DE69607966T2 - Verfahren zur herstellung hydroxy-substituierter acetylenischer biphenyle - Google Patents

Verfahren zur herstellung hydroxy-substituierter acetylenischer biphenyle

Info

Publication number
DE69607966T2
DE69607966T2 DE69607966T DE69607966T DE69607966T2 DE 69607966 T2 DE69607966 T2 DE 69607966T2 DE 69607966 T DE69607966 T DE 69607966T DE 69607966 T DE69607966 T DE 69607966T DE 69607966 T2 DE69607966 T2 DE 69607966T2
Authority
DE
Germany
Prior art keywords
biphenyle
substituted acetylenic
producing hydroxy
hydroxy
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69607966T
Other languages
English (en)
Other versions
DE69607966D1 (de
Inventor
Kreisler Lau
Neil Hendricks
William Wan
Aaron Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Publication of DE69607966D1 publication Critical patent/DE69607966D1/de
Application granted granted Critical
Publication of DE69607966T2 publication Critical patent/DE69607966T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/46—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen
    • C08G2650/48—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen containing fluorine, e.g. perfluropolyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyethers (AREA)
DE69607966T 1995-06-26 1996-06-25 Verfahren zur herstellung hydroxy-substituierter acetylenischer biphenyle Expired - Fee Related DE69607966T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51495P 1995-06-26 1995-06-26
US08/665,189 US5959157A (en) 1995-06-26 1996-06-14 Process for making hydroxy-substituted ethynylated biphenyl compounds
PCT/US1996/010812 WO1997001594A1 (en) 1995-06-26 1996-06-25 Hydroxy-substituted ethynylated biphenyls

Publications (2)

Publication Number Publication Date
DE69607966D1 DE69607966D1 (de) 2000-05-31
DE69607966T2 true DE69607966T2 (de) 2000-08-31

Family

ID=26667758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69607966T Expired - Fee Related DE69607966T2 (de) 1995-06-26 1996-06-25 Verfahren zur herstellung hydroxy-substituierter acetylenischer biphenyle

Country Status (6)

Country Link
US (1) US5959157A (de)
EP (1) EP0835274B1 (de)
JP (1) JPH11508883A (de)
KR (1) KR19990028449A (de)
DE (1) DE69607966T2 (de)
WO (1) WO1997001594A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235353B1 (en) * 1998-02-24 2001-05-22 Alliedsignal Inc. Low dielectric constant films with high glass transition temperatures made by electron beam curing
US6660875B1 (en) 1998-06-09 2003-12-09 Ppt Technologies, Llc Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS)
CN100519623C (zh) * 2001-07-12 2009-07-29 旭硝子株式会社 含氟芳香族聚合物及其用途
DE10155802B4 (de) * 2001-11-14 2006-03-02 Infineon Technologies Ag Halbleiterchip mit FIB-Schutz
US6787633B2 (en) * 2002-09-13 2004-09-07 General Electric Company Method and apparatus for preparing a poly(arylene ether)
US6818285B2 (en) * 2002-12-31 2004-11-16 International Business Machines Corporation Composition and method to achieve reduced thermal expansion in polyarylene networks
CN100537830C (zh) 2003-01-22 2009-09-09 霍尼韦尔国际公司 膜或薄层离子化沉积的设备和方法
TW200505966A (en) * 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
JP4501391B2 (ja) 2003-09-30 2010-07-14 旭硝子株式会社 架橋性含フッ素芳香族プレポリマー及びその用途
JP5549900B2 (ja) * 2005-06-24 2014-07-16 旭硝子株式会社 架橋性含フッ素芳香族プレポリマー及びその用途
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
CA2853977C (en) 2011-11-18 2016-05-24 Greene, Tweed & Co. Crosslinking compounds for high glass transition temperature polymers
US9000231B2 (en) * 2011-12-20 2015-04-07 Colgate-Palmolive Company Processes for making magnolol and derivatives thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4252937A (en) * 1979-06-08 1981-02-24 The United States Of America As Represented By The Secretary Of The Air Force Polyaromatic ether-keto-sulfones and their synthesis
US4683340A (en) * 1986-10-08 1987-07-28 The United States Of America As Represented By The Secretary Of The Air Force Bis(benzilyloxy) compounds
GB8828995D0 (en) * 1988-12-12 1989-01-25 Ici Plc Aromatic polymer
US5108840A (en) * 1989-12-08 1992-04-28 Raychem Corporation Multilayer electronic circuit article having a poly(naphthyl ether) dielectric
EP0505438A1 (de) * 1989-12-08 1992-09-30 AlliedSignal Inc. Elektronische gegenstände, die polyarylenäther als dielektrikum enthalten
CA2080831C (en) * 1990-04-17 2001-10-16 Frank W. Mercer Crosslinkable fluorinated aromatic ether compositions

Also Published As

Publication number Publication date
EP0835274B1 (de) 2000-04-26
WO1997001594A1 (en) 1997-01-16
DE69607966D1 (de) 2000-05-31
KR19990028449A (ko) 1999-04-15
JPH11508883A (ja) 1999-08-03
US5959157A (en) 1999-09-28
EP0835274A1 (de) 1998-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee