DE69323304T2 - Innenlochsägemaschine - Google Patents

Innenlochsägemaschine

Info

Publication number
DE69323304T2
DE69323304T2 DE69323304T DE69323304T DE69323304T2 DE 69323304 T2 DE69323304 T2 DE 69323304T2 DE 69323304 T DE69323304 T DE 69323304T DE 69323304 T DE69323304 T DE 69323304T DE 69323304 T2 DE69323304 T2 DE 69323304T2
Authority
DE
Germany
Prior art keywords
punching machine
hole punching
hole
machine
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69323304T
Other languages
English (en)
Other versions
DE69323304D1 (de
Inventor
Seiichi Terashima
Masao Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69323304D1 publication Critical patent/DE69323304D1/de
Application granted granted Critical
Publication of DE69323304T2 publication Critical patent/DE69323304T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
DE69323304T 1992-11-27 1993-11-27 Innenlochsägemaschine Expired - Fee Related DE69323304T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4319052A JP2979870B2 (ja) 1992-11-27 1992-11-27 半導体インゴットのコーン状端部切除方法

Publications (2)

Publication Number Publication Date
DE69323304D1 DE69323304D1 (de) 1999-03-11
DE69323304T2 true DE69323304T2 (de) 1999-09-30

Family

ID=18105972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323304T Expired - Fee Related DE69323304T2 (de) 1992-11-27 1993-11-27 Innenlochsägemaschine

Country Status (4)

Country Link
US (1) US5413521A (de)
EP (1) EP0633086B1 (de)
JP (1) JP2979870B2 (de)
DE (1) DE69323304T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632666A (en) * 1994-10-28 1997-05-27 Memc Electronic Materials, Inc. Method and apparatus for automated quality control in wafer slicing
JP3085136B2 (ja) * 1995-03-25 2000-09-04 信越半導体株式会社 ワークのスライシング方法および装置
JPH08290353A (ja) * 1995-04-19 1996-11-05 Komatsu Electron Metals Co Ltd 半導体単結晶インゴット切断治具
US5832914A (en) * 1997-08-22 1998-11-10 Seh America, Inc. Ingot trimming method and apparatus
JP4702984B2 (ja) * 2000-07-14 2011-06-15 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 結晶取出装置及び結晶取出方法
DE10055286A1 (de) * 2000-11-08 2002-05-23 Freiberger Compound Mat Gmbh Vorrichtung und Verfahren zum Trennen von Werkstoffen
CA2401306C (en) * 2001-09-13 2009-07-14 Auto V Grooving Inc. V grooving machine for natural or engineered stone
CN106450939B (zh) * 2016-10-31 2019-12-03 河南天海电器有限公司 一种高压屏蔽连接器组件
CN107756655B (zh) * 2017-09-28 2021-01-29 河南科特尔机械制造有限公司 一种石墨垫片自动切割、加工成型流水线设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147644A (ja) * 1984-08-13 1986-03-08 Hitachi Ltd スライサ−用ブレ−ドのそり制御方法
JPS6416311U (de) * 1987-07-20 1989-01-26
FR2624423A1 (fr) * 1987-12-14 1989-06-16 Rhone Poulenc Films Procede de tronconnage de bobines de films en matiere plastique et dispositif pour sa mise en oeuvre
JPH02134212A (ja) * 1988-11-14 1990-05-23 Sumitomo Metal Ind Ltd 切断方法
JP2503275B2 (ja) * 1989-07-27 1996-06-05 株式会社 東京精密 スライシングマシンの切断装置
JPH0767692B2 (ja) * 1989-09-07 1995-07-26 株式会社東京精密 スライシングマシンの切断方法
JP2505930B2 (ja) * 1990-05-10 1996-06-12 株式会社東京精密 スライシングマシンの切断方法
DE4024751C2 (de) * 1990-08-03 1995-06-08 Wacker Chemitronic Verfahren und Vorrichtung zum Innenlochsägen von stabförmigen Werkstücken, insbesondere Halbleiterstäben
JPH04138209A (ja) * 1990-09-28 1992-05-12 Toyo A Tec Kk スライシング装置

Also Published As

Publication number Publication date
JP2979870B2 (ja) 1999-11-15
EP0633086A1 (de) 1995-01-11
DE69323304D1 (de) 1999-03-11
EP0633086B1 (de) 1999-01-27
US5413521A (en) 1995-05-09
JPH06166021A (ja) 1994-06-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee