DE69614714D1 - Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtung - Google Patents

Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtung

Info

Publication number
DE69614714D1
DE69614714D1 DE69614714T DE69614714T DE69614714D1 DE 69614714 D1 DE69614714 D1 DE 69614714D1 DE 69614714 T DE69614714 T DE 69614714T DE 69614714 T DE69614714 T DE 69614714T DE 69614714 D1 DE69614714 D1 DE 69614714D1
Authority
DE
Germany
Prior art keywords
pct
electrical current
disc
coating
shaped elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69614714T
Other languages
English (en)
Other versions
DE69614714T2 (de
Inventor
Ake Billman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technotrans SE
Original Assignee
Technotrans SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technotrans SE filed Critical Technotrans SE
Application granted granted Critical
Publication of DE69614714D1 publication Critical patent/DE69614714D1/de
Publication of DE69614714T2 publication Critical patent/DE69614714T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
DE69614714T 1995-06-27 1996-06-26 Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtung Expired - Fee Related DE69614714T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9502325A SE512515C2 (sv) 1995-06-27 1995-06-27 Anordning för elektroplätering av skivelement med användning av en sluten slinga av en elektriskt ledande kropp
PCT/SE1996/000843 WO1997001657A1 (en) 1995-06-27 1996-06-26 Device for transmitting electric current to disc elements in surface-coating thereof

Publications (2)

Publication Number Publication Date
DE69614714D1 true DE69614714D1 (de) 2001-09-27
DE69614714T2 DE69614714T2 (de) 2002-06-27

Family

ID=20398760

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69614714T Expired - Fee Related DE69614714T2 (de) 1995-06-27 1996-06-26 Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtung

Country Status (7)

Country Link
US (1) US6120657A (de)
EP (1) EP0871799B1 (de)
JP (1) JPH11509272A (de)
AT (1) ATE204619T1 (de)
DE (1) DE69614714T2 (de)
SE (1) SE512515C2 (de)
WO (1) WO1997001657A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6254809B1 (en) 1998-05-19 2001-07-03 Steag Hamatech, Inc. System and method for curing a resin disposed between a top and bottom substrate with thermal management
US6214412B1 (en) 1998-05-19 2001-04-10 First Light Technologies, Inc. System and method for distributing a resin disposed between a top substrate and a bottom substrate
US6352612B1 (en) 1998-05-19 2002-03-05 Steag Hamatech, Inc. System for forming bonded storage disks with low power light assembly
US6103039A (en) * 1997-11-12 2000-08-15 First Light Technology, Inc. System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation
US6106657A (en) * 1998-05-19 2000-08-22 First Light Technology, Inc. System and method for dispensing a resin between substrates of a bonded storage disk
US6098272A (en) * 1998-05-19 2000-08-08 First Light Technology, Inc. System for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US6251235B1 (en) * 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
DE10019713C2 (de) * 2000-04-20 2003-11-13 Atotech Deutschland Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen
DE10111761A1 (de) * 2001-03-12 2002-10-02 Infineon Technologies Ag Anordnung und Verfahren zum rückseitigen Kontaktieren eines Halbleitersubstrats

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573176A (en) * 1968-07-19 1971-03-30 Rca Corp Selective anodization apparatus and process
JPS63134688A (ja) * 1986-11-25 1988-06-07 Canon Inc スタンパ−製造方法
JPH049491A (ja) * 1990-01-08 1992-01-14 Ricoh Co Ltd スタンパの電鋳加工用治具
JPH04120288A (ja) * 1990-09-07 1992-04-21 Ricoh Co Ltd 電鋳加工用治具
US5167792A (en) * 1990-12-19 1992-12-01 Canon Kabushiki Kaisha Master holder of stamper electroforming apparatus and electroforming method
JP3200468B2 (ja) * 1992-05-21 2001-08-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用めっき装置
US5522975A (en) * 1995-05-16 1996-06-04 International Business Machines Corporation Electroplating workpiece fixture
US5843296A (en) * 1996-12-26 1998-12-01 Digital Matrix Method for electroforming an optical disk stamper
US5785826A (en) * 1996-12-26 1998-07-28 Digital Matrix Apparatus for electroforming

Also Published As

Publication number Publication date
JPH11509272A (ja) 1999-08-17
SE512515C2 (sv) 2000-03-27
EP0871799B1 (de) 2001-08-22
US6120657A (en) 2000-09-19
SE9502325D0 (sv) 1995-06-27
SE9502325L (sv) 1996-12-28
EP0871799A1 (de) 1998-10-21
WO1997001657A1 (en) 1997-01-16
ATE204619T1 (de) 2001-09-15
DE69614714T2 (de) 2002-06-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee