DE69417640T2 - Verbesserter Stecker ohne Stifte - Google Patents

Verbesserter Stecker ohne Stifte

Info

Publication number
DE69417640T2
DE69417640T2 DE1994617640 DE69417640T DE69417640T2 DE 69417640 T2 DE69417640 T2 DE 69417640T2 DE 1994617640 DE1994617640 DE 1994617640 DE 69417640 T DE69417640 T DE 69417640T DE 69417640 T2 DE69417640 T2 DE 69417640T2
Authority
DE
Germany
Prior art keywords
pins
improved connector
connector
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1994617640
Other languages
English (en)
Other versions
DE69417640D1 (de
Inventor
Juan Ayala-Esquilin
Brian Samuel Beaman
Rudolf Adriaan Haring
James Lupton Hedrick
Da-Yuan Shih
George Frederick Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69417640D1 publication Critical patent/DE69417640D1/de
Publication of DE69417640T2 publication Critical patent/DE69417640T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
DE1994617640 1993-07-06 1994-06-28 Verbesserter Stecker ohne Stifte Expired - Lifetime DE69417640T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/088,016 US5441690A (en) 1993-07-06 1993-07-06 Process of making pinless connector

Publications (2)

Publication Number Publication Date
DE69417640D1 DE69417640D1 (de) 1999-05-12
DE69417640T2 true DE69417640T2 (de) 1999-12-02

Family

ID=22208695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994617640 Expired - Lifetime DE69417640T2 (de) 1993-07-06 1994-06-28 Verbesserter Stecker ohne Stifte

Country Status (4)

Country Link
US (1) US5441690A (de)
EP (1) EP0633579B1 (de)
JP (1) JP2603442B2 (de)
DE (1) DE69417640T2 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054651A (en) * 1996-06-21 2000-04-25 International Business Machines Corporation Foamed elastomers for wafer probing applications and interposer connectors
DE19544641B4 (de) * 1994-12-05 2005-08-25 Eads Deutschland Gmbh Solarzellen-Verbinder für Raumfahrt-Solargeneratoren
US5729150A (en) 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US5726211A (en) * 1996-03-21 1998-03-10 International Business Machines Corporation Process for making a foamed elastometric polymer
US5804607A (en) * 1996-03-21 1998-09-08 International Business Machines Corporation Process for making a foamed elastomeric polymer
US5700844A (en) * 1996-04-09 1997-12-23 International Business Machines Corporation Process for making a foamed polymer
US6403226B1 (en) 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
US5890915A (en) * 1996-05-17 1999-04-06 Minnesota Mining And Manufacturing Company Electrical and thermal conducting structure with resilient conducting paths
US5846469A (en) * 1996-05-30 1998-12-08 Pacesetter, Inc. Method for manufacturing a defibrillation electrode
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6264476B1 (en) 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6805712B2 (en) * 2002-03-20 2004-10-19 Bausch & Lomb Incorporated Process for the production of polysiloxane-based polymeric compositions for use in medical devices
WO2003100445A2 (en) * 2002-05-23 2003-12-04 Cascade Microtech, Inc. Probe for testing a device under test
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7040902B2 (en) * 2003-03-24 2006-05-09 Che-Yu Li & Company, Llc Electrical contact
US7014479B2 (en) * 2003-03-24 2006-03-21 Che-Yu Li Electrical contact and connector and method of manufacture
US7029288B2 (en) * 2003-03-24 2006-04-18 Che-Yu Li Electrical contact and connector and method of manufacture
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US20040249825A1 (en) * 2003-06-05 2004-12-09 International Business Machines Corporation Administering devices with dynamic action lists
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US20060028220A1 (en) * 2004-07-21 2006-02-09 K&S Interconnect, Inc. Reinforced probes for testing semiconductor devices
US20090174423A1 (en) * 2004-07-21 2009-07-09 Klaerner Peter J Bond Reinforcement Layer for Probe Test Cards
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US10189100B2 (en) * 2008-07-29 2019-01-29 Pratt & Whitney Canada Corp. Method for wire electro-discharge machining a part
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8686307B2 (en) * 2009-01-15 2014-04-01 Covac Co., Ltd. Metal mesh contact and switch and method for producing the same
KR101418590B1 (ko) * 2012-08-09 2014-07-10 김형익 와이어드 컨택트 러버 및 그 제조방법
JP2015207433A (ja) * 2014-04-18 2015-11-19 矢崎総業株式会社 導電性弾性部材及びコネクタ
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
WO2019204686A1 (en) 2018-04-19 2019-10-24 The Research Foundation For The State University Of New York Solderless circuit connector

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3142655A (en) * 1960-03-23 1964-07-28 Gen Electric Organopolysiloxane compositions incorporating heat-age resistant rare earth compounds
US4265775A (en) * 1979-08-16 1981-05-05 International Business Machines Corporation Non-bleeding thixotropic thermally conductive material
JPS601895B2 (ja) * 1980-03-28 1985-01-18 ト−レ・シリコ−ン株式会社 難燃性シリコ−ンゴム組成物
US4680363A (en) * 1982-03-30 1987-07-14 General Electric Company One component silicone compositions with good bonding properties
US4461854A (en) * 1982-08-11 1984-07-24 General Electric Company Room temperature vulcanizable polysiloxane having a heat-activated catalyst
US4548451A (en) * 1984-04-27 1985-10-22 International Business Machines Corporation Pinless connector interposer and method for making the same
US4778950A (en) * 1985-07-22 1988-10-18 Digital Equipment Corporation Anisotropic elastomeric interconnecting system
JPS62149751A (ja) * 1985-12-25 1987-07-03 Dow Corning Kk 耐熱性ポリオルガノシロキサン組成物
JPH0658818B2 (ja) * 1987-10-09 1994-08-03 信越ポリマー株式会社 異方導電性コネクターおよびその製造方法
DE3801389A1 (de) * 1988-01-19 1989-07-27 Wacker Chemie Gmbh Unter abspaltung von alkoholen zu elastomeren vernetzbare organopolysiloxanmassen
DE3831478A1 (de) * 1988-09-16 1990-03-29 Wacker Chemie Gmbh Zu schwerbrennbaren und/oder kriechstromfesten sowie lichtbogenbestaendigen organopolysiloxanelastomeren vernetzbare massen
US4970098A (en) * 1990-04-18 1990-11-13 International Business Machines Corporation Coatings for hot roll fusers
US5086558A (en) * 1990-09-13 1992-02-11 International Business Machines Corporation Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer
US5122562A (en) * 1990-09-25 1992-06-16 General Electric Company Heat curable silicone rubber compositions
US5123849A (en) * 1990-11-15 1992-06-23 Amp Incorporated Conductive gel area array connector
CA2055303A1 (en) * 1990-12-03 1992-06-04 Michael K. J. Lee Curable random dimethylsiloxane/diphenylsiloxane copolymer compositions

Also Published As

Publication number Publication date
JPH0729625A (ja) 1995-01-31
EP0633579A3 (de) 1995-02-22
JP2603442B2 (ja) 1997-04-23
US5441690A (en) 1995-08-15
DE69417640D1 (de) 1999-05-12
EP0633579B1 (de) 1999-04-07
EP0633579A2 (de) 1995-01-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7