DE69317180D1 - Verfahren zur Herstellung von IC-Karten - Google Patents

Verfahren zur Herstellung von IC-Karten

Info

Publication number
DE69317180D1
DE69317180D1 DE69317180T DE69317180T DE69317180D1 DE 69317180 D1 DE69317180 D1 DE 69317180D1 DE 69317180 T DE69317180 T DE 69317180T DE 69317180 T DE69317180 T DE 69317180T DE 69317180 D1 DE69317180 D1 DE 69317180D1
Authority
DE
Germany
Prior art keywords
cards
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69317180T
Other languages
English (en)
Other versions
DE69317180T2 (de
Inventor
Toyoji Kanazawa
Shingo Ichikawa
Hiroyuki Kaneko
Hisataro Watada
Toshibumi Wakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4251999A external-priority patent/JPH0672084A/ja
Priority claimed from JP4289526A external-priority patent/JPH06115285A/ja
Priority claimed from JP28952592A external-priority patent/JP3351827B2/ja
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of DE69317180D1 publication Critical patent/DE69317180D1/de
Application granted granted Critical
Publication of DE69317180T2 publication Critical patent/DE69317180T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
DE69317180T 1992-08-28 1993-08-24 Verfahren zur Herstellung von IC-Karten Expired - Fee Related DE69317180T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4251999A JPH0672084A (ja) 1992-08-28 1992-08-28 Ｉｃカードの製造方法
JP4289526A JPH06115285A (ja) 1992-10-02 1992-10-02 カード基板の歪除去方法
JP28952592A JP3351827B2 (ja) 1992-10-02 1992-10-02 カード基板への凹部形成方法

Publications (2)

Publication Number Publication Date
DE69317180D1 true DE69317180D1 (de) 1998-04-09
DE69317180T2 DE69317180T2 (de) 1998-10-08

Family

ID=27334078

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69317180T Expired - Fee Related DE69317180T2 (de) 1992-08-28 1993-08-24 Verfahren zur Herstellung von IC-Karten

Country Status (3)

Country Link
US (1) US6036797A (de)
EP (1) EP0585111B1 (de)
DE (1) DE69317180T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08279150A (ja) * 1995-02-09 1996-10-22 Shoei Insatsu Kk 識別カード、この識別カードの製造方法およびこの製造方法に用いる実質的な無配向加熱球晶化ポリエチレンテレフタレート樹脂シート
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
BR9804917A (pt) * 1997-05-19 2000-01-25 Hitachi Maxell Ltda Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação.
DE10111683C1 (de) * 2001-03-09 2002-11-21 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgerkörpers
DE60336054D1 (de) * 2002-05-08 2011-03-31 Lasercard Corp Verfahren zur herstellung einer sicheren persönlichen datenkarte
US6930231B1 (en) * 2003-11-25 2005-08-16 William Von Luhmann Method of producing guitar picks from identification cards
DE102007016779B4 (de) * 2007-04-04 2015-03-19 Bundesdruckerei Gmbh Verfahren zur Herstellung von Kavitäten in Sicherheitsdokumenten, insbesondere Chipkarten
EP2323076A1 (de) * 2009-11-12 2011-05-18 Gemalto SA Bearbeitungsverfahren eines Kartenkörpers und entsprechende Bearbeitungsstation
EP2461275A1 (de) * 2010-12-02 2012-06-06 Gemalto SA Sicherheitsdokument und Verfahren zur Herstellung von Sicherheitsdokumenten
US8403390B2 (en) * 2011-03-10 2013-03-26 Shiloh Industries, Inc. Vehicle panel assembly and method of attaching the same
FR2981294B1 (fr) * 2011-10-13 2013-12-20 Oberthur Technologies Procede de fabrication d'un support destine a recevoir un dispositif electronique et le support correspondant
USD983261S1 (en) 2019-12-20 2023-04-11 Capital One Services, Llc Vented laminated card
DE102022003764A1 (de) 2022-10-12 2024-04-18 Giesecke+Devrient ePayments GmbH Modulträgerband

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3508754A (en) * 1967-09-28 1970-04-28 Chromographic Press Inc Stacked sheet article with release coated removable areas
DE3122981A1 (de) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zum einbau von ic-bausteinen in ausweiskarten
JPS62154868U (de) * 1985-08-09 1987-10-01
JPS62169880A (ja) * 1986-01-22 1987-07-27 Kanzaki Paper Mfg Co Ltd 粘着シ−トの製造法
FR2625350B1 (fr) * 1987-12-29 1991-05-24 Bull Cp8 Carte a microcircuits electroniques et procede de fabrication de cette carte
DE68923686T2 (de) * 1988-04-20 1996-01-25 Matsushita Electric Ind Co Ltd Halbleiterkarte und verfahren zur herstellung.
US4923545A (en) * 1988-09-23 1990-05-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of insetting predesigned disbond areas into composite laminates
DE69020077T2 (de) * 1989-09-09 1995-11-09 Mitsubishi Electric Corp Integrierte Schaltungskarte.

Also Published As

Publication number Publication date
DE69317180T2 (de) 1998-10-08
EP0585111A1 (de) 1994-03-02
US6036797A (en) 2000-03-14
EP0585111B1 (de) 1998-03-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee