DE69415641D1 - Device for measuring thin film thickness - Google Patents

Device for measuring thin film thickness

Info

Publication number
DE69415641D1
DE69415641D1 DE69415641T DE69415641T DE69415641D1 DE 69415641 D1 DE69415641 D1 DE 69415641D1 DE 69415641 T DE69415641 T DE 69415641T DE 69415641 T DE69415641 T DE 69415641T DE 69415641 D1 DE69415641 D1 DE 69415641D1
Authority
DE
Germany
Prior art keywords
thin film
film thickness
measuring thin
measuring
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69415641T
Other languages
German (de)
Other versions
DE69415641T2 (en
Inventor
Moshe Finarov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nova Ltd
Original Assignee
Nova Measuring Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instruments Ltd filed Critical Nova Measuring Instruments Ltd
Application granted granted Critical
Publication of DE69415641D1 publication Critical patent/DE69415641D1/en
Publication of DE69415641T2 publication Critical patent/DE69415641T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
    • G01B11/065—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization using one or more discrete wavelengths
DE69415641T 1993-11-09 1994-10-17 Device for measuring thin film thickness Expired - Lifetime DE69415641T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL10754993A IL107549A (en) 1993-11-09 1993-11-09 Device for measuring the thickness of thin films

Publications (2)

Publication Number Publication Date
DE69415641D1 true DE69415641D1 (en) 1999-02-11
DE69415641T2 DE69415641T2 (en) 1999-07-29

Family

ID=11065433

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69415641T Expired - Lifetime DE69415641T2 (en) 1993-11-09 1994-10-17 Device for measuring thin film thickness

Country Status (5)

Country Link
US (2) US5517312A (en)
EP (1) EP0652415B1 (en)
JP (1) JP3697279B2 (en)
DE (1) DE69415641T2 (en)
IL (1) IL107549A (en)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6353477B1 (en) 1992-09-18 2002-03-05 J. A. Woollam Co. Inc. Regression calibrated spectroscopic rotating compensator ellipsometer system with pseudo-achromatic retarder system
IL107549A (en) * 1993-11-09 1996-01-31 Nova Measuring Instr Ltd Device for measuring the thickness of thin films
US5608526A (en) * 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US6734967B1 (en) * 1995-01-19 2004-05-11 Kla-Tencor Technologies Corporation Focused beam spectroscopic ellipsometry method and system
US6930813B1 (en) 2000-04-25 2005-08-16 J.A. Woollam Co. Inc. Spatial filter source beam conditioning in ellipsometer and the like systems
DE19537807C1 (en) * 1995-10-11 1997-02-06 Roland Man Druckmasch Method for determining layers
US5880465A (en) * 1996-05-31 1999-03-09 Kovex Corporation Scanning confocal microscope with oscillating objective lens
JP3459327B2 (en) * 1996-06-17 2003-10-20 理化学研究所 Method and apparatus for measuring layer thickness and refractive index of laminated structure
US5754291A (en) * 1996-09-19 1998-05-19 Molecular Dynamics, Inc. Micro-imaging system
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6278519B1 (en) 1998-01-29 2001-08-21 Therma-Wave, Inc. Apparatus for analyzing multi-layer thin film stacks on semiconductors
US5798837A (en) 1997-07-11 1998-08-25 Therma-Wave, Inc. Thin film optical measurement system and method with calibrating ellipsometer
US6134011A (en) 1997-09-22 2000-10-17 Hdi Instrumentation Optical measurement system using polarized light
US6483580B1 (en) * 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6476920B1 (en) 1998-03-18 2002-11-05 Nova Measuring Instruments, Ltd. Method and apparatus for measurements of patterned structures
US6836324B2 (en) * 1998-03-18 2004-12-28 Nova Measuring Instruments Ltd. Method and apparatus for measurements of patterned structures
US6361646B1 (en) 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
IL125338A0 (en) 1998-07-14 1999-03-12 Nova Measuring Instr Ltd Method and apparatus for monitoring and control of photolithography exposure and processing tools
US6181427B1 (en) 1998-07-10 2001-01-30 Nanometrics Incorporated Compact optical reflectometer system
US7295314B1 (en) 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US6320609B1 (en) * 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
IL126949A (en) 1998-11-08 2004-03-28 Nova Measuring Instr Ltd Apparatus for integrated monitoring of wafers and for process control in semiconductor manufacturing and a method for use thereof
US6690473B1 (en) 1999-02-01 2004-02-10 Sensys Instruments Corporation Integrated surface metrology
JP2001143982A (en) * 1999-06-29 2001-05-25 Applied Materials Inc Integrated dimension control for semiconductor device manufacturing
ATE374923T1 (en) * 1999-08-06 2007-10-15 Inverness Medical Biostar Inc BINDING ANALYSIS INSTRUMENTS BASED ON LIGHT ATTACHMENT THROUGH THIN FILM
EP1212580B1 (en) * 1999-09-16 2013-04-03 MKS Instruments, Inc. Method and apparatus for performing optical measurements of layers and surface properties
US6950182B1 (en) 1999-10-18 2005-09-27 J. A. Woollam Co. Functional equivalent to spatial filter in ellipsometer and the like systems
US7468794B1 (en) 1999-10-18 2008-12-23 J.A. Woollam Co., Inc. Rotating compensator ellipsometer system with spatial filter equivalent
US7567345B1 (en) 2007-01-05 2009-07-28 J.A. Woollam Co., Inc. Ellipsometer meeting scheimpflug condition with provision of an essentially circular electromagnetic radiation spot on a sample
US6469788B2 (en) 2000-03-27 2002-10-22 California Institute Of Technology Coherent gradient sensing ellipsometer
WO2001073376A1 (en) * 2000-03-27 2001-10-04 California Institute Of Technology Coherent gradient sensing ellipsometer
US6462817B1 (en) 2000-05-12 2002-10-08 Carlos Strocchia-Rivera Method of monitoring ion implants by examination of an overlying masking material
FR2809491B1 (en) * 2000-05-26 2008-07-04 Production Rech S Appliquees METHOD AND APPARATUS FOR ELLIPSOMETRIC METROLOGY FOR SAMPLE CONTAINED IN A CHAMBER OR THE LIKE
US7095511B2 (en) 2000-07-06 2006-08-22 Filmetrics, Inc. Method and apparatus for high-speed thickness mapping of patterned thin films
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
EP1319244A1 (en) 2000-09-20 2003-06-18 Kla-Tencor Inc. Methods and systems for semiconductor fabrication processes
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US7349090B2 (en) * 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6782337B2 (en) 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6625497B2 (en) * 2000-11-20 2003-09-23 Applied Materials Inc. Semiconductor processing module with integrated feedback/feed forward metrology
US6721052B2 (en) 2000-12-20 2004-04-13 Kla-Technologies Corporation Systems for measuring periodic structures
AUPR245301A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM06)
GB2384555B (en) * 2001-01-16 2005-05-04 Teraview Ltd Apparatus and method for investigating a sample
JP2002267418A (en) * 2001-03-09 2002-09-18 Horiba Ltd Film thickness measuring instrument
JP4399126B2 (en) 2001-04-25 2010-01-13 株式会社堀場製作所 Spectroscopic ellipsometer
IL145699A (en) * 2001-09-30 2006-12-10 Nova Measuring Instr Ltd Method of thin film characterization
TWI291729B (en) 2001-11-22 2007-12-21 Semiconductor Energy Lab A semiconductor fabricating apparatus
CN100508140C (en) * 2001-11-30 2009-07-01 株式会社半导体能源研究所 Manufacturing method for a semiconductor device
US7133737B2 (en) * 2001-11-30 2006-11-07 Semiconductor Energy Laboratory Co., Ltd. Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer
IL146924A (en) * 2001-12-04 2007-03-08 Nova Measuring Instr Ltd Metal cmp process monitoring
US7214573B2 (en) * 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
US7136172B1 (en) 2002-01-15 2006-11-14 J.A. Woollam Co., Inc. System and method for setting and compensating errors in AOI and POI of a beam of EM radiation
US20030184750A1 (en) * 2002-04-02 2003-10-02 Aikens David M. Ellipsometer or reflectometer with elliptical aperture
US7554662B1 (en) 2002-06-24 2009-06-30 J.A. Woollam Co., Inc. Spatial filter means comprising an aperture with a non-unity aspect ratio in a system for investigating samples with electromagnetic radiation
US7671989B2 (en) * 2002-06-24 2010-03-02 J. A. Woollam Co., Inc. Information maintenance during intensity attenuation in focused beams
US8013996B1 (en) 2002-06-24 2011-09-06 J.A. Woollam Co., Inc. Spatial filter in sample investigation system
US7193709B1 (en) 2003-01-31 2007-03-20 J.A. Woollam Co., Inc. Ellipsometric investigation of thin films
US7483148B1 (en) 2003-01-31 2009-01-27 J. A. Woollam Co., Inc. Ellipsometric investigation of very thin films
WO2004084279A1 (en) * 2003-03-14 2004-09-30 Midwest Research Institute Wafer characteristics via reflectometry
US6930782B1 (en) 2003-03-28 2005-08-16 Lam Research Corporation End point detection with imaging matching in semiconductor processing
US7085676B2 (en) * 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
US7148448B2 (en) * 2003-10-31 2006-12-12 General Electric Company Monitored laser shock peening
JP2007522432A (en) 2003-12-19 2007-08-09 インターナショナル・ビジネス・マシーンズ・コーポレーション Differential critical dimension and overlay measuring apparatus and measuring method
US6995901B2 (en) * 2004-01-15 2006-02-07 Alpha Innotech Corporation Optical analysis systems
US6853454B1 (en) * 2004-01-15 2005-02-08 Alpha Innotech Corporation Optical analysis systems
US20050157299A1 (en) * 2004-01-15 2005-07-21 Heffelfinger David M. Optical analysis systems
DE102004012161B3 (en) * 2004-03-12 2005-11-03 Nanofilm Technologie Gmbh Imaging Ellipsometer with Synchronized Sample Feed and Ellipsometric Measurement
US7206066B2 (en) * 2004-03-19 2007-04-17 Kla-Tencor Technologies Corporation Reflectance surface analyzer
IL162617A (en) * 2004-06-17 2010-04-15 Nova Measuring Instr Ltd Reflective optical system
US7274440B1 (en) * 2004-09-08 2007-09-25 Kla-Tencor Technologies Corp. Systems and methods for measuring stress in a specimen
US7515253B2 (en) * 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
US7349103B1 (en) 2005-10-31 2008-03-25 N&K Technology, Inc. System and method for high intensity small spot optical metrology
US8345241B1 (en) 2006-12-19 2013-01-01 J. A. Woollam Co., Inc. Application of digital light processor in imaging ellipsometer and the like systems
US8749782B1 (en) 2006-12-19 2014-06-10 J.A. Woollam Co., Inc. DLP base small spot investigation system
US7764387B2 (en) * 2007-03-02 2010-07-27 Applied Kinetics, Inc. Apparatus and method for measuring suspension and head assemblies in a stack
FR2925685B1 (en) * 2007-12-21 2010-02-05 Centre Nat Rech Scient METHOD AND DEVICE FOR THE MONOCOUP MEASUREMENT OF TRANSIENT BIREFRINGENCE INDUCED BY A DISTURBENCE BELONGING TO THE TERAHERTZ FREQUENCY DOMAIN
KR100981988B1 (en) * 2008-06-03 2010-09-13 나노-뷰(주) Apparatus and method for ellipsometry
US8467057B1 (en) 2008-09-15 2013-06-18 J.A. Woollam Co., Inc. Ellipsometers and polarimeters comprising polarization state compensating beam directing sample wobble compensating system, and method of use
US8339603B1 (en) 2008-10-03 2012-12-25 J.A. Woollam Co., Inc. Mapping ellipsometers and polarimeters comprising polarization state compensating beam directing means, and method of use
US8467056B1 (en) * 2009-11-09 2013-06-18 The United States Of America As Represented By The Secretary Of The Navy Variable angle, fiber optic coupled, light scattering apparatus
WO2012032575A1 (en) * 2010-09-08 2012-03-15 株式会社ニレコ Refractive index measuring apparatus and refractive index measuring method
US9658151B2 (en) 2011-03-07 2017-05-23 J.A. Woollam Co., Inc. System for viewing samples that are undergoing ellipsometric investigation in real time
US8953030B1 (en) 2011-03-07 2015-02-10 J.A. Woollam Co., Inc. System for viewing samples that are undergoing ellipsometric investigation in real time
JP5819715B2 (en) * 2011-11-30 2015-11-24 小島プレス工業株式会社 Vapor deposition polymer film forming equipment
CN104736744B (en) 2012-10-17 2017-06-06 东京毅力科创株式会社 Use the plasma etching end point determination of multi-variables analysis
US11885738B1 (en) 2013-01-22 2024-01-30 J.A. Woollam Co., Inc. Reflectometer, spectrophotometer, ellipsometer or polarimeter system including sample imaging system that simultaneously meet the scheimpflug condition and overcomes keystone error
JP6066192B2 (en) * 2013-03-12 2017-01-25 株式会社荏原製作所 Polishing pad surface texture measuring device
WO2014185818A1 (en) * 2013-05-13 2014-11-20 Gurevich Aleksei Sergeevich Ellipsometer
US10152998B2 (en) 2014-04-07 2018-12-11 Seagate Technology Llc Features maps of articles with polarized light
KR20180073700A (en) 2015-11-16 2018-07-02 도쿄엘렉트론가부시키가이샤 Advanced optical sensors and methods for plasma chambers
JP6974668B2 (en) 2016-03-31 2021-12-01 東京エレクトロン株式会社 Waferless dry cleaning Dry etching process using emission spectroscopy Feature control
US10453653B2 (en) 2016-09-02 2019-10-22 Tokyo Electron Limited Endpoint detection algorithm for atomic layer etching (ALE)
US10066989B1 (en) 2016-09-09 2018-09-04 J.A. Woollam Co., Inc Information maintenance, intensity attenuation, and angle/plane of incidence control in electromagentic beams
JP7112620B2 (en) 2016-11-18 2022-08-04 東京エレクトロン株式会社 Method and apparatus for detection of particle-induced arcs in manufacturing processes
CN110431655A (en) 2017-03-17 2019-11-08 东京毅力科创株式会社 The modified control in improved surface is measured for etching
KR102436759B1 (en) * 2017-10-24 2022-08-29 삼성디스플레이 주식회사 Debonding layer forming system, Debonding layer forming method, display device forming system using debonding layer and display device forming method using debonding layer
WO2020237016A1 (en) 2019-05-23 2020-11-26 Tokyo Electron Limited Optical diagnostics of semiconductor process using hyperspectral imaging
CN110425987A (en) * 2019-08-16 2019-11-08 宾努克斯科技（佛山）有限公司 A kind of penetrability laser thickness gauge
US10910201B1 (en) 2019-08-22 2021-02-02 Tokyo Electron Limited Synthetic wavelengths for endpoint detection in plasma etching

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645623A (en) 1970-09-25 1972-02-29 Raymond A Patten Apparatus for monitoring film thickness by reflecting a light beam from the film surface
US3869211A (en) 1972-06-29 1975-03-04 Canon Kk Instrument for measuring thickness of thin film
US4308586A (en) * 1980-05-02 1981-12-29 Nanometrics, Incorporated Method for the precise determination of photoresist exposure time
US4516855A (en) * 1981-04-03 1985-05-14 International Business Machines Corporation Method and apparatus for determining the polarization state of a light wave field
US4585348A (en) * 1981-09-28 1986-04-29 International Business Machines Corporation Ultra-fast photometric instrument
US4555767A (en) * 1982-05-27 1985-11-26 International Business Machines Corporation Method and apparatus for measuring thickness of epitaxial layer by infrared reflectance
JPS59109807A (en) * 1982-12-16 1984-06-25 Fuji Electric Co Ltd Method for measuring thickness of top layer of multi- layered electrophotographic sensitive body
JPS59125009A (en) * 1982-12-29 1984-07-19 Fujitsu Ltd Pattern detecting method
US5259881A (en) 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4618262A (en) * 1984-04-13 1986-10-21 Applied Materials, Inc. Laser interferometer system and method for monitoring and controlling IC processing
DE3419463C1 (en) * 1984-05-24 1985-09-12 Sagax Instrument AB, Sundbyberg Device for recording material properties of sample surfaces
US4653924A (en) * 1984-06-12 1987-03-31 Victor Company Of Japan, Ltd. Rotating analyzer type ellipsometer
US4681450A (en) * 1985-06-21 1987-07-21 Research Corporation Photodetector arrangement for measuring the state of polarization of light
ATE84276T1 (en) 1986-04-28 1993-01-15 Varian Associates MODULAR CONVEYING AND PROCESSING SYSTEM FOR SEMICONDUCTOR WAFER.
US4815856A (en) * 1986-06-05 1989-03-28 Storage Technology Partners Ii Method and apparatus for measuring the absolute thickness of dust defocus layers
US4842410A (en) * 1986-10-24 1989-06-27 Geo-Centers, Inc. Apparatus and method utilizing interference fringes to determine the thermal stability of a liquid
DE3750174T2 (en) 1986-10-30 1994-11-17 Canon Kk Exposure device.
US4908508A (en) * 1987-02-12 1990-03-13 Akzo N.V. Process and apparatus for determining thicknesses of layers
US4713140A (en) * 1987-03-02 1987-12-15 International Business Machines Corporation Laser luminescence monitor for material thickness
JPS6412208A (en) * 1987-07-04 1989-01-17 Toyo Boseki Measurement of film thickness and/or refractive index
JPS6454207A (en) * 1987-08-25 1989-03-01 Matsushita Electric Ind Co Ltd Optical measuring apparatus of film thickness
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
AU609573B2 (en) * 1988-01-11 1991-05-02 Commonwealth Of Australia, The Differential ellipsometer
US4826321A (en) * 1988-03-14 1989-05-02 Nanometrics, Incorporated Thin dielectric film measuring system
JPH0224502A (en) * 1988-07-12 1990-01-26 Dainippon Screen Mfg Co Ltd Film-thickness measuring method
US4873430A (en) * 1988-10-25 1989-10-10 International Business Machines Corporation Method and apparatus for optically measuring characteristics of a thin film by directing a P-polarized beam through an integrating sphere at the brewster's angle of the film
JP2588259B2 (en) * 1988-11-04 1997-03-05 株式会社島津製作所 Ellipsometer
US4962063A (en) 1988-11-10 1990-10-09 Applied Materials, Inc. Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while depositing
US4957368A (en) * 1989-03-16 1990-09-18 Photoacoustic Technology, Inc. Apparatus and process for performing ellipsometric measurements of surfaces
US5042951A (en) * 1989-09-19 1991-08-27 Therma-Wave, Inc. High resolution ellipsometric apparatus
US4999014A (en) * 1989-05-04 1991-03-12 Therma-Wave, Inc. Method and apparatus for measuring thickness of thin films
US5166752A (en) * 1990-01-11 1992-11-24 Rudolph Research Corporation Simultaneous multiple angle/multiple wavelength ellipsometer and method
US5274434A (en) 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
US5310410A (en) 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
GB2245670A (en) * 1990-06-27 1992-01-08 Ford Motor Co A pipe coupling
JP2927934B2 (en) 1990-11-16 1999-07-28 株式会社リコー Thin film measurement method and apparatus
US5159412A (en) * 1991-03-15 1992-10-27 Therma-Wave, Inc. Optical measurement device with enhanced sensitivity
JP3000303B2 (en) * 1991-03-29 2000-01-17 アルバック成膜株式会社 Method and apparatus for measuring optical constants and film thickness in vacuum deposition equipment
JPH052060A (en) * 1991-06-26 1993-01-08 Hitachi Ltd Process evaluation device and method
GB9116477D0 (en) 1991-07-30 1991-09-11 Exploration & Prod Serv Improved sub-sea test tree apparatus
JPH0571923A (en) * 1991-09-12 1993-03-23 Canon Inc Polarization analyzing method and thin film measuring apparatus
JPH0590211A (en) * 1991-09-30 1993-04-09 Fujitsu Ltd Device and method for vacuum treatment
US5181080A (en) * 1991-12-23 1993-01-19 Therma-Wave, Inc. Method and apparatus for evaluating the thickness of thin films
EP0558781B1 (en) * 1992-03-05 1998-08-05 Micronic Laser Systems Ab Method and apparatus for exposure of substrates
US5766360A (en) 1992-03-27 1998-06-16 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method
JPH05280937A (en) * 1992-04-03 1993-10-29 Sharp Corp Measuring method of film thickness
IL107549A (en) * 1993-11-09 1996-01-31 Nova Measuring Instr Ltd Device for measuring the thickness of thin films
USRE38153E1 (en) * 1993-11-09 2003-06-24 Nova Measuring Instruments, Ltd. Two-dimensional beam deflector
US5764365A (en) * 1993-11-09 1998-06-09 Nova Measuring Instruments, Ltd. Two-dimensional beam deflector
TW295677B (en) 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
EP0787286A1 (en) * 1994-10-21 1997-08-06 Therma-Wave Inc. Spectroscopic ellipsometer
US5608526A (en) * 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US5940175A (en) 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber
EP0841692A3 (en) 1996-11-08 1998-12-23 Matsushita Electric Industrial Co., Ltd. Apparatus and method for optical evaluation of a semiconductor device
US6943407B2 (en) 2003-06-17 2005-09-13 International Business Machines Corporation Low leakage heterojunction vertical transistors and high performance devices thereof

Also Published As

Publication number Publication date
EP0652415B1 (en) 1998-12-30
IL107549A (en) 1996-01-31
USRE41906E1 (en) 2010-11-02
JPH07198342A (en) 1995-08-01
US5517312A (en) 1996-05-14
DE69415641T2 (en) 1999-07-29
IL107549A0 (en) 1994-02-27
EP0652415A1 (en) 1995-05-10
JP3697279B2 (en) 2005-09-21

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