DE69227859T2 - Verfahren zur Herstellung einer Verpackung zur Unterbringung von elektronischen Elementen - Google Patents

Verfahren zur Herstellung einer Verpackung zur Unterbringung von elektronischen Elementen

Info

Publication number
DE69227859T2
DE69227859T2 DE69227859T DE69227859T DE69227859T2 DE 69227859 T2 DE69227859 T2 DE 69227859T2 DE 69227859 T DE69227859 T DE 69227859T DE 69227859 T DE69227859 T DE 69227859T DE 69227859 T2 DE69227859 T2 DE 69227859T2
Authority
DE
Germany
Prior art keywords
packaging
manufacture
storage
electronic elements
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69227859T
Other languages
English (en)
Other versions
DE69227859D1 (de
DE69227859T4 (de
Inventor
Takaharu Miyamoto
Fumio Miyagawa
Tsutomu Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3141215A external-priority patent/JPH04340256A/ja
Priority claimed from JP4084779A external-priority patent/JPH0590433A/ja
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Application granted granted Critical
Publication of DE69227859T2 publication Critical patent/DE69227859T2/de
Publication of DE69227859T4 publication Critical patent/DE69227859T4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
DE69227859T 1991-05-16 1992-05-15 Verfahren zur Herstellung einer Verpackung zur Unterbringung von elektronischen Elementen Expired - Lifetime DE69227859T4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3141215A JPH04340256A (ja) 1991-05-16 1991-05-16 高周波用電子構造部品
JP19494291 1991-07-08
JP4084779A JPH0590433A (ja) 1991-07-08 1992-03-06 電子部品用パツケージのメタル壁形成方法

Publications (2)

Publication Number Publication Date
DE69227859T2 true DE69227859T2 (de) 1999-05-20
DE69227859T4 DE69227859T4 (de) 1999-12-23

Family

ID=27304654

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69227859A Expired - Fee Related DE69227859D1 (de) 1991-05-16 1992-05-15 Verfahren zur Herstellung einer Verpackung zur Unterbringung von elektronischen Elementen
DE69227859T Expired - Lifetime DE69227859T4 (de) 1991-05-16 1992-05-15 Verfahren zur Herstellung einer Verpackung zur Unterbringung von elektronischen Elementen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69227859A Expired - Fee Related DE69227859D1 (de) 1991-05-16 1992-05-15 Verfahren zur Herstellung einer Verpackung zur Unterbringung von elektronischen Elementen

Country Status (3)

Country Link
US (1) US5277357A (de)
EP (1) EP0514213B1 (de)
DE (2) DE69227859D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9304041D0 (en) * 1993-02-27 1993-04-14 British Aerospace Forming of metal articles
DE4321036A1 (de) * 1993-06-24 1995-01-05 Fichtel & Sachs Ag Schwingungsdämpfer mit Zuganschlagbegrenzungshalter
US5628114A (en) * 1995-06-26 1997-05-13 Stern; Mel Screen frame and method of manufacture thereof
US5893435A (en) * 1995-12-20 1999-04-13 Fichtel & Sachs Ag Vibration damper for a motor vehicle, the vibration damper having a decompression stop boundary bracket
FR2759847B1 (fr) * 1997-02-14 1999-05-07 Egide Sa Boitier opto-electronique a insert ceramique
DE69820490T2 (de) * 1998-06-11 2004-10-07 Hong-Soon Park Vorrichtung zum formen von schneidplatten für drucksachen
US10357127B2 (en) * 2004-07-02 2019-07-23 Food Equipment Technologies Company, Inc. Sheet metal beverage brewer housing and method of making same
US20060105192A1 (en) * 2004-11-12 2006-05-18 Fernandez William L Pre-creased sheet metal coil stock
EP2952944B1 (de) * 2013-01-29 2019-01-09 Kyocera Corporation Verpackung zur aufnahme eines optischen halbleiterbauelements und optisches halbleiterbauelement

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1455525A (en) * 1922-01-27 1923-05-15 Henry B Finley Method of manufacturing sheet-metal receptacles or containers
US1785025A (en) * 1927-12-02 1930-12-16 Guarsteel Safety Stair Co Square tubing for newel posts
US3075487A (en) * 1958-05-05 1963-01-29 Arthur I Appleton Method of making a sealed electrical box
US3409976A (en) * 1966-01-13 1968-11-12 Gen Motors Corp Method of assembling an outer shell
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
US3925883A (en) * 1974-03-22 1975-12-16 Varian Associates Method for making waveguide components
US4262300A (en) * 1978-11-03 1981-04-14 Isotronics, Inc. Microcircuit package formed of multi-components
JPS5744420A (en) * 1980-08-29 1982-03-12 Matsushita Electric Works Ltd Roll forming method for metallic sheet
SE8102351L (sv) * 1981-04-13 1982-10-14 Plannja Ab Forfarande for att astadkomma bockning
EP0233824A3 (de) * 1986-02-19 1989-06-14 Isotronics, Inc. Gehäuse für Mikroschaltungen
DE3904219C2 (de) * 1988-11-03 1998-12-10 Technotron Elektrotechnische G Verfahren zur Herstellung einer hermetisch verschließbaren Gehäusewanne für ein Hybridschaltkreisgehäuse und danach hergestellte Gehäusewanne
US4991291A (en) * 1989-12-29 1991-02-12 Isotronics, Inc. Method for fabricating a fold-up frame

Also Published As

Publication number Publication date
DE69227859D1 (de) 1999-01-28
EP0514213B1 (de) 1998-12-16
EP0514213A3 (en) 1993-05-19
EP0514213A2 (de) 1992-11-19
DE69227859T4 (de) 1999-12-23
US5277357A (en) 1994-01-11

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