DE69615056T2 - Mikromechanisches mikrofon - Google Patents

Mikromechanisches mikrofon

Info

Publication number
DE69615056T2
DE69615056T2 DE69615056T DE69615056T DE69615056T2 DE 69615056 T2 DE69615056 T2 DE 69615056T2 DE 69615056 T DE69615056 T DE 69615056T DE 69615056 T DE69615056 T DE 69615056T DE 69615056 T2 DE69615056 T2 DE 69615056T2
Authority
DE
Germany
Prior art keywords
membranes
microphone
transducer element
center electrode
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69615056T
Other languages
German (de)
English (en)
Other versions
DE69615056D1 (de
Inventor
Jesper Bay
Siebe Bouwstra
Ole Hansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epcos Pte Ltd
Original Assignee
Microtronic AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microtronic AS filed Critical Microtronic AS
Application granted granted Critical
Publication of DE69615056D1 publication Critical patent/DE69615056D1/de
Publication of DE69615056T2 publication Critical patent/DE69615056T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Laminated Bodies (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
DE69615056T 1995-06-23 1996-06-21 Mikromechanisches mikrofon Expired - Lifetime DE69615056T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK072695A DK172085B1 (da) 1995-06-23 1995-06-23 Mikromekanisk mikrofon
PCT/DK1996/000276 WO1997001258A1 (en) 1995-06-23 1996-06-21 Micromechanical microphone

Publications (2)

Publication Number Publication Date
DE69615056D1 DE69615056D1 (de) 2001-10-11
DE69615056T2 true DE69615056T2 (de) 2002-04-25

Family

ID=8096839

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69615056T Expired - Lifetime DE69615056T2 (de) 1995-06-23 1996-06-21 Mikromechanisches mikrofon

Country Status (8)

Country Link
US (1) US6075867A (https=)
EP (1) EP0872153B1 (https=)
JP (1) JPH11508101A (https=)
AT (1) ATE205355T1 (https=)
DE (1) DE69615056T2 (https=)
DK (2) DK172085B1 (https=)
ES (1) ES2159747T3 (https=)
WO (1) WO1997001258A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010017959A1 (de) * 2010-04-22 2011-10-27 Epcos Ag Mikrofon mit breitem Dynamikbereich
US9510107B2 (en) 2014-03-06 2016-11-29 Infineon Technologies Ag Double diaphragm MEMS microphone without a backplate element

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FR1318783A (fr) * 1962-01-12 1963-02-22 Dispositif de sécurité pour le blocage des portes
US7881486B1 (en) * 1996-12-31 2011-02-01 Etymotic Research, Inc. Directional microphone assembly
DE19715365C2 (de) * 1997-04-11 1999-03-25 Sennheiser Electronic Kondensatormikrofon
US6088463A (en) 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
US7003127B1 (en) 1999-01-07 2006-02-21 Sarnoff Corporation Hearing aid with large diaphragm microphone element including a printed circuit board
JP2002534933A (ja) 1999-01-07 2002-10-15 サーノフ コーポレイション プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器
AT407322B (de) * 1999-03-23 2001-02-26 Akg Acoustics Gmbh Klein-mikrophon
US6522762B1 (en) 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
US6505076B2 (en) * 2000-12-08 2003-01-07 Advanced Bionics Corporation Water-resistant, wideband microphone subassembly
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
GB0113255D0 (en) * 2001-05-31 2001-07-25 Scient Generics Ltd Number generator
US20070113964A1 (en) * 2001-12-10 2007-05-24 Crawford Scott A Small water-repellant microphone having improved acoustic performance and method of constructing same
US20030210799A1 (en) * 2002-05-10 2003-11-13 Gabriel Kaigham J. Multiple membrane structure and method of manufacture
JP2004056438A (ja) * 2002-07-19 2004-02-19 Matsushita Electric Ind Co Ltd マイクロフォン
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
WO2004103015A1 (en) * 2003-05-15 2004-11-25 Oticon A/S Microphone with adjustable properties
JP4188325B2 (ja) * 2005-02-09 2008-11-26 ホシデン株式会社 防塵板内蔵マイクロホン
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005008512B4 (de) * 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
WO2006129821A1 (ja) * 2005-05-31 2006-12-07 Ngk Insulators, Ltd. 物体の通過検出装置
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US8081783B2 (en) * 2006-06-20 2011-12-20 Industrial Technology Research Institute Miniature acoustic transducer
TWI370101B (en) * 2007-05-15 2012-08-11 Ind Tech Res Inst Package and packaging assembly of microelectromechanical sysyem microphone
TWI323242B (en) * 2007-05-15 2010-04-11 Ind Tech Res Inst Package and packageing assembly of microelectromechanical system microphone
TWI343756B (en) * 2009-08-10 2011-06-11 Ind Tech Res Inst Flat loudspeaker structure
US7832080B2 (en) * 2007-10-11 2010-11-16 Etymotic Research, Inc. Directional microphone assembly
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
US20110138902A1 (en) * 2008-05-27 2011-06-16 Tufts University Mems microphone array on a chip
US9071910B2 (en) * 2008-07-24 2015-06-30 Cochlear Limited Implantable microphone device
TWI405472B (zh) * 2008-07-31 2013-08-11 Htc Corp 電子裝置及其電聲換能器
DE102008058787B4 (de) * 2008-11-24 2017-06-08 Sennheiser Electronic Gmbh & Co. Kg Mikrofon
US9247357B2 (en) 2009-03-13 2016-01-26 Cochlear Limited DACS actuator
KR20120014591A (ko) * 2009-05-18 2012-02-17 노우레스 일렉트로닉스, 엘엘시 감소된 진동 감도를 갖는 마이크로폰
CN102939770B (zh) 2010-03-19 2015-12-09 领先仿生公司 防水声学元件封罩以及包括其的设备
EP2432249A1 (en) * 2010-07-02 2012-03-21 Knowles Electronics Asia PTE. Ltd. Microphone
EP2666306B1 (en) 2011-01-18 2017-03-15 Advanced Bionics AG Moisture resistant headpieces and implantable cochlear stimulation systems including the same
US9693135B2 (en) * 2012-01-05 2017-06-27 Tdk Corporation Differential microphone and method for driving a differential microphone
US8983097B2 (en) 2012-02-29 2015-03-17 Infineon Technologies Ag Adjustable ventilation openings in MEMS structures
US9002037B2 (en) 2012-02-29 2015-04-07 Infineon Technologies Ag MEMS structure with adjustable ventilation openings
US8723277B2 (en) * 2012-02-29 2014-05-13 Infineon Technologies Ag Tunable MEMS device and method of making a tunable MEMS device
WO2014094831A1 (en) * 2012-12-18 2014-06-26 Epcos Ag Top-port mems microphone and method of manufacturing the same
US9173024B2 (en) * 2013-01-31 2015-10-27 Invensense, Inc. Noise mitigating microphone system
DE102013207497A1 (de) * 2013-04-25 2014-11-13 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
US9181080B2 (en) 2013-06-28 2015-11-10 Infineon Technologies Ag MEMS microphone with low pressure region between diaphragm and counter electrode
US9024396B2 (en) 2013-07-12 2015-05-05 Infineon Technologies Ag Device with MEMS structure and ventilation path in support structure
DE102013214823A1 (de) * 2013-07-30 2015-02-05 Robert Bosch Gmbh Mikrofonbauteil mit mindestens zwei MEMS-Mikrofonbauelementen
US9438979B2 (en) * 2014-03-06 2016-09-06 Infineon Technologies Ag MEMS sensor structure for sensing pressure waves and a change in ambient pressure
US9494477B2 (en) 2014-03-31 2016-11-15 Infineon Technologies Ag Dynamic pressure sensor
US9554207B2 (en) * 2015-04-30 2017-01-24 Shure Acquisition Holdings, Inc. Offset cartridge microphones
GB2554470A (en) * 2016-09-26 2018-04-04 Cirrus Logic Int Semiconductor Ltd MEMS device and process
DE102017103195B4 (de) * 2017-02-16 2021-04-08 Infineon Technologies Ag Mikroelektromechanisches Mikrofon und Herstellungsverfahren für ein Mikroelektromechanisches Mikrofon
US10284963B2 (en) 2017-03-28 2019-05-07 Nanofone Ltd. High performance sealed-gap capacitive microphone
DE102017213277B4 (de) * 2017-08-01 2019-08-14 Infineon Technologies Ag Mems-sensoren, verfahren zum bereitstellen derselben und verfahren zum betreiben eines mems-sensors
US10757510B2 (en) 2018-01-08 2020-08-25 Nanofone Limited High performance sealed-gap capacitive microphone with various gap geometries
WO2019226958A1 (en) 2018-05-24 2019-11-28 The Research Foundation For The State University Of New York Capacitive sensor
US10939214B2 (en) 2018-10-05 2021-03-02 Knowles Electronics, Llc Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
DE112019004970T5 (de) 2018-10-05 2021-06-24 Knowles Electronics, Llc Mikrofonvorrichtung mit Eindringschutz
US10870577B2 (en) 2018-10-05 2020-12-22 Knowles Electronics, Llc Methods of forming MEMS diaphragms including corrugations
US11889283B2 (en) 2020-12-21 2024-01-30 Infineon Technologies Ag Triple-membrane MEMS device
US11932533B2 (en) 2020-12-21 2024-03-19 Infineon Technologies Ag Signal processing circuit for triple-membrane MEMS device
US12240748B2 (en) 2021-03-21 2025-03-04 Knowles Electronics, Llc MEMS die and MEMS-based sensor
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US12552659B2 (en) 2021-10-06 2026-02-17 Knowles Electronics, Llc MEMS die and MEMS-based sensor
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint
KR20230115058A (ko) * 2022-01-26 2023-08-02 주식회사 디비하이텍 맴스 마이크로폰 구조 및 제조방법

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US3980838A (en) * 1974-02-20 1976-09-14 Tokyo Shibaura Electric Co., Ltd. Plural electret electroacoustic transducer
FR2402374A1 (fr) * 1977-08-30 1979-03-30 Thomson Brandt Dispositif de montage d'un microphone incorpore dans un appareil d'enregistrement sonore et appareil a microphone incorpore
FR2542552B1 (fr) * 1983-03-07 1986-04-11 Thomson Csf Transducteur electroacoustique a diaphragme piezo-electrique
US5085070A (en) * 1990-02-07 1992-02-04 At&T Bell Laboratories Capacitive force-balance system for measuring small forces and pressures
WO1995015067A1 (de) * 1993-11-23 1995-06-01 Lux Wellenhof Gabriele Hülle für hörgeräte, damit versehene hörgeräte bzw. teile davon und hörtestvorrichtung und verfahren

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010017959A1 (de) * 2010-04-22 2011-10-27 Epcos Ag Mikrofon mit breitem Dynamikbereich
US9510107B2 (en) 2014-03-06 2016-11-29 Infineon Technologies Ag Double diaphragm MEMS microphone without a backplate element
DE102015103321B4 (de) 2014-03-06 2018-06-14 Infineon Technologies Ag Doppelmembran-Mems-Mikrophon ohne Rückplattenelement

Also Published As

Publication number Publication date
EP0872153B1 (en) 2001-09-05
JPH11508101A (ja) 1999-07-13
DK0872153T3 (da) 2001-11-19
ES2159747T3 (es) 2001-10-16
US6075867A (en) 2000-06-13
DK172085B1 (da) 1997-10-13
WO1997001258A1 (en) 1997-01-09
ATE205355T1 (de) 2001-09-15
DK72695A (da) 1996-12-24
EP0872153A1 (en) 1998-10-21
DE69615056D1 (de) 2001-10-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: EPCOS PTE LTD, SINGAPORE, SG

8328 Change in the person/name/address of the agent

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCHAFT