DE69428410T2 - Optische Detektoren und Quellen mit integrierten holographischen optischen Elementen für optoelektronische Verbindungen - Google Patents

Optische Detektoren und Quellen mit integrierten holographischen optischen Elementen für optoelektronische Verbindungen

Info

Publication number
DE69428410T2
DE69428410T2 DE69428410T DE69428410T DE69428410T2 DE 69428410 T2 DE69428410 T2 DE 69428410T2 DE 69428410 T DE69428410 T DE 69428410T DE 69428410 T DE69428410 T DE 69428410T DE 69428410 T2 DE69428410 T2 DE 69428410T2
Authority
DE
Germany
Prior art keywords
sources
optical elements
integrated holographic
detectors
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69428410T
Other languages
English (en)
Other versions
DE69428410D1 (de
Inventor
Ronald Kaneshiro
Joseph Straznicky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE69428410D1 publication Critical patent/DE69428410D1/de
Application granted granted Critical
Publication of DE69428410T2 publication Critical patent/DE69428410T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
DE69428410T 1993-11-09 1994-11-03 Optische Detektoren und Quellen mit integrierten holographischen optischen Elementen für optoelektronische Verbindungen Expired - Fee Related DE69428410T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15064893A 1993-11-09 1993-11-09

Publications (2)

Publication Number Publication Date
DE69428410D1 DE69428410D1 (de) 2001-10-31
DE69428410T2 true DE69428410T2 (de) 2002-05-02

Family

ID=22535436

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69428410T Expired - Fee Related DE69428410T2 (de) 1993-11-09 1994-11-03 Optische Detektoren und Quellen mit integrierten holographischen optischen Elementen für optoelektronische Verbindungen

Country Status (4)

Country Link
US (1) US5513021A (de)
EP (1) EP0653654B1 (de)
JP (1) JP3539583B2 (de)
DE (1) DE69428410T2 (de)

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US5237434A (en) * 1991-11-05 1993-08-17 Mcnc Microelectronic module having optical and electrical interconnects
CN1104650C (zh) * 1994-06-28 2003-04-02 马西亚斯·布迪尔 全息神经芯片
DE19523097A1 (de) * 1995-06-26 1997-01-02 Abb Research Ltd Informationsverteiler
US5706114A (en) * 1995-10-03 1998-01-06 Erteza; Ireena A. Polyhedral integrated and free space optical interconnection
US5790728A (en) * 1996-06-28 1998-08-04 Motorola, Inc. Optical coupling component and method of making the same
US6005692A (en) * 1997-05-29 1999-12-21 Stahl; Thomas D. Light-emitting diode constructions
WO1999062126A1 (en) * 1998-05-29 1999-12-02 Stahl Thomas D Pixel composed of light emitting diodes optically coupled to a fiber optic core via a holographic layer
US6453377B1 (en) * 1998-06-16 2002-09-17 Micron Technology, Inc. Computer including optical interconnect, memory unit, and method of assembling a computer
JP3785820B2 (ja) 1998-08-03 2006-06-14 豊田合成株式会社 発光装置
US6845184B1 (en) 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US6785447B2 (en) 1998-10-09 2004-08-31 Fujitsu Limited Single and multilayer waveguides and fabrication process
US6611635B1 (en) 1998-10-09 2003-08-26 Fujitsu Limited Opto-electronic substrates with electrical and optical interconnections and methods for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6690845B1 (en) 1998-10-09 2004-02-10 Fujitsu Limited Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making
US6343171B1 (en) 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
US6706546B2 (en) 1998-10-09 2004-03-16 Fujitsu Limited Optical reflective structures and method for making
JP2001274528A (ja) 2000-01-21 2001-10-05 Fujitsu Ltd 薄膜デバイスの基板間転写方法
AU2001273424A1 (en) * 2000-07-18 2002-01-30 Intel Corporation Flip-chip mounted integrated optic receivers and transmitters
US6754406B2 (en) * 2002-01-22 2004-06-22 Agilent Technologies, Inc. Passively aligned fiber optical engine for parallel optics interconnect devices
US6661943B2 (en) * 2002-01-30 2003-12-09 Intel Corporation Fiber-free optical interconnect system for chip-to-chip signaling
FR2836236B1 (fr) * 2002-02-21 2004-09-17 Framatome Connectors Int Dispositif de couplage optoelectronique perfectionne
US7106973B2 (en) * 2002-08-13 2006-09-12 Lightpointe Communications, Inc. Apparatus and method for use in free-space optical communication comprising optically aligned components integrated on circuit boards
US6892007B2 (en) * 2002-09-16 2005-05-10 Agilent Technologies, Inc. Monitoring optical transmitter signals
US20040120717A1 (en) * 2002-12-18 2004-06-24 Lightpointe Communications, Inc. Extended source free-space optical communication system
US7274815B1 (en) * 2003-10-09 2007-09-25 Sandia Corporation Parallel phase-sensitive three-dimensional imaging camera
US7058247B2 (en) * 2003-12-17 2006-06-06 International Business Machines Corporation Silicon carrier for optical interconnect modules
US7400790B2 (en) * 2004-11-03 2008-07-15 Hewlett-Packard Development Company, L.P. Optical connections and methods of forming optical connections
US7118285B2 (en) * 2004-11-03 2006-10-10 Hewlett-Packard Development Company, L.P. Optical connections and methods of forming optical connections
US7344315B2 (en) * 2004-11-03 2008-03-18 Hewlett-Packard Development Company, L.P. Optical connections and methods of forming optical connections
US20060093271A1 (en) * 2004-11-03 2006-05-04 Fenwick David M Optical connections and methods of forming optical connections
JP2019134019A (ja) * 2018-01-30 2019-08-08 セイコーエプソン株式会社 発光装置
TWI770742B (zh) * 2020-09-28 2022-07-11 義明科技股份有限公司 光感測器

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* Cited by examiner, † Cited by third party
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US5159700A (en) * 1984-01-16 1992-10-27 Texas Instruments Incorporated Substrate with optical communication systems between chips mounted thereon and monolithic integration of optical I/O on silicon substrates
US4711997A (en) * 1986-11-14 1987-12-08 American Telephone And Telegraph Company, At&T Bell Laboratories Optical interconnection of devices on chips
US5071232A (en) * 1989-08-01 1991-12-10 Ricoh Company, Ltd. Optical deflection element and space optical matrix switching device
US4946253A (en) * 1989-10-16 1990-08-07 Arizona Board Of Regents For And On Behalf Of The University Of Arizona Reconfigurable substrate-mode holographic interconnect apparatus and method
US5061027A (en) * 1990-09-04 1991-10-29 Motorola, Inc. Solder-bump attached optical interconnect structure utilizing holographic elements and method of making same
US5101460A (en) * 1990-09-04 1992-03-31 Motorola, Inc. Simultaneous bidirectional optical interconnect
US5073041A (en) * 1990-11-13 1991-12-17 Bell Communications Research, Inc. Integrated assembly comprising vertical cavity surface-emitting laser array with Fresnel microlenses
US5159473A (en) * 1991-02-27 1992-10-27 University Of North Carolina Apparatus and method for programmable optical interconnections
US5237434A (en) * 1991-11-05 1993-08-17 Mcnc Microelectronic module having optical and electrical interconnects

Also Published As

Publication number Publication date
DE69428410D1 (de) 2001-10-31
EP0653654A1 (de) 1995-05-17
JPH07193535A (ja) 1995-07-28
EP0653654B1 (de) 2001-09-26
JP3539583B2 (ja) 2004-07-07
US5513021A (en) 1996-04-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AVAGO TECHNOLOGIES GENERAL IP ( SINGAPORE) PTE. LT

8339 Ceased/non-payment of the annual fee