DE69519812D1 - Weichlotpastemischung - Google Patents

Weichlotpastemischung

Info

Publication number
DE69519812D1
DE69519812D1 DE69519812T DE69519812T DE69519812D1 DE 69519812 D1 DE69519812 D1 DE 69519812D1 DE 69519812 T DE69519812 T DE 69519812T DE 69519812 T DE69519812 T DE 69519812T DE 69519812 D1 DE69519812 D1 DE 69519812D1
Authority
DE
Germany
Prior art keywords
solder paste
soft solder
paste mixture
mixture
soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69519812T
Other languages
English (en)
Other versions
DE69519812T2 (de
Inventor
Greg E Blonder
Thomas Dixon Dudderar
Yinon Degani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69519812D1 publication Critical patent/DE69519812D1/de
Application granted granted Critical
Publication of DE69519812T2 publication Critical patent/DE69519812T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69519812T 1994-03-22 1995-03-08 Weichlotpastemischung Expired - Lifetime DE69519812T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/216,225 US5382300A (en) 1994-03-22 1994-03-22 Solder paste mixture

Publications (2)

Publication Number Publication Date
DE69519812D1 true DE69519812D1 (de) 2001-02-15
DE69519812T2 DE69519812T2 (de) 2001-05-31

Family

ID=22806258

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69519812T Expired - Lifetime DE69519812T2 (de) 1994-03-22 1995-03-08 Weichlotpastemischung

Country Status (6)

Country Link
US (1) US5382300A (de)
EP (1) EP0673706B1 (de)
JP (1) JP3441220B2 (de)
KR (1) KR100317717B1 (de)
CA (1) CA2134377C (de)
DE (1) DE69519812T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573602A (en) * 1994-12-19 1996-11-12 Motorola, Inc. Solder paste
US5429293A (en) * 1994-12-19 1995-07-04 Motorola, Inc. Soldering process
US5803340A (en) * 1995-09-29 1998-09-08 Delco Electronics Corporation Composite solder paste for flip chip bumping
TW369451B (en) * 1996-05-10 1999-09-11 Ford Motor Co Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates
US5990564A (en) * 1997-05-30 1999-11-23 Lucent Technologies Inc. Flip chip packaging of memory chips
US6214131B1 (en) 1998-10-29 2001-04-10 Agilent Technologies, Inc. Mixed solder pastes for low-temperature soldering process
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
CA2410636A1 (en) 2000-05-24 2001-11-29 Stephen F. Corbin Variable melting point solders and brazes
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
KR100403621B1 (ko) * 2001-03-30 2003-10-30 삼성전자주식회사 전기적 특성 평가를 위한 테스트 패드를 갖는 칩 온 필름패키지 및 칩 온 필름 패키지 형성 방법
TW530403B (en) * 2002-03-01 2003-05-01 Advanced Semiconductor Eng Solder paste for manufacturing bump
CN1445049A (zh) * 2002-03-19 2003-10-01 日本胜利株式会社 焊锡膏、焊接成品及焊接方法
DE10304469A1 (de) * 2003-02-04 2004-08-19 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Weichlotlegierungszusammensetzung, Weichlotlegierung, Verwendung einer Weichlotlegierungszusammensetzung und Verfahren zum Herstellen einer Weichlotlegierung
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US7017795B2 (en) * 2003-11-03 2006-03-28 Indium Corporation Of America Solder pastes for providing high elasticity, low rigidity solder joints
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
JP2005183904A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品
DE102004034035A1 (de) * 2004-07-13 2006-02-09 W.C. Heraeus Gmbh Bleifreie Lotpasten mit erhöhter Zuverlässigkeit
KR100967420B1 (ko) 2008-01-25 2010-07-01 용 복 차 겔 상태의 땜납 조성물 및 그 제조방법
TW201210733A (en) 2010-08-26 2012-03-16 Dynajoin Corp Variable melting point solders
US11581239B2 (en) 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3574351D1 (en) * 1984-05-14 1989-12-28 Raychem Corp Solder composition
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
JPS62179889A (ja) * 1986-01-31 1987-08-07 Senjiyu Kinzoku Kogyo Kk クリ−ムはんだ
US4865654A (en) * 1986-10-03 1989-09-12 Texas Instruments Incorporated Delayed reflow alloy mix solder paste
US4921550A (en) * 1986-10-03 1990-05-01 Texas Instruments Incorporated Delayed reflow alloy mix solder paste
US4767471A (en) * 1986-10-03 1988-08-30 Texas Instruments Incorporated Delayed reflow alloy mix solder paste
JPH01241395A (ja) * 1988-03-19 1989-09-26 Matsuo Handa Kk クリームはんだ
US5229070A (en) * 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5211764A (en) * 1992-11-10 1993-05-18 At&T Bell Laboratories Solder paste and method of using the same
US5328521A (en) * 1993-03-08 1994-07-12 E. I. Du Pont De Nemours And Company Kinetic solder paste composition

Also Published As

Publication number Publication date
CA2134377A1 (en) 1995-09-23
KR100317717B1 (ko) 2002-04-24
US5382300A (en) 1995-01-17
EP0673706A1 (de) 1995-09-27
EP0673706B1 (de) 2001-01-10
CA2134377C (en) 1998-04-28
KR950031361A (ko) 1995-12-18
DE69519812T2 (de) 2001-05-31
JPH07256480A (ja) 1995-10-09
JP3441220B2 (ja) 2003-08-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition