DE69512051D1 - Verfahren und vorrichtung zur in situ messung der dehnung in einem dunnfilm wahrend seines niederschlags auf einem substrat - Google Patents
Verfahren und vorrichtung zur in situ messung der dehnung in einem dunnfilm wahrend seines niederschlags auf einem substratInfo
- Publication number
- DE69512051D1 DE69512051D1 DE69512051T DE69512051T DE69512051D1 DE 69512051 D1 DE69512051 D1 DE 69512051D1 DE 69512051 T DE69512051 T DE 69512051T DE 69512051 T DE69512051 T DE 69512051T DE 69512051 D1 DE69512051 D1 DE 69512051D1
- Authority
- DE
- Germany
- Prior art keywords
- deposition
- substrate
- thin film
- film during
- measuring elongation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008021 deposition Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0047—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes measuring forces due to residual stresses
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0061—Force sensors associated with industrial machines or actuators
- G01L5/0076—Force sensors associated with manufacturing machines
- G01L5/008—Force sensors integrated in an article or a dummy workpiece
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9405793A FR2719900B1 (fr) | 1994-05-11 | 1994-05-11 | Procédé et dispositif pour la mesure in situ des contraintes se développant au sein d'une couche mince lors de son dépôt sur un substrat. |
PCT/FR1995/000619 WO1995031706A1 (fr) | 1994-05-11 | 1995-05-11 | Procede et dispositif pour la mesure in situ des contraintes se developpant au sein d'une couche mince lors de son depot sur un substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69512051D1 true DE69512051D1 (de) | 1999-10-14 |
DE69512051T2 DE69512051T2 (de) | 2000-03-09 |
Family
ID=9463114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69512051T Expired - Lifetime DE69512051T2 (de) | 1994-05-11 | 1995-05-11 | Verfahren und vorrichtung zur in situ messung der dehnung in einem dunnfilm wahrend seines niederschlags auf einem substrat |
Country Status (6)
Country | Link |
---|---|
US (1) | US5745240A (de) |
EP (1) | EP0759155B1 (de) |
DE (1) | DE69512051T2 (de) |
ES (1) | ES2135737T3 (de) |
FR (1) | FR2719900B1 (de) |
WO (1) | WO1995031706A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19516256C1 (de) * | 1995-04-26 | 1996-10-02 | Fraunhofer Ges Forschung | Vorrichtung zur in-situ Messung von mechanischen Spannungen in Schichten |
US6649208B2 (en) * | 2001-04-17 | 2003-11-18 | Wayne E. Rodgers | Apparatus and method for thin film deposition onto substrates |
DE10207901A1 (de) * | 2002-02-22 | 2003-09-04 | Aixtron Ag | Vorrichtung zum Abschneiden dünner Schichten mit drahtloser Prozessparameter-Aufnahme |
US20050092246A1 (en) * | 2002-02-22 | 2005-05-05 | Peter Baumann | Device for depositing thin layers with a wireless detection of process parameters |
GB0218998D0 (en) * | 2002-08-14 | 2002-09-25 | Oxford Instr Plasma Technology | Thin film deposition apparatus |
DE102005008889B4 (de) * | 2005-02-26 | 2016-07-07 | Leybold Optics Gmbh | Optisches Monitoringsystem für Beschichtungsprozesse |
DE102005010681B4 (de) * | 2005-03-09 | 2016-05-04 | Leybold Optics Gmbh | Messanordnung zum optischen Monitoring von Beschichtungsprozessen |
CN102953037B (zh) | 2011-08-19 | 2014-12-17 | 京东方科技集团股份有限公司 | 一种超薄玻璃基板上导电膜的制备方法 |
US20130101728A1 (en) * | 2011-10-21 | 2013-04-25 | John J. Keremes | Additive manufacturing in situ stress relief |
JP5949252B2 (ja) * | 2011-12-02 | 2016-07-06 | 株式会社島津製作所 | Maldi用試料作成装置および試料作成方法 |
US9601391B2 (en) | 2015-03-12 | 2017-03-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Mechanical stress measurement during thin-film fabrication |
CN105604547B (zh) * | 2016-02-25 | 2019-03-05 | 中国电建集团华东勘测设计研究院有限公司 | 一种适用于破碎岩体的水压致裂法地应力量测方法 |
CN115255509B (zh) * | 2022-09-29 | 2023-01-24 | 中铝材料应用研究院有限公司 | 一种用于表征薄板内部残余应力的薄板切割装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3383238A (en) * | 1965-05-27 | 1968-05-14 | Unzicker Arlyn Eugene | Method and apparatus of controlling thin film deposition in a vacuum |
US3570449A (en) * | 1969-03-13 | 1971-03-16 | United Aircraft Corp | Sensor system for a vacuum deposition apparatus |
CH522570A (it) * | 1970-05-06 | 1972-06-30 | Metal Lux Spa | Apparecchiatura per la colorazione sotto vuoto di lenti per occhiali |
US4024291A (en) * | 1975-06-17 | 1977-05-17 | Leybold-Heraeus Gmbh & Co. Kg | Control of vapor deposition |
JPS52113379A (en) * | 1976-03-19 | 1977-09-22 | Hitachi Ltd | Vacuum evaporation |
JPS60229255A (ja) * | 1984-04-27 | 1985-11-14 | Matsushita Electric Ind Co Ltd | 光情報記録担体の蒸着方法 |
JPS63157869A (ja) * | 1986-12-18 | 1988-06-30 | Mitsubishi Electric Corp | 被膜形成装置 |
DE3901017A1 (de) * | 1989-01-14 | 1990-07-19 | Leybold Ag | Verfahren und vorrichtung zur ueberwachung des schichtabtrags bei einem trockenaetzprozess |
US5154810A (en) * | 1991-01-29 | 1992-10-13 | Optical Coating Laboratory, Inc. | Thin film coating and method |
US5450205A (en) * | 1993-05-28 | 1995-09-12 | Massachusetts Institute Of Technology | Apparatus and method for real-time measurement of thin film layer thickness and changes thereof |
US5392124A (en) * | 1993-12-17 | 1995-02-21 | International Business Machines Corporation | Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control |
-
1994
- 1994-05-11 FR FR9405793A patent/FR2719900B1/fr not_active Expired - Lifetime
-
1995
- 1995-05-11 DE DE69512051T patent/DE69512051T2/de not_active Expired - Lifetime
- 1995-05-11 ES ES95920138T patent/ES2135737T3/es not_active Expired - Lifetime
- 1995-05-11 US US08/652,535 patent/US5745240A/en not_active Expired - Fee Related
- 1995-05-11 EP EP95920138A patent/EP0759155B1/de not_active Expired - Lifetime
- 1995-05-11 WO PCT/FR1995/000619 patent/WO1995031706A1/fr active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0759155B1 (de) | 1999-09-08 |
FR2719900A1 (fr) | 1995-11-17 |
ES2135737T3 (es) | 1999-11-01 |
EP0759155A1 (de) | 1997-02-26 |
DE69512051T2 (de) | 2000-03-09 |
FR2719900B1 (fr) | 1996-09-20 |
US5745240A (en) | 1998-04-28 |
WO1995031706A1 (fr) | 1995-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |