AU6757696A - A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method - Google Patents

A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method

Info

Publication number
AU6757696A
AU6757696A AU67576/96A AU6757696A AU6757696A AU 6757696 A AU6757696 A AU 6757696A AU 67576/96 A AU67576/96 A AU 67576/96A AU 6757696 A AU6757696 A AU 6757696A AU 6757696 A AU6757696 A AU 6757696A
Authority
AU
Australia
Prior art keywords
circuit board
layers
determining
carrying
relative positions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU67576/96A
Inventor
Henricus Dethmer Ubbo Ubbens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU6757696A publication Critical patent/AU6757696A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU67576/96A 1995-09-01 1996-08-27 A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method Abandoned AU6757696A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1001113A NL1001113C2 (en) 1995-09-01 1995-09-01 Method for determining mutual positions of a number of layers of a multilayer printing panel, device suitable for carrying out such a manner, as well as measuring pin and printing panel suitable for use in such a method.
NL1001113 1995-09-01
PCT/NL1996/000339 WO1997009630A1 (en) 1995-09-01 1996-08-27 A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method

Publications (1)

Publication Number Publication Date
AU6757696A true AU6757696A (en) 1997-03-27

Family

ID=19761520

Family Applications (1)

Application Number Title Priority Date Filing Date
AU67576/96A Abandoned AU6757696A (en) 1995-09-01 1996-08-27 A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method

Country Status (3)

Country Link
AU (1) AU6757696A (en)
NL (1) NL1001113C2 (en)
WO (1) WO1997009630A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2397652B (en) * 2002-11-15 2005-12-21 Immobilienges Helmut Fischer Measurement probe for measurement of the thickness of thin layers
DE102013004679B4 (en) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Apparatus and method for processing printed circuit boards
EP2987576A1 (en) * 2014-08-19 2016-02-24 Skybrain Vermögensverwaltungs GmbH Methods for drilling a hole and drilling machine therefore
DE102018202659A1 (en) * 2018-02-22 2019-08-22 Zf Friedrichshafen Ag Damping arrangement for power electronics applications
US20220371103A1 (en) * 2019-10-25 2022-11-24 Telefonaktiebolaget Lm Ericsson (Publ) Board Drilling Apparatus, Drill Bit, and Method for Board Drilling Apparatus to Drill a Board
CN117419623B (en) * 2023-12-19 2024-04-19 四川睿杰鑫电子股份有限公司 PCB hole inspection device and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3045433A1 (en) * 1980-12-02 1982-07-01 Siemens AG, 1000 Berlin und 8000 München MULTI-LAYER CIRCUIT BOARD AND METHOD FOR DETERMINING THE CURRENT POSITION OF INTERNAL CONNECTION AREAS
JPS61125712A (en) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd Method for drilling hole of multi-layer printing wiring board
JPS6228602A (en) * 1985-07-31 1987-02-06 Nec Corp Method for detecting deviating quantity of interlayer position in multilayer printed circuit board
US4790694A (en) * 1986-10-09 1988-12-13 Loma Park Associates Method and system for multi-layer printed circuit board pre-drill processing
JPH0634455B2 (en) * 1988-11-17 1994-05-02 シャープ株式会社 Method for forming pilot hole for through hole of multilayer printed wiring board
DE4110441A1 (en) * 1991-03-27 1992-10-01 Schneider Klaus METHOD FOR MEASURING THE MUTUAL OFFSET OF THE LAYERS OF A MULTILAYER ARRANGEMENT AND DEVICE FOR CARRYING OUT THIS METHOD
JPH0538610A (en) * 1991-08-06 1993-02-19 Nec Corp Inspection of multilayer printed wiring board

Also Published As

Publication number Publication date
NL1001113C2 (en) 1997-03-04
WO1997009630A1 (en) 1997-03-13

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