DE69402108D1 - Verfahren zur Herstellung von metallisierten keramischen Substraten - Google Patents

Verfahren zur Herstellung von metallisierten keramischen Substraten

Info

Publication number
DE69402108D1
DE69402108D1 DE69402108T DE69402108T DE69402108D1 DE 69402108 D1 DE69402108 D1 DE 69402108D1 DE 69402108 T DE69402108 T DE 69402108T DE 69402108 T DE69402108 T DE 69402108T DE 69402108 D1 DE69402108 D1 DE 69402108D1
Authority
DE
Germany
Prior art keywords
production
ceramic substrates
metallized ceramic
metallized
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69402108T
Other languages
English (en)
Inventor
Douglas Cywar
Don Herman Hess
Christian Lalonde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69402108D1 publication Critical patent/DE69402108D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE69402108T 1993-05-28 1994-04-22 Verfahren zur Herstellung von metallisierten keramischen Substraten Expired - Lifetime DE69402108D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/069,304 US5352326A (en) 1993-05-28 1993-05-28 Process for manufacturing metalized ceramic substrates

Publications (1)

Publication Number Publication Date
DE69402108D1 true DE69402108D1 (de) 1997-04-24

Family

ID=22088070

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69402108T Expired - Lifetime DE69402108D1 (de) 1993-05-28 1994-04-22 Verfahren zur Herstellung von metallisierten keramischen Substraten

Country Status (4)

Country Link
US (1) US5352326A (de)
EP (1) EP0627872B1 (de)
JP (1) JP2587198B2 (de)
DE (1) DE69402108D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6440880B2 (en) 1993-10-29 2002-08-27 3M Innovative Properties Company Pressure-sensitive adhesives having microstructured surfaces
US6197397B1 (en) 1996-12-31 2001-03-06 3M Innovative Properties Company Adhesives having a microreplicated topography and methods of making and using same
US6100012A (en) * 1998-07-06 2000-08-08 National Semiconductor Corporation Infra-red radiation post-exposure bake process for chemically amplified resist lithography
US6362116B1 (en) * 2000-02-09 2002-03-26 Advanced Micro Devices, Inc. Method for controlling photoresist baking processes
US6992377B2 (en) * 2004-02-26 2006-01-31 Freescale Semiconductor, Inc. Semiconductor package with crossing conductor assembly and method of manufacture
GB2446838A (en) * 2007-02-20 2008-08-27 David John Ruchat Photovoltaic device and manufacturing method
JP2022175467A (ja) * 2021-05-13 2022-11-25 キヤノン株式会社 基板処理装置、基板処理方法、及び物品の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615435A (en) * 1968-02-14 1971-10-26 Du Pont Photohardenable image reproduction element with integral pigmented layer and process for use
DE2349979A1 (de) * 1973-10-04 1975-04-17 Bayer Ag Uv-licht-haertende massen hoher reaktivitaet
US3953214A (en) * 1974-05-24 1976-04-27 Dynachem Corporation Photopolymerizable screen printing inks and use thereof
IT1013645B (it) * 1974-06-17 1977-03-30 Technofil Spa Macchina bobinatrice per l avvol gimento continuo di bobine in particolare filo metallico
JPS5340537B2 (de) * 1974-12-27 1978-10-27
JPS5238819A (en) * 1975-09-22 1977-03-25 Toshiba Corp Television came unit
US4100047A (en) * 1976-10-12 1978-07-11 Mobil Oil Corporation Ultraviolet curable aqueous coatings
SE7905806L (sv) * 1979-07-03 1981-01-04 Nordnero Ab Vattenbaserat rengoringssystem
US4299910A (en) * 1980-11-24 1981-11-10 Rca Corporation Water-based photoresists using stilbene compounds as crosslinking agents
JPS57106029A (en) * 1980-12-23 1982-07-01 Nippon Telegr & Teleph Corp <Ntt> Formation of high-heat-resistant, negative type resist pattern
US4569901A (en) * 1984-10-31 1986-02-11 Allied Corporation Poly(N-benzyl acrylamide) polymer containing negative photoresist compositions
US4612270A (en) * 1985-03-14 1986-09-16 Rca Corporation Two-layer negative resist
JPS6318692A (ja) * 1986-07-11 1988-01-26 日立化成工業株式会社 印刷配線板の製造方法
US4770739A (en) * 1987-02-03 1988-09-13 Texas Instruments Incorporated Bilayer photoresist process
US4940510A (en) * 1987-06-01 1990-07-10 Digital Equipment Corporation Method of etching in the presence of positive photoresist
DE3814567A1 (de) * 1988-04-29 1989-11-09 Du Pont Deutschland Photopolymerisierbare zusammensetzungen mit carboxylgruppen enthaltenden bindemitteln
US4985343A (en) * 1989-02-09 1991-01-15 Mitsubishi Rayon Co., Ltd. Crosslinking-curable resin composition
US4935094A (en) * 1989-05-26 1990-06-19 At&T Bell Laboratories Negative resist with oxygen plasma resistance
JPH0353587A (ja) * 1989-07-20 1991-03-07 Nippon Paint Co Ltd レジストパターンの形成方法

Also Published As

Publication number Publication date
JPH06349978A (ja) 1994-12-22
EP0627872A2 (de) 1994-12-07
US5352326A (en) 1994-10-04
EP0627872A3 (de) 1995-03-29
JP2587198B2 (ja) 1997-03-05
EP0627872B1 (de) 1997-03-19

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Legal Events

Date Code Title Description
8332 No legal effect for de