DE69224536D1 - Verwendung von fresnelschen zonenplatten für materialbearbeitung - Google Patents
Verwendung von fresnelschen zonenplatten für materialbearbeitungInfo
- Publication number
- DE69224536D1 DE69224536D1 DE69224536T DE69224536T DE69224536D1 DE 69224536 D1 DE69224536 D1 DE 69224536D1 DE 69224536 T DE69224536 T DE 69224536T DE 69224536 T DE69224536 T DE 69224536T DE 69224536 D1 DE69224536 D1 DE 69224536D1
- Authority
- DE
- Germany
- Prior art keywords
- fresnel zone
- fzp
- workpiece
- hole
- deflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003754 machining Methods 0.000 title abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Polymerisation Methods In General (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1992/005555 WO1994001240A1 (en) | 1992-07-01 | 1992-07-01 | Use of fresnel zone plates for material processing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69224536D1 true DE69224536D1 (de) | 1998-04-02 |
DE69224536T2 DE69224536T2 (de) | 1998-09-10 |
Family
ID=22231213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69224536T Expired - Fee Related DE69224536T2 (de) | 1992-07-01 | 1992-07-01 | Verwendung von fresnelschen zonenplatten für materialbearbeitung |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0648154B1 (de) |
JP (1) | JPH08504132A (de) |
AT (1) | ATE163381T1 (de) |
DE (1) | DE69224536T2 (de) |
DK (1) | DK0648154T3 (de) |
ES (1) | ES2114943T3 (de) |
WO (1) | WO1994001240A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9601049D0 (en) | 1996-01-18 | 1996-03-20 | Xaar Ltd | Methods of and apparatus for forming nozzles |
FR2748412B1 (fr) * | 1996-05-07 | 1998-06-19 | Solaic Sa | Procede de decoupe d'une plaque en matiere plastique |
US6544104B1 (en) * | 1999-08-27 | 2003-04-08 | Asahi Kasei Kabushiki Kaisha | Polishing pad and polisher |
GB9922082D0 (en) * | 1999-09-17 | 1999-11-17 | Isis Innovation | Laser apparatus for use in material processing |
CN110303244B (zh) * | 2019-07-25 | 2020-11-27 | 中国工程物理研究院激光聚变研究中心 | 一种快速制备表面周期结构方法 |
CN113345619B (zh) * | 2021-06-16 | 2022-07-12 | 中国工程物理研究院激光聚变研究中心 | 一维x射线折射闪耀波带片 |
JP2023021574A (ja) * | 2021-08-02 | 2023-02-14 | 株式会社Screenホールディングス | 光照射装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5223693A (en) * | 1990-04-28 | 1993-06-29 | Mitsubishi Denki Kabushiki Kaisha | Optical machining apparatus |
-
1992
- 1992-07-01 DE DE69224536T patent/DE69224536T2/de not_active Expired - Fee Related
- 1992-07-01 ES ES92915314T patent/ES2114943T3/es not_active Expired - Lifetime
- 1992-07-01 JP JP6503975A patent/JPH08504132A/ja active Pending
- 1992-07-01 WO PCT/US1992/005555 patent/WO1994001240A1/en active IP Right Grant
- 1992-07-01 EP EP92915314A patent/EP0648154B1/de not_active Expired - Lifetime
- 1992-07-01 AT AT92915314T patent/ATE163381T1/de not_active IP Right Cessation
- 1992-07-01 DK DK92915314T patent/DK0648154T3/da active
Also Published As
Publication number | Publication date |
---|---|
ATE163381T1 (de) | 1998-03-15 |
ES2114943T3 (es) | 1998-06-16 |
EP0648154A1 (de) | 1995-04-19 |
DK0648154T3 (da) | 1998-09-23 |
DE69224536T2 (de) | 1998-09-10 |
EP0648154B1 (de) | 1998-02-25 |
WO1994001240A1 (en) | 1994-01-20 |
JPH08504132A (ja) | 1996-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5362940A (en) | Use of Fresnel zone plates for material processing | |
DE69305340T2 (de) | Verfahren und gerät zur beleuchtung von punkten auf einem träger | |
ES2146620T3 (es) | Proceso y aparato de soldadura y otros tratamientos termicos. | |
US5103073A (en) | Device for laser treatment of an object | |
CA2146798C (en) | Laser transfer machining apparatus | |
DE102004033151A1 (de) | Bearbeitungsvorrichtung unter Verwendung eines Laserstrahls | |
DE3063065D1 (en) | Device for the treatment of a workpiece with a laser beam | |
BR8907546A (pt) | Processo e dispositivo para a usinagem de pecas de trabalho com radiacao a laser | |
DE69115716D1 (de) | Vorrichtung zum eingravieren mit einem laserstrahl | |
ATE132785T1 (de) | Zielbereichprofilierung von optischen oberflächen durch ecimer laser lichtabschmelzung | |
KR900008299A (ko) | 조명방법 및 그 장치와 투영식 노출방법 및 그 장치 | |
CA2037063A1 (en) | Optical Machining Apparatus | |
WO1995030932A1 (en) | High power phase masks for imaging systems | |
DE19933825B4 (de) | Laserbearbeitungsvorrichtung | |
DE69224536D1 (de) | Verwendung von fresnelschen zonenplatten für materialbearbeitung | |
KR900019162A (ko) | 리니어 프레스넬 존 플레이트(Linear Fresnel Zone Plate)를 사용한 마스크와 반도체 웨이퍼의 위치맞춤 시스템 및 방법 | |
CA2228514A1 (en) | Monitoring of covert marks | |
KR930017251A (ko) | 표면 방출 분산 피드백 반도체 레이저 다이오드 장치에 춰엎드 회절격자를 제조하기 위한장치 | |
JPS57181537A (en) | Light pattern projector | |
JP3216987B2 (ja) | レーザ転写加工装置およびレーザ転写加工方法 | |
US5223912A (en) | Method and device for measuring at least one transverse dimension of a textile yarn | |
JPS55109589A (en) | Laser welding method utilizing elevation of lens | |
JPS57142785A (en) | Automatic marking device | |
DE102020116897B4 (de) | Laserprojektor mit zwei Laserdioden | |
EP0325103A3 (de) | Methode zum Aufbau eines optischen Kopfes durch Veränderung eines Hologrammrasters |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee | ||
8370 | Indication related to discontinuation of the patent is to be deleted | ||
8339 | Ceased/non-payment of the annual fee |