ATE163381T1 - Verwendung von fresnelschen zonenplatten für materialbearbeitung - Google Patents

Verwendung von fresnelschen zonenplatten für materialbearbeitung

Info

Publication number
ATE163381T1
ATE163381T1 AT92915314T AT92915314T ATE163381T1 AT E163381 T1 ATE163381 T1 AT E163381T1 AT 92915314 T AT92915314 T AT 92915314T AT 92915314 T AT92915314 T AT 92915314T AT E163381 T1 ATE163381 T1 AT E163381T1
Authority
AT
Austria
Prior art keywords
fzp
fresnel zone
workpiece
hole
deflection
Prior art date
Application number
AT92915314T
Other languages
English (en)
Inventor
Bruce G Macdonald
Robert O Hunter Jr
Adlai H Smith
Clark C Guest
Original Assignee
Litel Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litel Instr Inc filed Critical Litel Instr Inc
Application granted granted Critical
Publication of ATE163381T1 publication Critical patent/ATE163381T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Polymerisation Methods In General (AREA)
AT92915314T 1992-07-01 1992-07-01 Verwendung von fresnelschen zonenplatten für materialbearbeitung ATE163381T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1992/005555 WO1994001240A1 (en) 1992-07-01 1992-07-01 Use of fresnel zone plates for material processing

Publications (1)

Publication Number Publication Date
ATE163381T1 true ATE163381T1 (de) 1998-03-15

Family

ID=22231213

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92915314T ATE163381T1 (de) 1992-07-01 1992-07-01 Verwendung von fresnelschen zonenplatten für materialbearbeitung

Country Status (7)

Country Link
EP (1) EP0648154B1 (de)
JP (1) JPH08504132A (de)
AT (1) ATE163381T1 (de)
DE (1) DE69224536T2 (de)
DK (1) DK0648154T3 (de)
ES (1) ES2114943T3 (de)
WO (1) WO1994001240A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
FR2748412B1 (fr) * 1996-05-07 1998-06-19 Solaic Sa Procede de decoupe d'une plaque en matiere plastique
JP3867844B2 (ja) * 1999-08-27 2007-01-17 旭化成エレクトロニクス株式会社 研磨パッドおよび研磨装置
GB9922082D0 (en) * 1999-09-17 1999-11-17 Isis Innovation Laser apparatus for use in material processing
CN110303244B (zh) * 2019-07-25 2020-11-27 中国工程物理研究院激光聚变研究中心 一种快速制备表面周期结构方法
CN113345619B (zh) * 2021-06-16 2022-07-12 中国工程物理研究院激光聚变研究中心 一维x射线折射闪耀波带片
JP2023021574A (ja) * 2021-08-02 2023-02-14 株式会社Ｓｃｒｅｅｎホールディングス 光照射装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus

Also Published As

Publication number Publication date
ES2114943T3 (es) 1998-06-16
DE69224536T2 (de) 1998-09-10
DK0648154T3 (da) 1998-09-23
JPH08504132A (ja) 1996-05-07
WO1994001240A1 (en) 1994-01-20
DE69224536D1 (de) 1998-04-02
EP0648154B1 (de) 1998-02-25
EP0648154A1 (de) 1995-04-19

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee