ATE204619T1 - Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtung - Google Patents
Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtungInfo
- Publication number
- ATE204619T1 ATE204619T1 AT96922341T AT96922341T ATE204619T1 AT E204619 T1 ATE204619 T1 AT E204619T1 AT 96922341 T AT96922341 T AT 96922341T AT 96922341 T AT96922341 T AT 96922341T AT E204619 T1 ATE204619 T1 AT E204619T1
- Authority
- AT
- Austria
- Prior art keywords
- pct
- electrical current
- disk
- coating
- shaped elements
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9502325A SE512515C2 (sv) | 1995-06-27 | 1995-06-27 | Anordning för elektroplätering av skivelement med användning av en sluten slinga av en elektriskt ledande kropp |
PCT/SE1996/000843 WO1997001657A1 (en) | 1995-06-27 | 1996-06-26 | Device for transmitting electric current to disc elements in surface-coating thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE204619T1 true ATE204619T1 (de) | 2001-09-15 |
Family
ID=20398760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT96922341T ATE204619T1 (de) | 1995-06-27 | 1996-06-26 | Vorrichtung zum übertragen von elektrischem strom auf scheibenförmige elemente bei deren beschichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6120657A (de) |
EP (1) | EP0871799B1 (de) |
JP (1) | JPH11509272A (de) |
AT (1) | ATE204619T1 (de) |
DE (1) | DE69614714T2 (de) |
SE (1) | SE512515C2 (de) |
WO (1) | WO1997001657A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106657A (en) * | 1998-05-19 | 2000-08-22 | First Light Technology, Inc. | System and method for dispensing a resin between substrates of a bonded storage disk |
US6103039A (en) | 1997-11-12 | 2000-08-15 | First Light Technology, Inc. | System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation |
US6214412B1 (en) | 1998-05-19 | 2001-04-10 | First Light Technologies, Inc. | System and method for distributing a resin disposed between a top substrate and a bottom substrate |
US6352612B1 (en) | 1998-05-19 | 2002-03-05 | Steag Hamatech, Inc. | System for forming bonded storage disks with low power light assembly |
US6254809B1 (en) | 1998-05-19 | 2001-07-03 | Steag Hamatech, Inc. | System and method for curing a resin disposed between a top and bottom substrate with thermal management |
US6098272A (en) * | 1998-05-19 | 2000-08-08 | First Light Technology, Inc. | System for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk |
US6251235B1 (en) | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
US7427337B2 (en) | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
DE10019713C2 (de) * | 2000-04-20 | 2003-11-13 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen |
DE10111761A1 (de) * | 2001-03-12 | 2002-10-02 | Infineon Technologies Ag | Anordnung und Verfahren zum rückseitigen Kontaktieren eines Halbleitersubstrats |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3573176A (en) * | 1968-07-19 | 1971-03-30 | Rca Corp | Selective anodization apparatus and process |
JPS63134688A (ja) | 1986-11-25 | 1988-06-07 | Canon Inc | スタンパ−製造方法 |
JPH049491A (ja) * | 1990-01-08 | 1992-01-14 | Ricoh Co Ltd | スタンパの電鋳加工用治具 |
JPH04120288A (ja) * | 1990-09-07 | 1992-04-21 | Ricoh Co Ltd | 電鋳加工用治具 |
US5167792A (en) | 1990-12-19 | 1992-12-01 | Canon Kabushiki Kaisha | Master holder of stamper electroforming apparatus and electroforming method |
JP3200468B2 (ja) * | 1992-05-21 | 2001-08-20 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ウエーハ用めっき装置 |
US5522975A (en) * | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
US5843296A (en) * | 1996-12-26 | 1998-12-01 | Digital Matrix | Method for electroforming an optical disk stamper |
US5785826A (en) * | 1996-12-26 | 1998-07-28 | Digital Matrix | Apparatus for electroforming |
-
1995
- 1995-06-27 SE SE9502325A patent/SE512515C2/sv not_active IP Right Cessation
-
1996
- 1996-06-26 US US08/981,516 patent/US6120657A/en not_active Expired - Fee Related
- 1996-06-26 AT AT96922341T patent/ATE204619T1/de not_active IP Right Cessation
- 1996-06-26 EP EP96922341A patent/EP0871799B1/de not_active Expired - Lifetime
- 1996-06-26 DE DE69614714T patent/DE69614714T2/de not_active Expired - Fee Related
- 1996-06-26 JP JP9504357A patent/JPH11509272A/ja active Pending
- 1996-06-26 WO PCT/SE1996/000843 patent/WO1997001657A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE69614714T2 (de) | 2002-06-27 |
EP0871799B1 (de) | 2001-08-22 |
SE9502325L (sv) | 1996-12-28 |
SE9502325D0 (sv) | 1995-06-27 |
JPH11509272A (ja) | 1999-08-17 |
US6120657A (en) | 2000-09-19 |
WO1997001657A1 (en) | 1997-01-16 |
EP0871799A1 (de) | 1998-10-21 |
SE512515C2 (sv) | 2000-03-27 |
DE69614714D1 (de) | 2001-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |