DE69325763T2 - Elektroakustische Hybride integrierte Schaltung und Methode zu deren Herstellung - Google Patents

Elektroakustische Hybride integrierte Schaltung und Methode zu deren Herstellung

Info

Publication number
DE69325763T2
DE69325763T2 DE69325763T DE69325763T DE69325763T2 DE 69325763 T2 DE69325763 T2 DE 69325763T2 DE 69325763 T DE69325763 T DE 69325763T DE 69325763 T DE69325763 T DE 69325763T DE 69325763 T2 DE69325763 T2 DE 69325763T2
Authority
DE
Germany
Prior art keywords
electroacoustic
production
integrated circuit
hybrid integrated
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69325763T
Other languages
English (en)
Other versions
DE69325763D1 (de
Inventor
Kazuo Eda
Yutaka Taguchi
Akihiro Kanaboshi
Tetsuyoshi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26615892A external-priority patent/JP2589634B2/ja
Priority claimed from JP27400292A external-priority patent/JP2563733B2/ja
Priority claimed from JP27400392A external-priority patent/JP2574612B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69325763D1 publication Critical patent/DE69325763D1/de
Publication of DE69325763T2 publication Critical patent/DE69325763T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/174—Membranes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
DE69325763T 1992-10-05 1993-10-05 Elektroakustische Hybride integrierte Schaltung und Methode zu deren Herstellung Expired - Fee Related DE69325763T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP26615892A JP2589634B2 (ja) 1992-10-05 1992-10-05 電子音響集積回路とその製造方法
JP27400292A JP2563733B2 (ja) 1992-10-13 1992-10-13 電子音響集積回路およびその製造方法
JP27400392A JP2574612B2 (ja) 1992-10-13 1992-10-13 電子音響集積回路およびその製造方法

Publications (2)

Publication Number Publication Date
DE69325763D1 DE69325763D1 (de) 1999-09-02
DE69325763T2 true DE69325763T2 (de) 2000-04-20

Family

ID=27335442

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325763T Expired - Fee Related DE69325763T2 (de) 1992-10-05 1993-10-05 Elektroakustische Hybride integrierte Schaltung und Methode zu deren Herstellung

Country Status (4)

Country Link
EP (1) EP0591918B1 (de)
KR (1) KR0158898B1 (de)
DE (1) DE69325763T2 (de)
NO (1) NO310996B1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270202B1 (en) 1997-04-24 2001-08-07 Matsushita Electric Industrial Co., Ltd. Liquid jetting apparatus having a piezoelectric drive element directly bonded to a casing
US6081171A (en) * 1998-04-08 2000-06-27 Nokia Mobile Phones Limited Monolithic filters utilizing thin film bulk acoustic wave devices and minimum passive components for controlling the shape and width of a passband response
WO2001059812A2 (de) * 2000-02-11 2001-08-16 Siemens Aktiengesellschaft Satz umfassend viele erzeugnisse mit jeweils einem abstimmbaren elektronischen bauelement, sowie satz von anordnungen umfassend jeweils ein solches erzeugnis
US8735219B2 (en) 2012-08-30 2014-05-27 Ziptronix, Inc. Heterogeneous annealing method and device
CN105141278B (zh) * 2015-07-21 2018-05-22 苏州能讯高能半导体有限公司 一种晶体管与薄膜体声波谐振器集成的放大模块
US11664357B2 (en) 2018-07-03 2023-05-30 Adeia Semiconductor Bonding Technologies Inc. Techniques for joining dissimilar materials in microelectronics

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4665374A (en) * 1985-12-20 1987-05-12 Allied Corporation Monolithic programmable signal processor using PI-FET taps
DE3922671A1 (de) * 1989-07-10 1991-01-24 Siemens Ag Akustoelektronisches bauelement mit einer oberflaechenwellenanordnung und einer elektronischen halbleiterschaltung
JPH03178206A (ja) * 1989-12-06 1991-08-02 Nec Corp モノリシック集積回路化発振器
EP0531985B1 (de) * 1991-09-12 1999-02-24 Matsushita Electric Industrial Co., Ltd. Elektroakustische hybride integrierte Schaltung und ihre Herstellungsverfahren

Also Published As

Publication number Publication date
NO933534D0 (no) 1993-10-04
EP0591918A1 (de) 1994-04-13
DE69325763D1 (de) 1999-09-02
NO933534L (no) 1994-04-06
EP0591918B1 (de) 1999-07-28
KR0158898B1 (ko) 1999-10-01
NO310996B1 (no) 2001-09-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee