-28 Hilti Aktiengesellschaft Harzmischung auf Epoxy(meth)acrylatharz-Basis und deren Verwendung
BR112016021583B1 (pt) 2014-04-14 2021-10-26 Swimc Llc Método para produzir um polímero de poliéter de alto peso molecular, e, recipiente de embalagem de alimento e bebida
CN104693378A (zh) * 2015-03-24 2015-06-10 上海米维矿业科技有限公司 一种用于煤矿井巷动水流砂层段快速固结注浆材料及其制备方法
US9758706B2 (en) * 2015-07-31 2017-09-12 The Boeing Company Encapsulated catalyst for aerospace grade resin systems
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
WO2018021224A1 (ja) * 2016-07-28 2018-02-01 昭和電工株式会社 エポキシ（メタ）アクリレート化合物及びこれを含有する硬化性組成物
CN107540818A (zh) * 2017-07-27 2018-01-05 滁州金桥德克新材料有限公司 一种高性能改性环氧丙烯酸树脂及其制备方法
CN107418355B (zh) * 2017-07-31 2019-10-18 华南理工大学 一种水性环氧改性丙烯酸绝缘漆及其制备方法及应用
CN111087068B (zh) * 2019-12-24 2022-03-29 南京公诚节能新材料研究院有限公司 一种水净化处理生物滤料的制备方法
CN111217988A (zh) * 2019-12-31 2020-06-02 广东立邦长润发科技材料有限公司 一种可紫外光固化多官环氧丙烯酸酯及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377406A (en) * 1963-12-16 1968-04-09 Shell Oil Co Process of esterification of polyepoxides with ethylenically unsaturated monocarboxylic acids in the presence of onium salts of inorganic acids
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
AU594348B2 (en) * 1985-06-28 1990-03-08 Mitsui Toatsu Chemicals Inc. Process for producing 6,6'-dihydroxy-3,3,3',3'-tetramethyl- 1,1'-spirobiidane
US4701566A (en) * 1986-10-10 1987-10-20 General Electric Company Method for preparing spirobiindane bisphenols
JPH0780862B2 (ja) * 1986-12-12 1995-08-30 三井東圧化学株式会社 ６，６▲’▼−ジヒドロキシ−３，３，３▲’▼，３▲’▼−テトラメチル−１，１▲’▼−スピロビインダンのジグリシジルエ−テルおよびその製造方法
DE4027385A1 (de) * 1989-09-05 1991-03-07 Basf Ag Hitzehaertbare bismaleinimid-formmassen
US5281678A (en) * 1990-11-20 1994-01-25 W. R. Grace & Co. Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
JPH0542776A (ja) * 1991-08-08 1993-02-23 Konica Corp 感熱転写記録体の製造方法
JPH069753A (ja) * 1992-06-24 1994-01-18 Mitsui Toatsu Chem Inc エポキシ樹脂組成物

Also Published As

Publication number Publication date
DE69619575T2 (de) 2002-09-12
EP0737701A2 (de) 1996-10-16
KR960037708A (ko) 1996-11-19
EP0737701A3 (de) 1997-05-07
US5677398A (en) 1997-10-14
EP0737701B1 (de) 2002-03-06
CN1143086A (zh) 1997-02-19
KR100222286B1 (ko) 1999-10-01
CN1092674C (zh) 2002-10-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee