FR2903812B1 - Circuit integre reparti sur au moins deux plans non paralleles et son procede de realisation - Google Patents

Circuit integre reparti sur au moins deux plans non paralleles et son procede de realisation

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Publication number
FR2903812B1
FR2903812B1 FR0652966A FR0652966A FR2903812B1 FR 2903812 B1 FR2903812 B1 FR 2903812B1 FR 0652966 A FR0652966 A FR 0652966A FR 0652966 A FR0652966 A FR 0652966A FR 2903812 B1 FR2903812 B1 FR 2903812B1
Authority
FR
France
Prior art keywords
producing
integrated circuit
same
circuit distributed
parallel plans
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0652966A
Other languages
English (en)
Other versions
FR2903812A1 (fr
Inventor
Jean Baptiste Albertini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0652966A priority Critical patent/FR2903812B1/fr
Priority to EP07823279A priority patent/EP2041022A1/fr
Priority to US12/373,444 priority patent/US20090315129A1/en
Priority to PCT/FR2007/001188 priority patent/WO2008006976A1/fr
Priority to JP2009518927A priority patent/JP2009543086A/ja
Publication of FR2903812A1 publication Critical patent/FR2903812A1/fr
Application granted granted Critical
Publication of FR2903812B1 publication Critical patent/FR2903812B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G—PHYSICS
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    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Hall/Mr Elements (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Magnetic Variables (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR0652966A 2006-07-13 2006-07-13 Circuit integre reparti sur au moins deux plans non paralleles et son procede de realisation Expired - Fee Related FR2903812B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0652966A FR2903812B1 (fr) 2006-07-13 2006-07-13 Circuit integre reparti sur au moins deux plans non paralleles et son procede de realisation
EP07823279A EP2041022A1 (fr) 2006-07-13 2007-07-11 Circuit intégré réparti sur au moins deux plans non parallèles et son procédé de réalisation
US12/373,444 US20090315129A1 (en) 2006-07-13 2007-07-11 Integrated circuit distributed over at least two non-parallel planes and its method of production
PCT/FR2007/001188 WO2008006976A1 (fr) 2006-07-13 2007-07-11 Circuit intégré réparti sur au moins deux plans non parallèles et son procédé de réalisation
JP2009518927A JP2009543086A (ja) 2006-07-13 2007-07-11 少なくとも２つの非平行平面上に分散配置された集積回路およびその製造方法

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FR0652966A FR2903812B1 (fr) 2006-07-13 2006-07-13 Circuit integre reparti sur au moins deux plans non paralleles et son procede de realisation

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FR2903812B1 true FR2903812B1 (fr) 2008-10-31

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EP (1) EP2041022A1 (fr)
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FR2928006B1 (fr) * 2008-02-26 2011-03-04 Univ Claude Bernard Lyon Procede de fabrication d'un capteur de champ magnetique et capteur de champ magnetique obtenu
DE102008042800A1 (de) * 2008-10-13 2010-04-15 Robert Bosch Gmbh Vorrichtung zur Messung von Richtung und/oder Stärke eines Magnetfeldes
DE102008062672A1 (de) * 2008-12-17 2010-07-15 Siemens Aktiengesellschaft Verfahren und Vorrichtung zur Durchführung eines Vergleichs zwischen einer linken und einer rechten Gehirnhälfte eines Patienten
US8525514B2 (en) * 2010-03-19 2013-09-03 Memsic, Inc. Magnetometer
KR101250559B1 (ko) * 2011-01-06 2013-04-03 한국표준과학연구원 누설자속 측정에 의한 압력용기의 비파괴 탐상장치
CN102385043B (zh) * 2011-08-30 2013-08-21 江苏多维科技有限公司 Mtj三轴磁场传感器及其封装方法
CN102426344B (zh) * 2011-08-30 2013-08-21 江苏多维科技有限公司 三轴磁场传感器
WO2013145284A1 (fr) * 2012-03-30 2013-10-03 株式会社フジクラ Capteur de courant
KR20180072313A (ko) * 2016-12-21 2018-06-29 에스케이하이닉스 주식회사 커패시턴스 센싱 회로

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US5558091A (en) * 1993-10-06 1996-09-24 Biosense, Inc. Magnetic determination of position and orientation
US6169254B1 (en) * 1994-07-20 2001-01-02 Honeywell, Inc. Three axis sensor package on flexible substrate
US5446307A (en) * 1994-11-04 1995-08-29 The United States Of America As Represented By The Secretary Of The Army Microelectronic 3D bipolar magnetotransistor magnetometer
GB9507930D0 (en) * 1995-04-19 1995-06-14 Smiths Industries Plc Inertial sensor assemblies
US6201387B1 (en) * 1997-10-07 2001-03-13 Biosense, Inc. Miniaturized position sensor having photolithographic coils for tracking a medical probe
US6859577B2 (en) * 2001-06-25 2005-02-22 Analog Devices Inc. Self assembled micro anti-stiction structure
US6583031B2 (en) * 2001-07-25 2003-06-24 Onix Microsystems, Inc. Method of making a MEMS element having perpendicular portion formed from substrate
FR2833106B1 (fr) * 2001-12-03 2005-02-25 St Microelectronics Sa Circuit integre comportant un composant auxiliaire, par exemple un composant passif ou un microsysteme electromecanique, dispose au-dessus d'une puce electronique, et procede de fabrication correspondant
US7126330B2 (en) * 2004-06-03 2006-10-24 Honeywell International, Inc. Integrated three-dimensional magnetic sensing device and method to fabricate an integrated three-dimensional magnetic sensing device
FR2880731B1 (fr) * 2005-01-11 2007-04-27 Commissariat Energie Atomique Composant, notamment avec des elements actifs, et procede de realisation d'un tel composant
DE102005023591A1 (de) * 2005-05-18 2006-11-30 Hl-Planar Technik Gmbh Feldmesseinrichtung, Messbaugruppe für eine Feldmesseinrichtung und Herstellungsmethode für eine Mehrzahl von Messbaugruppen

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EP2041022A1 (fr) 2009-04-01
US20090315129A1 (en) 2009-12-24
WO2008006976A8 (fr) 2009-03-19
JP2009543086A (ja) 2009-12-03
WO2008006976A1 (fr) 2008-01-17
FR2903812A1 (fr) 2008-01-18

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