DE69611467T2 - Modulare Anordnung mit zwei elektrisch zu verbindenden Schaltungen zur Übertragung eines Hochfrequenzsignals - Google Patents
Modulare Anordnung mit zwei elektrisch zu verbindenden Schaltungen zur Übertragung eines HochfrequenzsignalsInfo
- Publication number
- DE69611467T2 DE69611467T2 DE69611467T DE69611467T DE69611467T2 DE 69611467 T2 DE69611467 T2 DE 69611467T2 DE 69611467 T DE69611467 T DE 69611467T DE 69611467 T DE69611467 T DE 69611467T DE 69611467 T2 DE69611467 T2 DE 69611467T2
- Authority
- DE
- Germany
- Prior art keywords
- transmission
- frequency signal
- electrically connectable
- modular arrangement
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005540 biological transmission Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9502356A FR2731308B1 (fr) | 1995-03-01 | 1995-03-01 | Ensemble modulaire incluant deux circuits electroniques a relier electriquement pour la transmission d'un signal hyperfrequence |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69611467D1 DE69611467D1 (de) | 2001-02-15 |
DE69611467T2 true DE69611467T2 (de) | 2001-05-03 |
Family
ID=9476607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69611467T Expired - Fee Related DE69611467T2 (de) | 1995-03-01 | 1996-03-01 | Modulare Anordnung mit zwei elektrisch zu verbindenden Schaltungen zur Übertragung eines Hochfrequenzsignals |
Country Status (4)
Country | Link |
---|---|
US (1) | US5808530A (de) |
EP (1) | EP0730327B1 (de) |
DE (1) | DE69611467T2 (de) |
FR (1) | FR2731308B1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512431B2 (en) | 2001-02-28 | 2003-01-28 | Lockheed Martin Corporation | Millimeterwave module compact interconnect |
US6790049B2 (en) * | 2002-11-19 | 2004-09-14 | Scientific Components | Mechanical case for housing electronic products with integrated connector |
US7413481B2 (en) * | 2003-09-26 | 2008-08-19 | Redmond Iii Frank E | Systems for and methods of circuit construction |
SE533744C2 (sv) * | 2009-02-04 | 2010-12-21 | Roxtec Ab | Rör- eller kabelgenomföring med modulariserade moduler |
WO2010141100A1 (en) * | 2009-06-04 | 2010-12-09 | Morgan Advanced Ceramics, Inc. | Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4455448A (en) * | 1981-12-02 | 1984-06-19 | Watkins-Johnson Company | Housing for microwave electronic devices |
US4507708A (en) * | 1983-03-30 | 1985-03-26 | Westinghouse Electric Corp. | RF module with integral coaxial connector means |
JPS63244695A (ja) * | 1987-03-30 | 1988-10-12 | Fujitsu Ltd | 半導体発光装置 |
SE457253B (sv) * | 1987-04-14 | 1988-12-12 | Ericsson Telefon Ab L M | Elektrodanordning foer optoelektroniska organ |
JPH073907B2 (ja) * | 1987-07-03 | 1995-01-18 | 株式会社日立製作所 | デュアルインラインパッケ−ジ形半導体レ−ザモジュ−ル |
JPH0817260B2 (ja) * | 1987-12-18 | 1996-02-21 | 株式会社日立製作所 | 駆動回路内蔵半導体レーザモジユール |
US4979787A (en) * | 1990-01-12 | 1990-12-25 | Pco, Inc. | Optical-electronic interface module |
GB9100815D0 (en) * | 1991-01-15 | 1991-02-27 | British Telecomm | Coplanar waveguide ribbon |
JPH04279079A (ja) * | 1991-02-18 | 1992-10-05 | Mitsubishi Electric Corp | レーザダイオードモジュール |
-
1995
- 1995-03-01 FR FR9502356A patent/FR2731308B1/fr not_active Expired - Fee Related
-
1996
- 1996-02-29 US US08/610,166 patent/US5808530A/en not_active Expired - Lifetime
- 1996-03-01 EP EP96400441A patent/EP0730327B1/de not_active Expired - Lifetime
- 1996-03-01 DE DE69611467T patent/DE69611467T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2731308B1 (fr) | 1997-05-30 |
FR2731308A1 (fr) | 1996-09-06 |
US5808530A (en) | 1998-09-15 |
DE69611467D1 (de) | 2001-02-15 |
EP0730327B1 (de) | 2001-01-10 |
EP0730327A1 (de) | 1996-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: AVANEX CORP., FREMONT, CALIF., US |
|
8339 | Ceased/non-payment of the annual fee |