DE69504519D1 - Drei-achsen verpackungsanordnung - Google Patents

Drei-achsen verpackungsanordnung

Info

Publication number
DE69504519D1
DE69504519D1 DE69504519T DE69504519T DE69504519D1 DE 69504519 D1 DE69504519 D1 DE 69504519D1 DE 69504519 T DE69504519 T DE 69504519T DE 69504519 T DE69504519 T DE 69504519T DE 69504519 D1 DE69504519 D1 DE 69504519D1
Authority
DE
Germany
Prior art keywords
packing arrangement
axis packing
axis
arrangement
packing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69504519T
Other languages
English (en)
Other versions
DE69504519T2 (de
Inventor
Bharat Pant
Richard Spielberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Application granted granted Critical
Publication of DE69504519D1 publication Critical patent/DE69504519D1/de
Publication of DE69504519T2 publication Critical patent/DE69504519T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/0206—Three-component magnetometers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Magnetic Variables (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
DE69504519T 1994-07-20 1995-07-20 Drei-achsen verpackungsanordnung Expired - Lifetime DE69504519T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/277,847 US6169254B1 (en) 1994-07-20 1994-07-20 Three axis sensor package on flexible substrate
PCT/US1995/009183 WO1996002848A1 (en) 1994-07-20 1995-07-20 Three axis packaging

Publications (2)

Publication Number Publication Date
DE69504519D1 true DE69504519D1 (de) 1998-10-08
DE69504519T2 DE69504519T2 (de) 1999-02-11

Family

ID=23062609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69504519T Expired - Lifetime DE69504519T2 (de) 1994-07-20 1995-07-20 Drei-achsen verpackungsanordnung

Country Status (4)

Country Link
US (1) US6169254B1 (de)
EP (1) EP0771423B1 (de)
DE (1) DE69504519T2 (de)
WO (1) WO1996002848A1 (de)

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GB9928025D0 (en) * 1999-11-27 2000-01-26 Vlsi Vision Ltd Improvements in or relating to image sensor devices and endoscopes incorporationg improved image sensor devices
US6497035B1 (en) * 1999-12-06 2002-12-24 Hr Textron, Inc. Hall position sensor
GB2358476B (en) * 2000-01-21 2004-06-23 Siemens Metering Ltd Improvements in or relating to metering
DE20018538U1 (de) 2000-10-27 2002-03-07 Mannesmann Vdo Ag Sensormodul
US6504366B2 (en) * 2001-03-29 2003-01-07 Honeywell International Inc. Magnetometer package
TWI255346B (en) * 2002-07-29 2006-05-21 Yamaha Corp Manufacturing method for magnetic sensor and lead frame therefor
US6770813B1 (en) * 2003-05-16 2004-08-03 Visteon Global Technologies, Inc. Mountable microelectronic package
WO2005026761A1 (en) 2003-09-16 2005-03-24 Koninklijke Philips Electronics N.V. A method of manufacturing an electronic device and an electronic device
US6933716B2 (en) * 2003-11-25 2005-08-23 Wolff Controls Corporation Minimized cross-section sensor package
JP2005223221A (ja) * 2004-02-06 2005-08-18 Denso Corp 磁気検出装置およびその製造方法
US7126330B2 (en) * 2004-06-03 2006-10-24 Honeywell International, Inc. Integrated three-dimensional magnetic sensing device and method to fabricate an integrated three-dimensional magnetic sensing device
JP2006214898A (ja) * 2005-02-04 2006-08-17 Seiko Epson Corp 圧電デバイス及び電子機器
JP4977378B2 (ja) * 2006-02-23 2012-07-18 山梨日本電気株式会社 磁気センサ、回転検出装置及び位置検出装置
FR2903812B1 (fr) * 2006-07-13 2008-10-31 Commissariat Energie Atomique Circuit integre reparti sur au moins deux plans non paralleles et son procede de realisation
US20090072823A1 (en) * 2007-09-17 2009-03-19 Honeywell International Inc. 3d integrated compass package
ITMI20090972A1 (it) * 2009-06-03 2010-12-04 Consiglio Naz Delle Ricerche Infm Istituto Dispositivo sensore magnetico triassiale integrato.
US8703543B2 (en) * 2009-07-14 2014-04-22 Honeywell International Inc. Vertical sensor assembly method
ES2654145T3 (es) 2009-08-03 2018-02-12 Dune Medical Devices Ltd. Sensor electromagnético para su uso en mediciones en un sujeto
CN102770085B (zh) * 2009-08-03 2015-06-10 沙丘医疗设备有限公司 手术工具
US9488699B2 (en) * 2012-04-26 2016-11-08 Honeywell International Inc. Devices for sensing current
RU2513655C1 (ru) * 2012-11-12 2014-04-20 Федеральное государственное бюджетное учреждение науки Институт физики полупроводников им. А.В. Ржанова Сибирского отделения Российской академии наук (ИФП СО РАН) Датчик магнитного поля и способ его изготовления
JP2014229761A (ja) * 2013-05-23 2014-12-08 株式会社東芝 電子機器
WO2015030872A1 (en) 2013-08-30 2015-03-05 Honeywell International Inc. Stray magnetic field rejection for in-hole current-measurement systems
US11647678B2 (en) * 2016-08-23 2023-05-09 Analog Devices International Unlimited Company Compact integrated device packages
US10629574B2 (en) 2016-10-27 2020-04-21 Analog Devices, Inc. Compact integrated device packages
US10697800B2 (en) 2016-11-04 2020-06-30 Analog Devices Global Multi-dimensional measurement using magnetic sensors and related systems, methods, and integrated circuits
US10782114B2 (en) 2016-12-20 2020-09-22 Boston Scientific Scimed Inc. Hybrid navigation sensor
US11058321B2 (en) * 2016-12-20 2021-07-13 Boston Scientific Scimed Inc. Current driven sensor for magnetic navigation
WO2018145010A1 (en) * 2017-02-06 2018-08-09 Boston Scientific Scimed Inc. Sensor assemblies for electromagnetic navigation systems
US10835151B2 (en) 2017-02-06 2020-11-17 Boston Scientific Scimed Inc. Sensor assemblies for electromagnetic navigation systems
JP6607896B2 (ja) * 2017-09-20 2019-11-20 矢崎総業株式会社 配索材の導体接続構造
US11141567B2 (en) * 2018-01-16 2021-10-12 Boston Scientific Scimed Inc. Electrical arrangements for sensor assemblies in electromagnetic navigation systems
US11628275B2 (en) 2018-01-31 2023-04-18 Analog Devices, Inc. Electronic devices

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Also Published As

Publication number Publication date
DE69504519T2 (de) 1999-02-11
EP0771423A1 (de) 1997-05-07
EP0771423B1 (de) 1998-09-02
WO1996002848A1 (en) 1996-02-01
US6169254B1 (en) 2001-01-02

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Legal Events

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8364 No opposition during term of opposition