DE69423288D1 - Verfahren zur Ankopplung einer Prüfanordnung an einen elektrischen Baustein - Google Patents

Verfahren zur Ankopplung einer Prüfanordnung an einen elektrischen Baustein

Info

Publication number
DE69423288D1
DE69423288D1 DE69423288T DE69423288T DE69423288D1 DE 69423288 D1 DE69423288 D1 DE 69423288D1 DE 69423288 T DE69423288 T DE 69423288T DE 69423288 T DE69423288 T DE 69423288T DE 69423288 D1 DE69423288 D1 DE 69423288D1
Authority
DE
Germany
Prior art keywords
coupling
electrical module
test arrangement
test
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69423288T
Other languages
English (en)
Other versions
DE69423288T2 (de
Inventor
Robert H Wardwell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69423288D1 publication Critical patent/DE69423288D1/de
Application granted granted Critical
Publication of DE69423288T2 publication Critical patent/DE69423288T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425Test clips, e.g. for IC's
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00Coupling parts supported only by co-operation with counterpart
    • H01R31/06Intermediate parts for linking two coupling parts, e.g. adapter

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69423288T 1993-10-26 1994-10-25 Verfahren zur Ankopplung einer Prüfanordnung an einen elektrischen Baustein Expired - Fee Related DE69423288T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/143,005 US5701086A (en) 1993-10-26 1993-10-26 Connecting test equipment to adjacent legs of an IC or the like by interdigitating conductive wedges with the legs

Publications (2)

Publication Number Publication Date
DE69423288D1 true DE69423288D1 (de) 2000-04-13
DE69423288T2 DE69423288T2 (de) 2000-11-30

Family

ID=22502167

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69423288T Expired - Fee Related DE69423288T2 (de) 1993-10-26 1994-10-25 Verfahren zur Ankopplung einer Prüfanordnung an einen elektrischen Baustein

Country Status (4)

Country Link
US (1) US5701086A (de)
EP (1) EP0650064B1 (de)
JP (1) JPH07191090A (de)
DE (1) DE69423288T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5507652A (en) * 1995-02-17 1996-04-16 Hewlett-Packard Company Wedge connector for integrated circuits
US5923177A (en) * 1997-03-27 1999-07-13 Hewlett-Packard Company Portable wedge probe for perusing signals on the pins of an IC
US6437587B1 (en) * 1999-11-04 2002-08-20 Agilent Technologies, Inc. ICT test fixture for fine pitch testing
US6518780B1 (en) * 2000-07-31 2003-02-11 Lecroy Corporation Electrical test probe wedge tip
IL143980A0 (en) * 2001-06-25 2002-04-21 Imarad Imaging Systems Ltd Three dimensional radiation detection
US7317312B1 (en) 2003-02-14 2008-01-08 Lecroy Corporation Guide for tip to transmission path contact
US7173439B1 (en) 2003-02-14 2007-02-06 Lecroy Corporation Guide for tip to transmission path contact
CN107580681B (zh) * 2015-05-07 2020-06-19 泰克诺探头公司 尤其用于减小节距的应用的、具有竖直探针的测试头
DE102015121618A1 (de) * 2015-12-11 2017-06-14 Phoenix Contact Gmbh & Co. Kg Schleifenbrücke zum durchschleifen einer anzahl von elektrischen signalen
KR102146290B1 (ko) * 2019-04-04 2020-08-21 황동원 반도체 소자 테스트용 lidless BGA 소켓장치
CN114994498B (zh) * 2022-05-17 2023-03-10 珠海精实测控技术股份有限公司 一种弯曲pcb板的功能测试装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001679A (en) * 1975-02-19 1977-01-04 Cargile William P Wedge action electrical test probe
ZA812893B (en) * 1980-05-12 1982-05-26 Ncr Co Integrated circuit package having a plurality of pins for providing external electrical connections
DE3446622A1 (de) * 1984-12-20 1986-06-26 Krone Gmbh, 1000 Berlin Steckereinsatz fuer stecker mit hoher steckhaeufigkeit
US5049813A (en) * 1987-04-17 1991-09-17 Everett/Charles Contact Products, Inc. Testing of integrated circuit devices on loaded printed circuit boards
US4835469A (en) * 1987-07-24 1989-05-30 John Fluke Mfg. Co., Inc. Integrated circuit clip for circuit analyzer
US4833404A (en) * 1987-10-02 1989-05-23 The United States Of America As Represented By The United States Department Of Energy Test probe for surface mounted leadless chip carrier
GB2236630A (en) * 1989-10-02 1991-04-10 Tektronix Inc Twist lock probe tip
US5166609A (en) * 1990-05-24 1992-11-24 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
US5156649A (en) * 1991-11-27 1992-10-20 Tektronix, Inc. Test clip adapter for integrated circuit device
US5345364A (en) * 1993-08-18 1994-09-06 Minnesota Mining And Manufacturing Company Edge-connecting printed circuit board
US5463324A (en) * 1993-10-26 1995-10-31 Hewlett-Packard Company Probe with contacts that interdigitate with and wedge between adjacent legs of an IC or the like
US5391082A (en) * 1993-10-26 1995-02-21 Airhart; Durwood Conductive wedges for interdigitating with adjacent legs of an IC or the like

Also Published As

Publication number Publication date
EP0650064A2 (de) 1995-04-26
EP0650064B1 (de) 2000-03-08
DE69423288T2 (de) 2000-11-30
JPH07191090A (ja) 1995-07-28
EP0650064A3 (de) 1996-01-03
US5701086A (en) 1997-12-23

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee