DE69219042D1 - Verfahren zur elektrischen Verbindung - Google Patents

Verfahren zur elektrischen Verbindung

Info

Publication number
DE69219042D1
DE69219042D1 DE69219042T DE69219042T DE69219042D1 DE 69219042 D1 DE69219042 D1 DE 69219042D1 DE 69219042 T DE69219042 T DE 69219042T DE 69219042 T DE69219042 T DE 69219042T DE 69219042 D1 DE69219042 D1 DE 69219042D1
Authority
DE
Germany
Prior art keywords
electrical connection
connection method
electrical
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69219042T
Other languages
English (en)
Other versions
DE69219042T2 (de
Inventor
Tatsuo Chiyonobu
Kaoru Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22926991A external-priority patent/JPH0574503A/ja
Priority claimed from JP12640692A external-priority patent/JPH05326098A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69219042D1 publication Critical patent/DE69219042D1/de
Publication of DE69219042T2 publication Critical patent/DE69219042T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
DE69219042T 1991-09-10 1992-09-01 Verfahren zur elektrischen Verbindung Expired - Fee Related DE69219042T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22926991A JPH0574503A (ja) 1991-09-10 1991-09-10 電気的接続方法
JP12640692A JPH05326098A (ja) 1992-05-19 1992-05-19 端子の電気的接続方法

Publications (2)

Publication Number Publication Date
DE69219042D1 true DE69219042D1 (de) 1997-05-22
DE69219042T2 DE69219042T2 (de) 1997-07-24

Family

ID=26462603

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69219042T Expired - Fee Related DE69219042T2 (de) 1991-09-10 1992-09-01 Verfahren zur elektrischen Verbindung

Country Status (4)

Country Link
US (1) US5417362A (de)
EP (1) EP0532215B1 (de)
CA (1) CA2077286C (de)
DE (1) DE69219042T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
DE19842124A1 (de) * 1998-09-15 2000-03-23 Moeller Gmbh Kontaktanordnung elektrisch leitfähiger Polymere
US7258839B2 (en) * 2001-12-21 2007-08-21 Cytonome, Inc. Temperature controlled microfabricated two-pin liquid sample dispensing system
US6740544B2 (en) * 2002-05-14 2004-05-25 Freescale Semiconductor, Inc. Solder compositions for attaching a die to a substrate
US7779638B2 (en) * 2005-12-27 2010-08-24 Intel Corporation Localized microelectronic cooling apparatuses and associated methods and systems
DK2122344T3 (da) 2007-02-20 2019-07-15 Oxford Nanopore Tech Ltd Lipiddobbeltlags-sensorsystem
DE102007053379A1 (de) * 2007-11-09 2009-05-20 Moeller Gmbh Flüssigmetallpaste
GB0724736D0 (en) 2007-12-19 2008-01-30 Oxford Nanolabs Ltd Formation of layers of amphiphilic molecules
US9728868B1 (en) 2010-05-05 2017-08-08 Cree Fayetteville, Inc. Apparatus having self healing liquid phase power connects and method thereof
GB201202519D0 (en) 2012-02-13 2012-03-28 Oxford Nanopore Tech Ltd Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules
DE102012213505A1 (de) * 2012-07-31 2014-02-06 Tyco Electronics Amp Gmbh Schicht für ein elektrisches Kontaktelement, Schichtsystem und Verfahren zur Herstellung einer Schicht
GB201313121D0 (en) 2013-07-23 2013-09-04 Oxford Nanopore Tech Ltd Array of volumes of polar medium
GB201418512D0 (en) 2014-10-17 2014-12-03 Oxford Nanopore Tech Ltd Electrical device with detachable components
EP3208028B1 (de) * 2016-02-19 2021-04-07 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren und vorrichtung zur reversiblen befestigung eines phasenwechselmetalls an einem objekt
US10672530B2 (en) 2016-02-29 2020-06-02 Liquid Wire Inc. Deformable conductors and related sensors, antennas and multiplexed systems
US11156509B2 (en) 2016-02-29 2021-10-26 Liquid Wire Inc. Sensors with deformable conductors and selective deformation
GB201611770D0 (en) 2016-07-06 2016-08-17 Oxford Nanopore Tech Microfluidic device
AU2020239385A1 (en) 2019-03-12 2021-08-26 Oxford Nanopore Technologies Plc Nanopore sensing device and methods of operation and of forming it
CN113745870B (zh) * 2021-08-24 2022-10-25 西安交通大学 一种中心载流导杆及高压输电设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3337309A (en) * 1963-10-11 1967-08-22 Daniel W Lewis Thermoelectric unit comprising intimate layers of gallium-indium alloy and alumina
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
JPS57123673A (en) * 1981-01-26 1982-08-02 Nippon Telegraph & Telephone Microsocket
JPS58130540A (ja) * 1982-01-29 1983-08-04 Hitachi Ltd 半導体素子実装構造
US4615479A (en) * 1985-02-21 1986-10-07 Asahi Glass Company Ltd. Method for soldering an electrical product
DE69022605T2 (de) * 1989-02-28 1996-03-21 Fujitsu Ltd Elektrische Verbindungsvorrichtung.
JPH02260384A (ja) * 1989-03-31 1990-10-23 Japan Radio Co Ltd 混成集積回路の接合方法
US4966142A (en) * 1989-06-30 1990-10-30 Trustees Of Boston University Method for electrically joining superconductors to themselves, to normal conductors, and to semi-conductors
US5007163A (en) * 1990-04-18 1991-04-16 International Business Machines Corporation Non-destructure method of performing electrical burn-in testing of semiconductor chips

Also Published As

Publication number Publication date
EP0532215A2 (de) 1993-03-17
DE69219042T2 (de) 1997-07-24
US5417362A (en) 1995-05-23
CA2077286C (en) 1996-08-06
EP0532215B1 (de) 1997-04-16
EP0532215A3 (en) 1993-10-20
CA2077286A1 (en) 1993-03-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee