DE69400675D1 - Verfahren zur Herstellung von Resiststrukturen - Google Patents

Verfahren zur Herstellung von Resiststrukturen

Info

Publication number
DE69400675D1
DE69400675D1 DE69400675T DE69400675T DE69400675D1 DE 69400675 D1 DE69400675 D1 DE 69400675D1 DE 69400675 T DE69400675 T DE 69400675T DE 69400675 T DE69400675 T DE 69400675T DE 69400675 D1 DE69400675 D1 DE 69400675D1
Authority
DE
Germany
Prior art keywords
production
resist structures
resist
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69400675T
Other languages
English (en)
Other versions
DE69400675T2 (de
Inventor
Masamitsu Shirai
Masahiro Tsunooka
Kanji Nishijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Paint Co Ltd
Original Assignee
Nippon Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Paint Co Ltd filed Critical Nippon Paint Co Ltd
Publication of DE69400675D1 publication Critical patent/DE69400675D1/de
Application granted granted Critical
Publication of DE69400675T2 publication Critical patent/DE69400675T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
DE69400675T 1993-05-24 1994-05-24 Verfahren zur Herstellung von Resiststrukturen Expired - Fee Related DE69400675T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5159902A JPH06332196A (ja) 1993-05-24 1993-05-24 レジストパターンの形成方法

Publications (2)

Publication Number Publication Date
DE69400675D1 true DE69400675D1 (de) 1996-11-14
DE69400675T2 DE69400675T2 (de) 1997-03-06

Family

ID=15703672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69400675T Expired - Fee Related DE69400675T2 (de) 1993-05-24 1994-05-24 Verfahren zur Herstellung von Resiststrukturen

Country Status (4)

Country Link
US (1) US5683857A (de)
EP (1) EP0626620B1 (de)
JP (1) JPH06332196A (de)
DE (1) DE69400675T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999052018A1 (en) * 1998-04-07 1999-10-14 Euv Limited Liability Corporation Thin layer imaging process for microlithography using radiation at strongly attenuated wavelengths
JP3711198B2 (ja) * 1998-04-23 2005-10-26 東京応化工業株式会社 レジストパターンの形成方法
US6210856B1 (en) 1999-01-27 2001-04-03 International Business Machines Corporation Resist composition and process of forming a patterned resist layer on a substrate
US6461971B1 (en) 2000-01-21 2002-10-08 Chartered Semiconductor Manufacturing Ltd. Method of residual resist removal after etching of aluminum alloy filmsin chlorine containing plasma
US6740597B1 (en) * 2000-08-31 2004-05-25 Micron Technology, Inc. Methods of removing at least some of a material from a semiconductor substrate
JP4524744B2 (ja) * 2004-04-14 2010-08-18 日本電気株式会社 有機マスクの形成方法及び該有機マスクを利用したパターン形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5108875A (en) * 1988-07-29 1992-04-28 Shipley Company Inc. Photoresist pattern fabrication employing chemically amplified metalized material
JPH02115853A (ja) * 1988-10-26 1990-04-27 Fujitsu Ltd 半導体装置の製造方法
JPH0442229A (ja) * 1990-06-08 1992-02-12 Fujitsu Ltd レジスト材料およびパターンの形成方法
JPH0469662A (ja) * 1990-07-10 1992-03-04 Japan Synthetic Rubber Co Ltd レジストの処理方法
US5286595A (en) * 1990-08-08 1994-02-15 E. I. Du Pont De Nemours And Company Process for creating a tacky tonable image surface through exposure of a substrate coated with a polymer blend, including a photo-acid generator, to actinic radiation
US5391441A (en) * 1992-02-21 1995-02-21 Hitachi, Ltd. Exposure mask and method of manufacture thereof
US5346803A (en) * 1993-09-15 1994-09-13 Shin-Etsu Chemical Co., Ltd. Photoresist composition comprising a copolymer having a di-t-butyl fumarate

Also Published As

Publication number Publication date
EP0626620B1 (de) 1996-10-09
JPH06332196A (ja) 1994-12-02
US5683857A (en) 1997-11-04
DE69400675T2 (de) 1997-03-06
EP0626620A1 (de) 1994-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee