DE69613476D1 - Metallspülungsverfahren mit kontrollierter Metallmikrokorrosionsreduktion - Google Patents

Metallspülungsverfahren mit kontrollierter Metallmikrokorrosionsreduktion

Info

Publication number
DE69613476D1
DE69613476D1 DE69613476T DE69613476T DE69613476D1 DE 69613476 D1 DE69613476 D1 DE 69613476D1 DE 69613476 T DE69613476 T DE 69613476T DE 69613476 T DE69613476 T DE 69613476T DE 69613476 D1 DE69613476 D1 DE 69613476D1
Authority
DE
Germany
Prior art keywords
metal
rinsing process
rinsing
controlled
corrosion reduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69613476T
Other languages
English (en)
Other versions
DE69613476T2 (de
Inventor
Antonio Rotondaro
Rita Vos
Mark Heyns
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Application granted granted Critical
Publication of DE69613476D1 publication Critical patent/DE69613476D1/de
Publication of DE69613476T2 publication Critical patent/DE69613476T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
DE69613476T 1996-12-09 1996-12-09 Metallspülungsverfahren mit kontrollierter Metallmikrokorrosionsreduktion Expired - Lifetime DE69613476T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP96870157A EP0846985B1 (de) 1996-12-09 1996-12-09 Metallspülungsverfahren mit kontrollierter Metallmikrokorrosionsreduktion

Publications (2)

Publication Number Publication Date
DE69613476D1 true DE69613476D1 (de) 2001-07-26
DE69613476T2 DE69613476T2 (de) 2002-04-18

Family

ID=8226184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69613476T Expired - Lifetime DE69613476T2 (de) 1996-12-09 1996-12-09 Metallspülungsverfahren mit kontrollierter Metallmikrokorrosionsreduktion

Country Status (4)

Country Link
US (1) US6153018A (de)
EP (1) EP0846985B1 (de)
AT (1) ATE202421T1 (de)
DE (1) DE69613476T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2836562B2 (ja) * 1996-02-08 1998-12-14 日本電気株式会社 半導体ウェハのウェット処理方法
US6878213B1 (en) 1998-12-07 2005-04-12 Scp Global Technologies, Inc. Process and system for rinsing of semiconductor substrates
JP3550507B2 (ja) * 1999-03-25 2004-08-04 Ｎｅｃエレクトロニクス株式会社 被洗浄体のすすぎ方法およびその装置
US6422246B1 (en) * 2000-02-29 2002-07-23 United Microelectronics Corp. Method removing residual photoresist

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3085917A (en) * 1960-05-27 1963-04-16 Gen Electric Chemical cleaning method and material
US3813309A (en) * 1969-12-23 1974-05-28 Ibm Method for stripping resists from substrates
US3649260A (en) * 1970-02-27 1972-03-14 Sylvania Electric Prod Process for making refractory metal material
US3787239A (en) * 1970-09-25 1974-01-22 Allied Chem Chemical strippers and method of using
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US5102777A (en) * 1990-02-01 1992-04-07 Ardrox Inc. Resist stripping
US5201960A (en) * 1991-02-04 1993-04-13 Applied Photonics Research, Inc. Method for removing photoresist and other adherent materials from substrates
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US5472830A (en) * 1994-04-18 1995-12-05 Ocg Microelectronic Materials, Inc. Non-corrosion photoresist stripping composition
JP2836562B2 (ja) * 1996-02-08 1998-12-14 日本電気株式会社 半導体ウェハのウェット処理方法

Also Published As

Publication number Publication date
EP0846985A1 (de) 1998-06-10
US6153018A (en) 2000-11-28
EP0846985B1 (de) 2001-06-20
DE69613476T2 (de) 2002-04-18
ATE202421T1 (de) 2001-07-15

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