DE69325088D1 - Elektrisches Verbindungssystem - Google Patents

Elektrisches Verbindungssystem

Info

Publication number
DE69325088D1
DE69325088D1 DE69325088T DE69325088T DE69325088D1 DE 69325088 D1 DE69325088 D1 DE 69325088D1 DE 69325088 T DE69325088 T DE 69325088T DE 69325088 T DE69325088 T DE 69325088T DE 69325088 D1 DE69325088 D1 DE 69325088D1
Authority
DE
Germany
Prior art keywords
electrical connection
connection system
electrical
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69325088T
Other languages
English (en)
Other versions
DE69325088T2 (de
Inventor
Arthur King Wilson
Patricia Susan Brown
Jason R Arbeiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69325088D1 publication Critical patent/DE69325088D1/de
Publication of DE69325088T2 publication Critical patent/DE69325088T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/1752—Mounting within the printer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
DE69325088T 1993-04-30 1993-12-16 Elektrisches Verbindungssystem Expired - Fee Related DE69325088T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/056,692 US5372512A (en) 1993-04-30 1993-04-30 Electrical interconnect system for a flexible circuit

Publications (2)

Publication Number Publication Date
DE69325088D1 true DE69325088D1 (de) 1999-07-01
DE69325088T2 DE69325088T2 (de) 1999-12-23

Family

ID=22006030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325088T Expired - Fee Related DE69325088T2 (de) 1993-04-30 1993-12-16 Elektrisches Verbindungssystem

Country Status (4)

Country Link
US (3) US5372512A (de)
EP (1) EP0622866B1 (de)
JP (1) JP3387621B2 (de)
DE (1) DE69325088T2 (de)

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ATE177688T1 (de) * 1992-07-30 1999-04-15 Canon Kk Aufzeichnungskopf und diesen verwendendes aufzeichnungsgerät
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
DE4417088C2 (de) * 1993-05-14 2001-11-29 Amphenol Tuchel Elect Kontaktiersystem für Chipkarten
IT1261605B (it) * 1993-10-11 1996-05-23 Olivetti & Co Spa Stampante con testine di stampa intercambiabili
US5975679A (en) * 1993-10-29 1999-11-02 Hewlett-Packard Company Dot alignment in mixed resolution printer
US5796417A (en) * 1993-10-29 1998-08-18 Hewlett-Packard Company Compliant interconnect assembly for mounting removable print cartridges in a carriage
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
US5748209A (en) * 1994-10-31 1998-05-05 Hewlett-Packard Company Thermal ink jet tab circuit having a plurality of trace groups wherein adjacent traces in each group are staggered
US5629725A (en) * 1995-01-04 1997-05-13 Brother International Corporation Carriage mount for an ink jet cartridge
JP3543433B2 (ja) * 1995-02-15 2004-07-14 ブラザー工業株式会社 接点電極接続装置
CA2213590C (en) * 1997-08-21 2006-11-07 Keith C. Carroll Flexible circuit connector and method of making same
US6064509A (en) * 1997-08-22 2000-05-16 Gentex Corporation Clip for use with transparent conductive electrodes in electrochromic devices
US6036502A (en) * 1997-11-03 2000-03-14 Intercon Systems, Inc. Flexible circuit compression connector system and method of manufacture
US5899757A (en) 1997-11-03 1999-05-04 Intercon Systems, Inc. Compression connector
US6536871B1 (en) 1997-11-05 2003-03-25 Hewlett-Packard Company Reliable flex circuit interconnect on inkjet print cartridge
DE19751095C1 (de) * 1997-11-18 1999-05-20 Siemens Ag Elektrische Verbindungsanordnung
US6024580A (en) * 1998-01-08 2000-02-15 International Business Machines Corporation High performance pad on pad connector for flex circuit packaging
US6247639B1 (en) * 1998-04-29 2001-06-19 Medallion Technology, Llc Fixed-gap solder reflow method
US6224192B1 (en) 1998-10-06 2001-05-01 Hewlett-Packard Company Inkjet printing systems using a modular print cartridge assembly
US6065826A (en) * 1998-10-06 2000-05-23 Hewlett-Packard Company Modular print cartridge receptacle for use in inkjet printing systems
GB9821787D0 (en) * 1998-10-06 1998-12-02 Data Limited Apparatus for classifying or processing data
US6302704B1 (en) * 1999-04-22 2001-10-16 Ford Global Tech. Method and apparatus for selectively connecting flexible circuits
EP1057638B1 (de) * 1999-06-04 2007-01-31 Canon Kabushiki Kaisha Flüssigkeitsausstosskopf und Flüssigkeitsausstossvorrichtung
US6132122A (en) * 1999-08-23 2000-10-17 Hewlett-Packard Company Low profile architecture for internet appliance printing
US6402299B1 (en) 1999-10-22 2002-06-11 Lexmark International, Inc. Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer
US6223973B1 (en) * 1999-11-16 2001-05-01 Visteon Global Technologies, Inc. Apparatus and method for connecting printed circuit boards through soldered lap joints
US6428228B1 (en) * 1999-12-02 2002-08-06 Hewlett-Packard Company Removable paper module for an orthogonal inkjet printer
JP3910327B2 (ja) 1999-12-22 2007-04-25 松下電器産業株式会社 電動圧縮機及びその製造方法
TW514596B (en) 2000-02-28 2002-12-21 Hewlett Packard Co Glass-fiber thermal inkjet print head
US7059868B1 (en) * 2000-03-07 2006-06-13 Western Digital (Fremont), Inc. Connection of trace circuitry in a computer disk drive system
US6199977B1 (en) 2000-04-13 2001-03-13 Lexmark International, Inc. Cartridge body for ink jet printer
US6855013B2 (en) 2000-05-08 2005-02-15 Tyco Electronic Logistics Ag LCD connector for printed circuit boards
US6322374B1 (en) * 2000-07-28 2001-11-27 The United States Of America As Represented By The Secretary Of The Air Force Micro-zero insertion force socket
US6536872B2 (en) 2001-08-16 2003-03-25 Lexmark International, Inc. Connection module
US6595785B2 (en) 2001-10-05 2003-07-22 Delphi Technologies, Inc. Bump contact force concentration system and method
EP1599121A4 (de) * 2002-11-27 2007-10-10 Blacktoe Medical Iii Inc Tauchultraschallsonde und kabel
US20050096554A1 (en) * 2002-11-27 2005-05-05 Dudik Evan M. Acoustic medical sensor for ultrasound imaging
US7070350B2 (en) * 2003-05-15 2006-07-04 Matsushita Electric Industrial Co., Ltd. Image recording device
US7025440B2 (en) * 2003-10-15 2006-04-11 Lexmark International, Inc. Low profile ink jet cartridge assembly
US7824119B2 (en) * 2004-11-12 2010-11-02 Pertech Resources, Inc. Transaction printer
US20060103701A1 (en) * 2004-11-17 2006-05-18 Nu-Kote International, Inc. Ink cartridge with semiconductor storage device
TWI286453B (en) * 2005-03-14 2007-09-01 Au Optronics Corp Electric device and flat panel display utilizing same
GB0523667D0 (en) * 2005-11-21 2005-12-28 In2Tec Ltd Displacement sensor
US7621757B2 (en) * 2006-06-23 2009-11-24 Delphi Technologies, Inc. Solderless electrical interconnection for electronic package
JP5291285B2 (ja) 2006-07-11 2013-09-18 サンデン株式会社 電動圧縮機の密封端子装置
US20080306387A1 (en) 2007-04-13 2008-12-11 Schutz Ronald W Finger mounted imaging and sensing assembly
CN102985260B (zh) * 2010-05-11 2016-08-24 惠普发展公司，有限责任合伙企业 油墨笔电接口
US8529276B2 (en) 2011-02-18 2013-09-10 Hi Rel Connectors, Inc. Connector to flex assembly
CN202196958U (zh) * 2011-08-10 2012-04-18 富士康(昆山)电脑接插件有限公司 电连接器
US8821167B2 (en) 2012-05-31 2014-09-02 Hi Rel Connectors, Inc. Apparatus for electrically connecting a flexible circuit to a receiver
US8878072B2 (en) 2012-06-19 2014-11-04 Lockheed Martin Corporation High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment
JP6037682B2 (ja) * 2012-06-29 2016-12-07 オリンパス株式会社 プリント配線板の接続構造
US9258907B2 (en) 2012-08-09 2016-02-09 Lockheed Martin Corporation Conformal 3D non-planar multi-layer circuitry
US8772745B1 (en) 2013-03-14 2014-07-08 Lockheed Martin Corporation X-ray obscuration film and related techniques
US9742091B2 (en) * 2014-04-11 2017-08-22 R&D Sockets, Inc. Method and structure for conductive elastomeric pin arrays using solder interconnects and a non-conductive medium
US10123410B2 (en) 2014-10-10 2018-11-06 Lockheed Martin Corporation Fine line 3D non-planar conforming circuit
US10587074B2 (en) * 2017-09-29 2020-03-10 Appple Inc. Hybrid electrical connector

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GB144028A (en) * 1919-04-15 1920-06-10 Erasmus Manford Blacksher Improvements in and connected with aeroplanes and the like
DE2253627A1 (de) * 1972-11-02 1974-05-16 Philips Patentverwaltung Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement
JPS56121014A (en) * 1980-02-28 1981-09-22 Sharp Corp Liquid-crystal display device
US4403272A (en) * 1980-06-02 1983-09-06 Oak Industries Inc. Membrane switch interconnect tail and printed circuit board connection
JPS5848373A (ja) * 1981-09-02 1983-03-22 リトン・システムズ・インコ−ポレ−テツド コネクタ
US4706097A (en) * 1986-04-03 1987-11-10 Hewlett Packard Company Near-linear spring connect structure for flexible interconnect circuits
US4907018A (en) * 1988-11-21 1990-03-06 Hewlett-Packard Company Printhead-carriage alignment and electrical interconnect lock-in mechanism
US4989317A (en) * 1988-11-21 1991-02-05 Hewlett-Packard Company Method for making tab circuit electrical connector supporting multiple components thereon
US4976626A (en) * 1988-12-21 1990-12-11 International Business Machines Corporation Connector for connecting flexible film circuit carrier to board or card
US4913656A (en) * 1989-04-07 1990-04-03 Rogers Corporation Electrical connector
US5158466A (en) * 1991-03-04 1992-10-27 Hughes Aircraft Company Metallically encapsulated elevated interconnection feature
US5205750A (en) * 1991-12-06 1993-04-27 International Business Machines Corporation Temperature compensating strain relief connection for flexible electrical circuits
US5205740A (en) * 1991-12-13 1993-04-27 International Business Machines, Corp. Super connector for connecting flat ribbon cables
US5213511A (en) * 1992-03-27 1993-05-25 Hughes Aircraft Company Dimple interconnect for flat cables and printed wiring boards
US5273440A (en) * 1992-05-19 1993-12-28 Elco Corporation Pad array socket
US5295838A (en) * 1993-01-14 1994-03-22 Hughes Aircraft Company Raised feature/gold dot pressure interconnections of rigid-flex circuits and rigid circuit boards
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages

Also Published As

Publication number Publication date
US5608434A (en) 1997-03-04
JP3387621B2 (ja) 2003-03-17
JPH0722092A (ja) 1995-01-24
US5372512A (en) 1994-12-13
DE69325088T2 (de) 1999-12-23
EP0622866A2 (de) 1994-11-02
EP0622866A3 (de) 1996-04-10
EP0622866B1 (de) 1999-05-26
US5533904A (en) 1996-07-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8339 Ceased/non-payment of the annual fee