DE69509424D1 - Stromausfall Rückstellung für eine Waferheizvorrichtung - Google Patents

Stromausfall Rückstellung für eine Waferheizvorrichtung

Info

Publication number
DE69509424D1
DE69509424D1 DE69509424T DE69509424T DE69509424D1 DE 69509424 D1 DE69509424 D1 DE 69509424D1 DE 69509424 T DE69509424 T DE 69509424T DE 69509424 T DE69509424 T DE 69509424T DE 69509424 D1 DE69509424 D1 DE 69509424D1
Authority
DE
Germany
Prior art keywords
provision
power failure
wafer heater
wafer
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69509424T
Other languages
English (en)
Other versions
DE69509424T2 (de
Inventor
Lawrence Chung-Lai Lei
Gean Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69509424D1 publication Critical patent/DE69509424D1/de
Application granted granted Critical
Publication of DE69509424T2 publication Critical patent/DE69509424T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
DE69509424T 1994-02-24 1995-02-14 Stromausfall Rückstellung für eine Waferheizvorrichtung Expired - Fee Related DE69509424T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/201,444 US5421894A (en) 1994-02-24 1994-02-24 Power loss recovery for wafer heater

Publications (2)

Publication Number Publication Date
DE69509424D1 true DE69509424D1 (de) 1999-06-10
DE69509424T2 DE69509424T2 (de) 1999-11-25

Family

ID=22745840

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69509424T Expired - Fee Related DE69509424T2 (de) 1994-02-24 1995-02-14 Stromausfall Rückstellung für eine Waferheizvorrichtung

Country Status (5)

Country Link
US (1) US5421894A (de)
EP (1) EP0669643B1 (de)
JP (1) JPH0851116A (de)
KR (1) KR100219968B1 (de)
DE (1) DE69509424T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW254030B (en) * 1994-03-18 1995-08-11 Anelva Corp Mechanic escape mechanism for substrate
US5796066A (en) * 1996-03-29 1998-08-18 Lam Research Corporation Cable actuated drive assembly for vacuum chamber
US5772773A (en) * 1996-05-20 1998-06-30 Applied Materials, Inc. Co-axial motorized wafer lift
US5951776A (en) * 1996-10-25 1999-09-14 Applied Materials, Inc. Self aligning lift mechanism
KR100319891B1 (ko) * 1999-06-29 2002-01-10 윤종용 웨이퍼용 열처리 방법
US6705394B1 (en) * 1999-10-29 2004-03-16 Cvc Products, Inc. Rapid cycle chuck for low-pressure processing
JP3543949B2 (ja) * 1999-11-09 2004-07-21 東京エレクトロン株式会社 熱処理装置
DE10330506A1 (de) * 2003-07-05 2005-03-31 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Waferinspektion
US8603249B2 (en) * 2006-12-11 2013-12-10 Lg Electronics Inc. Lift pin driving device and manufacturing apparatus having same
CN103173740B (zh) * 2013-02-25 2015-05-06 上海大学 Mocvd尾气驱动旋转系统
CN104102174B (zh) * 2014-06-30 2016-09-07 北京七星华创电子股份有限公司 一种半导体设备软件重启后状态恢复的方法
US10340096B2 (en) 2017-05-19 2019-07-02 Mitsubishi Electric Power Products, Inc. System and method for air motor recharging of spring mechanisms

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967132A (en) * 1974-11-26 1976-06-29 Takamine Bruce N Air operated power transfer apparatus
JPH073314B2 (ja) * 1988-03-07 1995-01-18 イーグル工業株式会社 真空熱処理炉の非常用冷却装置
US5131460A (en) * 1991-10-24 1992-07-21 Applied Materials, Inc. Reducing particulates during semiconductor fabrication

Also Published As

Publication number Publication date
JPH0851116A (ja) 1996-02-20
DE69509424T2 (de) 1999-11-25
US5421894A (en) 1995-06-06
EP0669643A1 (de) 1995-08-30
EP0669643B1 (de) 1999-05-06
KR100219968B1 (ko) 1999-10-01
KR950034466A (ko) 1995-12-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee