DE69320612D1 - Gehäusung bestehend aus unter Druck zusammengestetzten Teilen - Google Patents

Gehäusung bestehend aus unter Druck zusammengestetzten Teilen

Info

Publication number
DE69320612D1
DE69320612D1 DE69320612T DE69320612T DE69320612D1 DE 69320612 D1 DE69320612 D1 DE 69320612D1 DE 69320612 T DE69320612 T DE 69320612T DE 69320612 T DE69320612 T DE 69320612T DE 69320612 D1 DE69320612 D1 DE 69320612D1
Authority
DE
Germany
Prior art keywords
under pressure
parts assembled
housing consisting
assembled under
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69320612T
Other languages
English (en)
Other versions
DE69320612T2 (de
Inventor
Greg E Blonder
William Michel Macdonald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69320612D1 publication Critical patent/DE69320612D1/de
Application granted granted Critical
Publication of DE69320612T2 publication Critical patent/DE69320612T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69320612T 1993-01-14 1993-12-08 Gehäusung bestehend aus unter Druck zusammengestetzten Teilen Expired - Fee Related DE69320612T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/004,361 US5291572A (en) 1993-01-14 1993-01-14 Article comprising compression bonded parts

Publications (2)

Publication Number Publication Date
DE69320612D1 true DE69320612D1 (de) 1998-10-01
DE69320612T2 DE69320612T2 (de) 1999-02-11

Family

ID=21710409

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69320612T Expired - Fee Related DE69320612T2 (de) 1993-01-14 1993-12-08 Gehäusung bestehend aus unter Druck zusammengestetzten Teilen

Country Status (4)

Country Link
US (1) US5291572A (de)
EP (1) EP0606725B1 (de)
JP (1) JPH06236933A (de)
DE (1) DE69320612T2 (de)

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IT1255953B (it) * 1992-10-30 1995-11-17 Pirelli Cavi Spa Amplificatore ottico compatto a funzioni separate
JPH06204566A (ja) * 1992-10-14 1994-07-22 Fujitsu Ltd 光ファイバ・光素子結合用パッケージ及び光ファイバ・光素子モジュール
US5415730A (en) * 1993-12-14 1995-05-16 At&T Corp. Metal coated optical fiber techniques
CA2139086C (en) * 1993-12-27 2000-06-13 Kiyoto Matsumoto Light-receiving structure for waveguide type optical devices
US5535296A (en) * 1994-09-28 1996-07-09 Optobahn Corporation Integrated optoelectronic coupling and connector
US5940562A (en) * 1996-03-12 1999-08-17 Minnesota Mining And Manufacturing Company Stubless optoelectronic device receptacle
JPH09318849A (ja) * 1996-05-24 1997-12-12 Fujitsu Ltd 光伝送モジュールおよびその製造方法
US5848211A (en) * 1996-08-28 1998-12-08 Hewlett-Packard Company Photonics module having its components mounted on a single mounting member
US5771323A (en) * 1996-08-28 1998-06-23 Hewlett-Packard Company Micro-photonics module
US5731904A (en) * 1996-08-28 1998-03-24 Hewlett-Packard Co. Fabricating an optical device having at least an optical filter and a mirror
US5808293A (en) * 1996-08-28 1998-09-15 Hewlett-Packard Company Photo detector with an integrated mirror and a method of making the same
US5862283A (en) * 1996-08-28 1999-01-19 Hewlett-Packard Company Mounting a planar optical component on a mounting member
DE19711283A1 (de) * 1997-03-18 1998-10-29 Siemens Ag Hermetisch dichtes optisches Sendemodul
GB2325080A (en) * 1997-05-07 1998-11-11 Mitel Semiconductor Ab Mountings for semiconductor light emitting devices
US5896481A (en) * 1997-05-30 1999-04-20 The Boeing Company Optical subassembly with a groove for aligning an optical device with an optical fiber
US5930429A (en) * 1997-07-01 1999-07-27 Hewlett-Packard Company Micro-photonics module integrated on a single substrate
US5937114A (en) * 1997-07-21 1999-08-10 Hewlett-Packard Company Micro-photonics module with a partition wall
US6521989B2 (en) * 1998-10-08 2003-02-18 Honeywell Inc. Methods and apparatus for hermetically sealing electronic packages
WO2000055665A2 (en) * 1999-03-16 2000-09-21 Framatome Connectors International Modular optoelectronic connector
US6400009B1 (en) 1999-10-15 2002-06-04 Lucent Technologies Inc. Hermatic firewall for MEMS packaging in flip-chip bonded geometry
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6883977B2 (en) 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
JP2002198664A (ja) * 2000-12-26 2002-07-12 Seiko Instruments Inc 携帯電子機器
US6611001B2 (en) * 2001-02-06 2003-08-26 Lucent Technologies Inc. Laser package
US7669666B2 (en) * 2001-03-29 2010-03-02 Planetair Turf Products, Llc Aeration device
US7078671B1 (en) * 2001-08-06 2006-07-18 Shipley Company, L.L.C. Silicon optical microbench devices and wafer-level testing thereof
US6786654B2 (en) 2002-08-21 2004-09-07 Hymite A/S Encapsulated optical fiber end-coupled device
WO2004097474A1 (en) * 2003-04-29 2004-11-11 Xponent Photonics Inc Surface-mounted photodetector for an optical waveguide
EP1517166B1 (de) 2003-09-15 2015-10-21 Nuvotronics, LLC Vorrichtungsgehäuse und Verfahren zu derer Prüfung und Herstellung
TWI226469B (en) * 2003-12-19 2005-01-11 Ind Tech Res Inst Device for assembling and measuring an optical transceiver
JP2005251838A (ja) * 2004-03-02 2005-09-15 Sharp Corp 半導体レーザ装置
CN104925744A (zh) * 2004-11-04 2015-09-23 微芯片生物技术公司 压入式冷焊密封方法和装置
DE102007054505B4 (de) 2007-11-15 2016-12-22 Robert Bosch Gmbh Drehratensensor
DE102008038993B4 (de) * 2008-08-13 2011-06-22 Karlsruher Institut für Technologie, 76131 Optisches Element und Verfahren zu seiner Herstellung
JP5197714B2 (ja) * 2010-10-29 2013-05-15 三菱電機株式会社 流量検出装置
US10105544B2 (en) * 2016-08-30 2018-10-23 Pacesetter, Inc. Implantable medical devices including a laser etched surface in bonded areas
CN107316906B (zh) * 2017-06-22 2020-03-27 京东方科技集团股份有限公司 Ltps基板及其制作方法、薄膜晶体管、阵列基板和显示装置
FR3071354A1 (fr) 2017-09-18 2019-03-22 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique comprenant un substrat de support et un capot d'encapsulation d'un composant electronique
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

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US4119363A (en) * 1976-03-18 1978-10-10 Bell Telephone Laboratories Incorporated Package for optical devices including optical fiber-to-metal hermetic seal
JPS5454572A (en) * 1977-10-11 1979-04-28 Toshiba Corp Semiconductor device
US5083031A (en) * 1986-08-19 1992-01-21 International Sensor Technology, Inc. Radiation dosimeters
FR2623013A1 (fr) * 1987-11-06 1989-05-12 Commissariat Energie Atomique Source d'electrons a cathodes emissives a micropointes et dispositif de visualisation par cathodoluminescence excitee par emission de champ,utilisant cette source
US4937653A (en) * 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
US4876457A (en) * 1988-10-31 1989-10-24 American Telephone And Telegraph Company Method and apparatus for differentiating a planar textured surface from a surrounding background
US4895291A (en) * 1989-05-04 1990-01-23 Eastman Kodak Company Method of making a hermetic seal in a solid-state device
US5023881A (en) * 1990-06-19 1991-06-11 At&T Bell Laboratories Photonics module and alignment method
US5124281A (en) * 1990-08-27 1992-06-23 At&T Bell Laboratories Method of fabricating a photonics module comprising a spherical lens

Also Published As

Publication number Publication date
JPH06236933A (ja) 1994-08-23
EP0606725B1 (de) 1998-08-26
US5291572A (en) 1994-03-01
EP0606725A1 (de) 1994-07-20
DE69320612T2 (de) 1999-02-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee