DE69601278D1 - Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum - Google Patents
Korrosionsbeständiger Druckwandler durch anorganischen Überzug im HohlraumInfo
- Publication number
- DE69601278D1 DE69601278D1 DE69601278T DE69601278T DE69601278D1 DE 69601278 D1 DE69601278 D1 DE 69601278D1 DE 69601278 T DE69601278 T DE 69601278T DE 69601278 T DE69601278 T DE 69601278T DE 69601278 D1 DE69601278 D1 DE 69601278D1
- Authority
- DE
- Germany
- Prior art keywords
- thanks
- corrosion
- cavity
- pressure transducer
- inorganic coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 230000007797 corrosion Effects 0.000 title 1
- 238000005260 corrosion Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49771—Quantitative measuring or gauging
- Y10T29/49776—Pressure, force, or weight determining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/415,900 US5889211A (en) | 1995-04-03 | 1995-04-03 | Media compatible microsensor structure and methods of manufacturing and using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69601278D1 true DE69601278D1 (de) | 1999-02-18 |
DE69601278T2 DE69601278T2 (de) | 1999-09-09 |
Family
ID=23647695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69601278T Expired - Fee Related DE69601278T2 (de) | 1995-04-03 | 1996-03-25 | Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum |
Country Status (5)
Country | Link |
---|---|
US (1) | US5889211A (de) |
EP (1) | EP0736757B1 (de) |
JP (1) | JPH08278218A (de) |
KR (1) | KR100402875B1 (de) |
DE (1) | DE69601278T2 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6140144A (en) * | 1996-08-08 | 2000-10-31 | Integrated Sensing Systems, Inc. | Method for packaging microsensors |
US5994161A (en) * | 1997-09-03 | 1999-11-30 | Motorola, Inc. | Temperature coefficient of offset adjusted semiconductor device and method thereof |
US6546785B1 (en) * | 1998-04-02 | 2003-04-15 | Rockwell Automation Technologies, Inc. | System and method for dynamic lubrication adjustment for a lubrication analysis system |
US6023961A (en) | 1998-04-02 | 2000-02-15 | Reliance Electric Industrial Company | Micro-viscosity sensor and lubrication analysis system employing the same |
US7134323B1 (en) | 1998-04-02 | 2006-11-14 | Rockwell Automation Technologies, Inc. | System and method for dynamic lubrication adjustment for a lubrication analysis system |
DE19816872B4 (de) | 1998-04-16 | 2005-12-15 | Ebro Electronic Gmbh & Co. Kg | Meßvorrichtung zum Messen des Drucks einer Atmosphäre |
DE19830538A1 (de) * | 1998-07-08 | 2000-01-20 | Siemens Ag | Drucksensor-Anordnung, insbesondere zur Druckerfassung in einem ölbeaufschlagten Druckbereich eines Kraftfahrzeuggetriebes |
US6177726B1 (en) * | 1999-02-11 | 2001-01-23 | Philips Electronics North America Corporation | SiO2 wire bond insulation in semiconductor assemblies |
US20030011048A1 (en) * | 1999-03-19 | 2003-01-16 | Abbott Donald C. | Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
US6579612B1 (en) | 1999-06-24 | 2003-06-17 | International Business Machines Corporation | Magnetostrictive sensor structure |
AU7645300A (en) * | 1999-10-05 | 2001-05-10 | Delta Danish Electronics, Light And Acoustics | Encapsulation for a three-dimensional microsystem |
US6453749B1 (en) | 1999-10-28 | 2002-09-24 | Motorola, Inc. | Physical sensor component |
US6576980B1 (en) | 1999-11-30 | 2003-06-10 | Agere Systems, Inc. | Surface treatment anneal of hydrogenated silicon-oxy-carbide dielectric layer |
JP2003533361A (ja) * | 2000-05-15 | 2003-11-11 | テカン・トレーディング・アクチェンゲゼルシャフト | ミクロ流体構造での蒸着相似コーティングの使用 |
DE10035538A1 (de) * | 2000-07-21 | 2002-02-07 | Bosch Gmbh Robert | Sensor |
EP1245528A1 (de) * | 2001-03-27 | 2002-10-02 | Delta Danish Electronics, Light & Acoustics | Ein einstückiges flexibles Mikrosystem und Verfahren zu dessen Herstellung |
US6769319B2 (en) | 2001-07-09 | 2004-08-03 | Freescale Semiconductor, Inc. | Component having a filter |
DE10140322B4 (de) * | 2001-08-16 | 2007-10-04 | Abb Patent Gmbh | Mikrostrukturierter dreidimensionaler Sensor oder Aktor, sowie Verfahren zu seiner Herstellung |
DE10163760C5 (de) | 2001-12-28 | 2012-02-02 | Ebro Electronic Gmbh & Co. Kg | Vorrichtung und Verfahren zum Messen des Zustandes von Ölen und Fetten |
JP2003302299A (ja) * | 2002-04-10 | 2003-10-24 | Denso Corp | 力学量検出装置の製造方法 |
JP3915586B2 (ja) * | 2002-04-24 | 2007-05-16 | 株式会社デンソー | 力学量検出装置の製造方法 |
DE10227479A1 (de) * | 2002-06-19 | 2004-01-08 | Endress + Hauser Gmbh + Co. Kg | Druckmeßgerät |
DE10319646B3 (de) * | 2003-05-02 | 2004-09-02 | Hilti Ag | Treibmittelbehälter für Setzgeräte und brennkraftbetriebenes Setzgerät |
US7078796B2 (en) * | 2003-07-01 | 2006-07-18 | Freescale Semiconductor, Inc. | Corrosion-resistant copper bond pad and integrated device |
US20050001316A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant bond pad and integrated device |
JP2007532865A (ja) * | 2004-02-09 | 2007-11-15 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 圧力センサのための腐食保護 |
JP4564775B2 (ja) * | 2004-04-26 | 2010-10-20 | 日立オートモティブシステムズ株式会社 | 液体及び気体用圧力検出装置 |
US20060105682A1 (en) * | 2004-10-01 | 2006-05-18 | John Bowman | System and method for monitoring and/or controlling a flow of a media |
KR100840292B1 (ko) | 2005-10-11 | 2008-06-20 | 삼성전기주식회사 | 멤스 모듈 및 패키징 방법 |
KR100773759B1 (ko) | 2006-03-27 | 2007-11-09 | 한국기계연구원 | 마이크로 압력센서 |
KR100828067B1 (ko) | 2006-03-27 | 2008-05-08 | 한국기계연구원 | 선형보정 마이크로 압력센서 |
DE502006008914D1 (de) * | 2006-09-25 | 2011-03-31 | Grundfos Management As | Halbleiterbauelement |
US8214007B2 (en) | 2006-11-01 | 2012-07-03 | Welch Allyn, Inc. | Body worn physiological sensor device having a disposable electrode module |
WO2008058406A1 (de) * | 2006-11-13 | 2008-05-22 | Inficon Gmbh | Vakuummembranmesszelle und verfahren zur herstellung einer derartigen messzelle |
DE102007042976B4 (de) * | 2007-09-10 | 2012-12-13 | Continental Automotive Gmbh | Drucksensor und Verfahren zu dessen Herstellung |
US7820485B2 (en) * | 2008-09-29 | 2010-10-26 | Freescale Semiconductor, Inc. | Method of forming a package with exposed component surfaces |
US8415203B2 (en) * | 2008-09-29 | 2013-04-09 | Freescale Semiconductor, Inc. | Method of forming a semiconductor package including two devices |
DE102009028488A1 (de) * | 2009-08-12 | 2011-02-17 | Endress + Hauser Gmbh + Co. Kg | Relativdrucksensor |
US8569092B2 (en) * | 2009-12-28 | 2013-10-29 | General Electric Company | Method for fabricating a microelectromechanical sensor with a piezoresistive type readout |
DE102010039357B4 (de) * | 2010-08-16 | 2017-12-14 | Ifm Electronic Gmbh | Druckmessgerät für die Prozessmesstechnik |
US8371176B2 (en) | 2011-01-06 | 2013-02-12 | Honeywell International Inc. | Media isolated pressure sensor |
US8384168B2 (en) | 2011-04-21 | 2013-02-26 | Freescale Semiconductor, Inc. | Sensor device with sealing structure |
US8476087B2 (en) | 2011-04-21 | 2013-07-02 | Freescale Semiconductor, Inc. | Methods for fabricating sensor device package using a sealing structure |
US9700222B2 (en) | 2011-12-02 | 2017-07-11 | Lumiradx Uk Ltd | Health-monitor patch |
US9734304B2 (en) | 2011-12-02 | 2017-08-15 | Lumiradx Uk Ltd | Versatile sensors with data fusion functionality |
US8516897B1 (en) | 2012-02-21 | 2013-08-27 | Honeywell International Inc. | Pressure sensor |
DE102013226775A1 (de) * | 2013-12-19 | 2015-06-25 | Vega Grieshaber Kg | Messzelle |
DE102014113543A1 (de) * | 2014-09-19 | 2016-03-24 | Endress + Hauser Gmbh + Co. Kg | Medienbeständige Multilagenbeschichtung für ein Messgerät der Prozesstechnik |
DE202015104676U1 (de) * | 2015-09-03 | 2015-11-23 | Leifheit Ag | Küchenwaage |
CN108168768B (zh) * | 2017-11-23 | 2019-03-01 | 中国矿业大学 | 气体突破压力测试装置及方法 |
CN118202217A (zh) * | 2021-12-02 | 2024-06-14 | 株式会社日立高新技术 | 压力传感器模块以及具有压力传感器模块的分注装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4655088A (en) * | 1985-10-07 | 1987-04-07 | Motorola, Inc. | Unibody pressure transducer package |
US4732042A (en) * | 1986-04-22 | 1988-03-22 | Motorola Inc. | Cast membrane protected pressure sensor |
US4773269A (en) * | 1986-07-28 | 1988-09-27 | Rosemount Inc. | Media isolated differential pressure sensors |
US4790192A (en) * | 1987-09-24 | 1988-12-13 | Rosemount Inc. | Silicon side by side coplanar pressure sensors |
DE3912217A1 (de) * | 1989-04-13 | 1990-10-18 | Endress Hauser Gmbh Co | Drucksensor |
JP2558549B2 (ja) * | 1990-10-11 | 1996-11-27 | 東横化学株式会社 | 半導体圧力センサ及びその製造方法 |
JPH05149814A (ja) * | 1991-11-29 | 1993-06-15 | Fuji Electric Co Ltd | 二重ダイヤフラム式半導体圧力センサ |
EP0548470B2 (de) * | 1991-12-24 | 1999-12-08 | Landis & Gyr Technology Innovation AG | Drucksensor mit einer Membran aus Halbleitermaterial |
-
1995
- 1995-04-03 US US08/415,900 patent/US5889211A/en not_active Expired - Lifetime
-
1996
- 1996-03-12 KR KR1019960006428A patent/KR100402875B1/ko not_active IP Right Cessation
- 1996-03-25 DE DE69601278T patent/DE69601278T2/de not_active Expired - Fee Related
- 1996-03-25 EP EP96104684A patent/EP0736757B1/de not_active Expired - Lifetime
- 1996-03-29 JP JP8104434A patent/JPH08278218A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR100402875B1 (ko) | 2004-07-05 |
EP0736757A1 (de) | 1996-10-09 |
DE69601278T2 (de) | 1999-09-09 |
EP0736757B1 (de) | 1999-01-07 |
JPH08278218A (ja) | 1996-10-22 |
KR960039444A (ko) | 1996-11-25 |
US5889211A (en) | 1999-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69601278D1 (de) | Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum | |
DE69600520D1 (de) | System zur elektrizitätsübertragung im bohrloch | |
DE69623947D1 (de) | Beschichtungsharzmasse | |
DE69616198D1 (de) | Druckwandler | |
ATE301718T1 (de) | Metabolismusregulierung durch verändern des gehaltes an trehalose-6-phosphat | |
DE69412746D1 (de) | Wässrige Harzbeschichtungszusammensetzung | |
EP0726096A3 (de) | Verbesserungen an Pumpenzerstäubern | |
NL1003334A1 (nl) | Corrosie-remmers in poederbekledingen. | |
FI944587A0 (fi) | Järjestely seinämässä sekä menetelmä seinämän pinnoittamiseksi | |
DE59603304D1 (de) | Durch beschichtung stabilisierte feste peroxo- und peroxy-verbindungen | |
DE69738250D1 (de) | Durch Photostereographie hergestelltes, dreidimensionales Objekt und die Harzzusammensetzung zu seiner Herstellung | |
DE59506859D1 (de) | Vorgesteuertes proportional-druckbegrenzungsventil | |
DE69625987D1 (de) | Koplanar montierter Druckwandler mit zwei Gehäusen | |
DE69526672D1 (de) | Starke wasserdurchlässige dünne kompositmembran | |
FR2657816B1 (fr) | Feuilles decoratives utilisables notamment pour la fabrication de panneaux stratifies et comprenant des paillettes metallisees ou en plastique irise. | |
DE69505162D1 (de) | Interner Druckregler im Flansch einer Druckerhöhungsvorrichtung | |
DK0606536T3 (da) | Måleværdigiver med ultralydtransducer | |
GB9405103D0 (en) | Passive sonar transducer arrangement | |
EP0730952A3 (de) | Verfahren zum Kaschieren von einem Metallband mit Kunststofffolie, danach hergestellter Schichtstoff, und daraus hergestellte Dose | |
GB2299822B (en) | Improvements in or relating to anti-fouling coatings | |
EE9600168A (et) | Mõõturi kruviliide | |
EP0749155A3 (de) | Kompositbeschichtungen für Elektronik | |
GB2304620B (en) | Improvements in or relating to the manufacture of plastics pipes | |
GB9521726D0 (en) | Improvements in or relating to the coating of ships | |
GB9613150D0 (en) | Improvements in or relating to acoustic transducers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: FREESCALE SEMICONDUCTOR, INC., AUSTIN, TEX., US |
|
8339 | Ceased/non-payment of the annual fee |