DE69507674D1 - Verfahren zum Herstellen eines flachen Kabelbaumes - Google Patents

Verfahren zum Herstellen eines flachen Kabelbaumes

Info

Publication number
DE69507674D1
DE69507674D1 DE69507674T DE69507674T DE69507674D1 DE 69507674 D1 DE69507674 D1 DE 69507674D1 DE 69507674 T DE69507674 T DE 69507674T DE 69507674 T DE69507674 T DE 69507674T DE 69507674 D1 DE69507674 D1 DE 69507674D1
Authority
DE
Germany
Prior art keywords
making
wire harness
flat wire
flat
harness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69507674T
Other languages
English (en)
Other versions
DE69507674T2 (de
Inventor
Shogo Tanno
Toshiyuki Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Application granted granted Critical
Publication of DE69507674D1 publication Critical patent/DE69507674D1/de
Publication of DE69507674T2 publication Critical patent/DE69507674T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
    • H01B13/01254—Flat-harness manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
DE69507674T 1994-09-30 1995-09-26 Verfahren zum Herstellen eines flachen Kabelbaumes Expired - Fee Related DE69507674T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23740994 1994-09-30

Publications (2)

Publication Number Publication Date
DE69507674D1 true DE69507674D1 (de) 1999-03-18
DE69507674T2 DE69507674T2 (de) 1999-06-10

Family

ID=17014956

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507674T Expired - Fee Related DE69507674T2 (de) 1994-09-30 1995-09-26 Verfahren zum Herstellen eines flachen Kabelbaumes

Country Status (4)

Country Link
US (1) US5656115A (de)
EP (1) EP0704863B1 (de)
KR (1) KR100345936B1 (de)
DE (1) DE69507674T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19649972C2 (de) * 1996-11-22 2002-11-07 Siemens Ag Verfahren zur Herstellung eines Leitungssatzes für Kraftfahrzeuge
CA2518614A1 (en) * 2002-04-24 2003-11-06 Mineral Lassen Llc Manufacturing method for a wireless communication device and manufacturing apparatus
JP4036217B2 (ja) * 2004-10-27 2008-01-23 セイコーエプソン株式会社 測位システム、端末装置、測位装置及びプログラム
NL1029954C2 (nl) * 2005-09-14 2007-03-15 Assembleon Nv Werkwijze voor het verwarmen van een strookvormige drager alsmede een dergelijke inrichting.
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
FI121592B (fi) 2008-03-26 2011-01-31 Tecnomar Oy Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti
ES2386614T3 (es) * 2010-02-06 2012-08-23 Textilma Ag Dispositivo de montaje para aplicar un módulo de chip RFID sobre un sustrato, especialmente una etiqueta
ES2735236T3 (es) 2010-06-14 2019-12-17 Avery Dennison Corp Método y aparato de fabricar etiquetas y marbetes de identificación por radiofrecuencia en tiradas cortas
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
US9038918B2 (en) * 2012-12-13 2015-05-26 Avery Dennison Corporation Antenna for RFID device and method for making the same
DE102014102519A1 (de) 2014-02-26 2015-08-27 Schreiner Group Gmbh & Co. Kg Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat
DE102018215081A1 (de) * 2018-09-05 2020-03-05 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Herstellen eines verdrillten Folienleiters für ein Kraftfahrzeug und verdrillter Folienleiter für ein Kraftfahrzeug
CN113517660B (zh) * 2021-04-27 2022-06-17 广西佳仕运网络科技有限公司 一种计算机网络工程布线施工装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4197154A (en) * 1978-04-27 1980-04-08 Bernal Rotary Systems, Inc. Apparatus for applying strip material to a backing web
JP2674820B2 (ja) * 1989-01-31 1997-11-12 ソニーケミカル株式会社 自動専用フラットケーブルの製造方法
JPH0668722A (ja) 1992-08-24 1994-03-11 Mitsubishi Cable Ind Ltd フラット配線体の製法
JP3387557B2 (ja) 1993-06-16 2003-03-17 三菱電線工業株式会社 打抜残材の除去方法

Also Published As

Publication number Publication date
KR100345936B1 (ko) 2002-11-16
KR960012046A (ko) 1996-04-20
EP0704863B1 (de) 1999-02-03
DE69507674T2 (de) 1999-06-10
US5656115A (en) 1997-08-12
EP0704863A1 (de) 1996-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee