DE69601278D1 - Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum - Google Patents

Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum

Info

Publication number
DE69601278D1
DE69601278D1 DE69601278T DE69601278T DE69601278D1 DE 69601278 D1 DE69601278 D1 DE 69601278D1 DE 69601278 T DE69601278 T DE 69601278T DE 69601278 T DE69601278 T DE 69601278T DE 69601278 D1 DE69601278 D1 DE 69601278D1
Authority
DE
Germany
Prior art keywords
thanks
corrosion
cavity
pressure transducer
inorganic coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69601278T
Other languages
English (en)
Other versions
DE69601278T2 (de
Inventor
Theresa A Maudie
David J Monk
Timothy S Savage
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69601278D1 publication Critical patent/DE69601278D1/de
Application granted granted Critical
Publication of DE69601278T2 publication Critical patent/DE69601278T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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    • H01L2224/48505—Material at the bonding interface
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49771—Quantitative measuring or gauging
    • Y10T29/49776—Pressure, force, or weight determining

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Wire Bonding (AREA)
DE69601278T 1995-04-03 1996-03-25 Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum Expired - Fee Related DE69601278T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/415,900 US5889211A (en) 1995-04-03 1995-04-03 Media compatible microsensor structure and methods of manufacturing and using the same

Publications (2)

Publication Number Publication Date
DE69601278D1 true DE69601278D1 (de) 1999-02-18
DE69601278T2 DE69601278T2 (de) 1999-09-09

Family

ID=23647695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69601278T Expired - Fee Related DE69601278T2 (de) 1995-04-03 1996-03-25 Korrosionsbeständiger Druckwandler durch anorganischen Überzug im Hohlraum

Country Status (5)

Country Link
US (1) US5889211A (de)
EP (1) EP0736757B1 (de)
JP (1) JPH08278218A (de)
KR (1) KR100402875B1 (de)
DE (1) DE69601278T2 (de)

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US6546785B1 (en) * 1998-04-02 2003-04-15 Rockwell Automation Technologies, Inc. System and method for dynamic lubrication adjustment for a lubrication analysis system
US6023961A (en) 1998-04-02 2000-02-15 Reliance Electric Industrial Company Micro-viscosity sensor and lubrication analysis system employing the same
US7134323B1 (en) 1998-04-02 2006-11-14 Rockwell Automation Technologies, Inc. System and method for dynamic lubrication adjustment for a lubrication analysis system
DE19816872B4 (de) 1998-04-16 2005-12-15 Ebro Electronic Gmbh & Co. Kg Meßvorrichtung zum Messen des Drucks einer Atmosphäre
DE19830538A1 (de) * 1998-07-08 2000-01-20 Siemens Ag Drucksensor-Anordnung, insbesondere zur Druckerfassung in einem ölbeaufschlagten Druckbereich eines Kraftfahrzeuggetriebes
US6177726B1 (en) * 1999-02-11 2001-01-23 Philips Electronics North America Corporation SiO2 wire bond insulation in semiconductor assemblies
US20030011048A1 (en) * 1999-03-19 2003-01-16 Abbott Donald C. Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered
US6579612B1 (en) 1999-06-24 2003-06-17 International Business Machines Corporation Magnetostrictive sensor structure
AU7645300A (en) * 1999-10-05 2001-05-10 Delta Danish Electronics, Light And Acoustics Encapsulation for a three-dimensional microsystem
US6453749B1 (en) 1999-10-28 2002-09-24 Motorola, Inc. Physical sensor component
US6576980B1 (en) 1999-11-30 2003-06-10 Agere Systems, Inc. Surface treatment anneal of hydrogenated silicon-oxy-carbide dielectric layer
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EP0736757A1 (de) 1996-10-09
DE69601278T2 (de) 1999-09-09
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JPH08278218A (ja) 1996-10-22
KR960039444A (ko) 1996-11-25
US5889211A (en) 1999-03-30

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