DE69433514D1 - Drahtverbinder und zugehörige Methode - Google Patents

Drahtverbinder und zugehörige Methode

Info

Publication number
DE69433514D1
DE69433514D1 DE69433514T DE69433514T DE69433514D1 DE 69433514 D1 DE69433514 D1 DE 69433514D1 DE 69433514 T DE69433514 T DE 69433514T DE 69433514 T DE69433514 T DE 69433514T DE 69433514 D1 DE69433514 D1 DE 69433514D1
Authority
DE
Germany
Prior art keywords
wire connector
associated method
connector
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69433514T
Other languages
English (en)
Other versions
DE69433514T2 (de
Inventor
Kimiji Nishimaki
Takashi Kamiharako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5199237A external-priority patent/JP2914850B2/ja
Priority claimed from JP5199235A external-priority patent/JP2992427B2/ja
Priority claimed from JP19923693A external-priority patent/JP3009564B2/ja
Priority claimed from JP19923493A external-priority patent/JP3178567B2/ja
Application filed by Kaijo Corp filed Critical Kaijo Corp
Publication of DE69433514D1 publication Critical patent/DE69433514D1/de
Application granted granted Critical
Publication of DE69433514T2 publication Critical patent/DE69433514T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE1994633514 1993-07-16 1994-07-15 Drahtverbinder und zugehörige Methode Expired - Lifetime DE69433514T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP19923493 1993-07-16
JP5199237A JP2914850B2 (ja) 1993-07-16 1993-07-16 ワイヤボンディング装置及びその方法
JP5199235A JP2992427B2 (ja) 1993-07-16 1993-07-16 ワイヤボンディング装置及びその方法
JP19923693A JP3009564B2 (ja) 1993-07-16 1993-07-16 ワイヤボンディング装置及びその方法
JP19923693 1993-07-16
JP19923793 1993-07-16
JP19923493A JP3178567B2 (ja) 1993-07-16 1993-07-16 ワイヤボンディング装置及びその方法
JP19923593 1993-07-16

Publications (2)

Publication Number Publication Date
DE69433514D1 true DE69433514D1 (de) 2004-03-04
DE69433514T2 DE69433514T2 (de) 2004-11-11

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365292B2 (ja) * 2004-09-02 2009-11-18 株式会社カイジョー ワイヤボンディングにおけるボール圧着厚の測定方法
JP5873611B2 (ja) * 2007-03-13 2016-03-01 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディング用に目標アイポイントを教示する方法およびそれに関連した半導体処理操作
WO2015088658A2 (en) * 2013-12-11 2015-06-18 Fairchild Semiconductor Corporation Integrated wire bonder and 3d measurement system with defect rejection
CN108067759A (zh) * 2016-11-16 2018-05-25 上海涛创自动化科技有限公司 一种汇流条自动上料焊接一体设备
CN114566456B (zh) * 2022-04-29 2022-08-23 深圳市铨天科技有限公司 一种多层堆叠存储芯片的封装设备
CN117984001A (zh) * 2024-04-03 2024-05-07 宁波尚进自动化科技有限公司 焊接方法、装置、焊接设备、电子设备及存储介质

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789233A (en) * 1980-11-25 1982-06-03 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS5867033A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ワイヤボンデイング方法
US4445633A (en) * 1982-02-11 1984-05-01 Rockwell International Corporation Automatic bonder for forming wire interconnections of automatically controlled configuration
JPH065684B2 (ja) * 1986-10-08 1994-01-19 サンケン電気株式会社 ボンディング装置
US4812614A (en) * 1987-02-26 1989-03-14 Industrial Technology Research Institute Machine vision seam tracking method and apparatus for welding robots
US5269452A (en) * 1992-11-12 1993-12-14 Northern Telecom Limited Method and apparatus for wirebonding
JP2823454B2 (ja) * 1992-12-03 1998-11-11 株式会社東芝 ワイヤボンディング装置

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Publication number Publication date
EP0634791A2 (de) 1995-01-18
EP0634791B1 (de) 2004-01-28
DE69433514T2 (de) 2004-11-11
EP0634791A3 (de) 1995-09-13

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