DE69613352T2 - Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeit - Google Patents
Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeitInfo
- Publication number
- DE69613352T2 DE69613352T2 DE69613352T DE69613352T DE69613352T2 DE 69613352 T2 DE69613352 T2 DE 69613352T2 DE 69613352 T DE69613352 T DE 69613352T DE 69613352 T DE69613352 T DE 69613352T DE 69613352 T2 DE69613352 T2 DE 69613352T2
- Authority
- DE
- Germany
- Prior art keywords
- evaluation
- multiple layer
- height differential
- collimator arrangement
- improved height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000011156 evaluation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/382,366 US5643428A (en) | 1995-02-01 | 1995-02-01 | Multiple tier collimator system for enhanced step coverage and uniformity |
PCT/US1996/000572 WO1996024155A1 (en) | 1995-02-01 | 1996-01-11 | Multiple tier collimator system for enhanced step coverage and uniformity |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69613352D1 DE69613352D1 (de) | 2001-07-19 |
DE69613352T2 true DE69613352T2 (de) | 2002-04-25 |
Family
ID=23508642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69613352T Expired - Fee Related DE69613352T2 (de) | 1995-02-01 | 1996-01-11 | Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeit |
Country Status (5)
Country | Link |
---|---|
US (1) | US5643428A (de) |
EP (1) | EP0809859B1 (de) |
DE (1) | DE69613352T2 (de) |
TW (1) | TW436895B (de) |
WO (1) | WO1996024155A1 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0682125A1 (de) * | 1994-05-11 | 1995-11-15 | Applied Materials, Inc. | Kontrolle eines Materials, welches von einem Target zerstäubt wird |
CN100452071C (zh) | 1995-02-13 | 2009-01-14 | 英特特拉斯特技术公司 | 用于安全交易管理和电子权利保护的系统和方法 |
US5892900A (en) | 1996-08-30 | 1999-04-06 | Intertrust Technologies Corp. | Systems and methods for secure transaction management and electronic rights protection |
US6157721A (en) | 1996-08-12 | 2000-12-05 | Intertrust Technologies Corp. | Systems and methods using cryptography to protect secure computing environments |
TW399245B (en) * | 1997-10-29 | 2000-07-21 | Nec Corp | Sputtering apparatus for sputtering high melting point metal and method for manufacturing semiconductor device having high melting point metal |
US6036821A (en) * | 1998-01-29 | 2000-03-14 | International Business Machines Corporation | Enhanced collimated sputtering apparatus and its method of use |
US6287436B1 (en) | 1998-02-27 | 2001-09-11 | Innovent, Inc. | Brazed honeycomb collimator |
US6482301B1 (en) | 1998-06-04 | 2002-11-19 | Seagate Technology, Inc. | Target shields for improved magnetic properties of a recording medium |
US6362097B1 (en) * | 1998-07-14 | 2002-03-26 | Applied Komatsu Technlology, Inc. | Collimated sputtering of semiconductor and other films |
US6592728B1 (en) * | 1998-08-04 | 2003-07-15 | Veeco-Cvc, Inc. | Dual collimated deposition apparatus and method of use |
US6365134B1 (en) | 1999-07-07 | 2002-04-02 | Scientific Pharmaceuticals, Inc. | Process and composition for high efficacy teeth whitening |
US7067115B2 (en) * | 1999-07-07 | 2006-06-27 | Scientific Pharmaceuticals, Inc. | Process and composition for high efficacy teeth whitening |
US6596598B1 (en) | 2000-02-23 | 2003-07-22 | Advanced Micro Devices, Inc. | T-shaped gate device and method for making |
US6521897B1 (en) * | 2000-11-17 | 2003-02-18 | The Regents Of The University Of California | Ion beam collimating grid to reduce added defects |
PT1350863E (pt) * | 2002-03-19 | 2006-12-29 | Scheuten Glasgroep Bv | Dispositivo e processo para a aplicação orientada de um material a depositar num substrato |
JP2003282981A (ja) * | 2002-03-26 | 2003-10-03 | Fujitsu Ltd | ジョセフソン接合素子およびその製造方法 |
US20040086639A1 (en) * | 2002-09-24 | 2004-05-06 | Grantham Daniel Harrison | Patterned thin-film deposition using collimating heated mask asembly |
US20040202621A1 (en) * | 2002-12-23 | 2004-10-14 | Orlowski Jan A. | Teeth whitening system based on the combination of hydrogen peroxide and carbamide peroxide |
US20050006223A1 (en) * | 2003-05-07 | 2005-01-13 | Robert Nichols | Sputter deposition masking and methods |
TWI229908B (en) * | 2004-03-08 | 2005-03-21 | Univ Nat Chiao Tung | Adjustable collimator and sputtering apparatus with the same |
US20050211547A1 (en) * | 2004-03-26 | 2005-09-29 | Applied Materials, Inc. | Reactive sputter deposition plasma reactor and process using plural ion shower grids |
US7695590B2 (en) | 2004-03-26 | 2010-04-13 | Applied Materials, Inc. | Chemical vapor deposition plasma reactor having plural ion shower grids |
US7291360B2 (en) * | 2004-03-26 | 2007-11-06 | Applied Materials, Inc. | Chemical vapor deposition plasma process using plural ion shower grids |
US7244474B2 (en) | 2004-03-26 | 2007-07-17 | Applied Materials, Inc. | Chemical vapor deposition plasma process using an ion shower grid |
US7767561B2 (en) | 2004-07-20 | 2010-08-03 | Applied Materials, Inc. | Plasma immersion ion implantation reactor having an ion shower grid |
US8058156B2 (en) | 2004-07-20 | 2011-11-15 | Applied Materials, Inc. | Plasma immersion ion implantation reactor having multiple ion shower grids |
US7271111B2 (en) * | 2005-06-08 | 2007-09-18 | Advantech Global, Ltd | Shadow mask deposition of materials using reconfigurable shadow masks |
US20070012559A1 (en) * | 2005-07-13 | 2007-01-18 | Applied Materials, Inc. | Method of improving magnetron sputtering of large-area substrates using a removable anode |
US9194036B2 (en) * | 2007-09-06 | 2015-11-24 | Infineon Technologies Ag | Plasma vapor deposition |
US20130180850A1 (en) * | 2010-07-09 | 2013-07-18 | Oc Oerlikon Balzers Ag | Magnetron sputtering apparatus |
CN103814430A (zh) * | 2011-08-17 | 2014-05-21 | 三星电子株式会社 | 溅射设备和用于形成发光器件的透射导电层的方法 |
CN105132861A (zh) * | 2015-10-13 | 2015-12-09 | 京东方科技集团股份有限公司 | 一种蒸镀掩膜版以及蒸镀设备 |
KR102056735B1 (ko) * | 2016-03-14 | 2019-12-17 | 가부시끼가이샤 도시바 | 처리 장치 및 콜리메이터 |
JP6105115B1 (ja) * | 2016-03-14 | 2017-03-29 | 株式会社東芝 | 処理装置及びコリメータ |
USD859333S1 (en) * | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD858468S1 (en) * | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
GB201909538D0 (en) * | 2019-07-02 | 2019-08-14 | Spts Technologies Ltd | Deposition apparatus |
US20210135085A1 (en) * | 2019-11-06 | 2021-05-06 | International Business Machines Corporation | Cluster tool for production-worthy fabrication of dolan bridge quantum josephson junction devices |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
US20220406583A1 (en) * | 2021-06-18 | 2022-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Deposition system and method |
USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1072281A (en) * | 1976-03-24 | 1980-02-26 | Jobst U. Gellert | Injection molding filter assembly |
DE2841124C2 (de) * | 1978-09-21 | 1984-09-13 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen von elektronischen Halbleiterbauelementen durch Röntgen-Lithographie |
US4824544A (en) * | 1987-10-29 | 1989-04-25 | International Business Machines Corporation | Large area cathode lift-off sputter deposition device |
US4988424A (en) * | 1989-06-07 | 1991-01-29 | Ppg Industries, Inc. | Mask and method for making gradient sputtered coatings |
EP0440377B1 (de) * | 1990-01-29 | 1998-03-18 | Varian Associates, Inc. | Gerät und Verfahren zur Niederschlagung durch einen Kollimator |
US5223108A (en) * | 1991-12-30 | 1993-06-29 | Materials Research Corporation | Extended lifetime collimator |
DE69312142T2 (de) * | 1992-04-02 | 1998-02-05 | Philips Electronics Nv | Verfahren zum Herstellen einer zugespitzten Elektrode |
CA2111536A1 (en) * | 1992-12-16 | 1994-06-17 | Geri M. Actor | Collimated deposition apparatus |
US5415753A (en) * | 1993-07-22 | 1995-05-16 | Materials Research Corporation | Stationary aperture plate for reactive sputter deposition |
EP0682125A1 (de) * | 1994-05-11 | 1995-11-15 | Applied Materials, Inc. | Kontrolle eines Materials, welches von einem Target zerstäubt wird |
-
1995
- 1995-02-01 US US08/382,366 patent/US5643428A/en not_active Expired - Lifetime
-
1996
- 1996-01-11 WO PCT/US1996/000572 patent/WO1996024155A1/en active IP Right Grant
- 1996-01-11 EP EP96903508A patent/EP0809859B1/de not_active Expired - Lifetime
- 1996-01-11 DE DE69613352T patent/DE69613352T2/de not_active Expired - Fee Related
- 1996-01-24 TW TW085100804A patent/TW436895B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO1996024155A1 (en) | 1996-08-08 |
DE69613352D1 (de) | 2001-07-19 |
EP0809859B1 (de) | 2001-06-13 |
EP0809859A1 (de) | 1997-12-03 |
TW436895B (en) | 2001-05-28 |
US5643428A (en) | 1997-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |