DE69223057D1 - Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine - Google Patents

Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine

Info

Publication number
DE69223057D1
DE69223057D1 DE69223057T DE69223057T DE69223057D1 DE 69223057 D1 DE69223057 D1 DE 69223057D1 DE 69223057 T DE69223057 T DE 69223057T DE 69223057 T DE69223057 T DE 69223057T DE 69223057 D1 DE69223057 D1 DE 69223057D1
Authority
DE
Germany
Prior art keywords
milling machine
numerically controlled
clamping board
controlled milling
vacuum clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69223057T
Other languages
English (en)
Other versions
DE69223057T2 (de
Inventor
Nobuyoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heian Corp
Original Assignee
Heian Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heian Corp filed Critical Heian Corp
Publication of DE69223057D1 publication Critical patent/DE69223057D1/de
Application granted granted Critical
Publication of DE69223057T2 publication Critical patent/DE69223057T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Milling, Drilling, And Turning Of Wood (AREA)
  • Jigs For Machine Tools (AREA)
DE1992623057 1992-12-21 1992-12-22 Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine Expired - Fee Related DE69223057T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/994,549 US5323821A (en) 1992-12-21 1992-12-21 Suction table apparatus of a numerical control router
EP19920311723 EP0603438B1 (de) 1992-12-21 1992-12-22 Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine

Publications (2)

Publication Number Publication Date
DE69223057D1 true DE69223057D1 (de) 1997-12-11
DE69223057T2 DE69223057T2 (de) 1998-05-14

Family

ID=26132309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1992623057 Expired - Fee Related DE69223057T2 (de) 1992-12-21 1992-12-22 Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine

Country Status (4)

Country Link
US (1) US5323821A (de)
EP (1) EP0603438B1 (de)
DE (1) DE69223057T2 (de)
ES (1) ES2112304T3 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4337739C1 (de) * 1993-11-05 1994-08-25 Klessmann Ima Norte Maschfab Bearbeitungszentrum zum spangebenden Bearbeiten von plattenförmigen Werkstücken
US5987729A (en) * 1994-06-24 1999-11-23 Moran; Thomas F. Multiple plenum suction hold down device
US5582225A (en) * 1995-05-22 1996-12-10 Schank; Earle Dust free work bench
NL1003174C2 (nl) * 1996-05-21 1997-11-25 Groot Machine Service B V De Werkwijze voor het vervaardigen van meubelpanelen.
DE19700839C2 (de) * 1997-01-13 2000-06-08 Siemens Ag Chuckanordnung
JP2913472B2 (ja) * 1997-06-20 1999-06-28 株式会社平安コーポレーション 防塵構造を備えたｎｃルータ
US6012199A (en) * 1998-01-07 2000-01-11 Litomisky; Petr Refuse vacuum system for machine shops
US5979519A (en) * 1998-07-28 1999-11-09 Thermwood Corporation Machine tool having improved means for holding workpieces
US9199315B2 (en) 2000-06-02 2015-12-01 Kennametal Inc. Twist drill and method for producing a twist drill which method includes forming a flute of a twist drill
DE10203491A1 (de) * 2002-01-30 2003-07-31 Helmut Reccius Umformwerkzeug
US6764434B1 (en) * 2002-05-16 2004-07-20 Wilhelm Volk Multi-station machining center
US7272882B1 (en) * 2006-03-02 2007-09-25 C. R. Onsrud, Inc. Multiple table routing machine with roller hold-down
US7591619B1 (en) * 2008-04-01 2009-09-22 Buffalo Machinery Co., Ltd. Machining apparatus
TWI540089B (zh) * 2013-05-17 2016-07-01 由田新技股份有限公司 一種工作機及其上的真空吸附式承載裝置
CN109676552A (zh) * 2019-01-31 2019-04-26 中山大学 一种吸附力均匀的真空吸附平台

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066249A (en) * 1977-05-11 1978-01-03 Grumman Aerospace Corporation Modular vacuum work area
US4313478A (en) * 1979-09-18 1982-02-02 Helan Iron Works, Ltd. Wood working router
JPS5680141A (en) * 1979-12-04 1981-07-01 Seiko Epson Corp Manufacture device of semiconductor
US4532839A (en) * 1983-12-21 1985-08-06 Tektronix, Inc. Method for simultaneously cutting a plurality of circuit boards
JPS61258239A (ja) * 1985-05-10 1986-11-15 Dainippon Screen Mfg Co Ltd シ−ト材の吸着保持装置
JPS63312035A (ja) * 1987-06-10 1988-12-20 Hitachi Ltd 薄板保持装置
US4949942A (en) * 1989-11-13 1990-08-21 Isao Shoda Table exchanging device for wood working machine
US5094282A (en) * 1990-01-25 1992-03-10 Heian Corporated Lumber processing apparatus
US5203547A (en) * 1990-11-29 1993-04-20 Canon Kabushiki Kaisha Vacuum attraction type substrate holding device
GB9026732D0 (en) * 1990-12-08 1991-01-30 Carne Ufm Ltd Vacuum plates
US5141212A (en) * 1991-04-08 1992-08-25 Ekstrom Carlson & Co. Vacuum chuck with foam workpiece-supporting surface

Also Published As

Publication number Publication date
ES2112304T3 (es) 1998-04-01
EP0603438B1 (de) 1997-11-05
DE69223057T2 (de) 1998-05-14
EP0603438A1 (de) 1994-06-29
US5323821A (en) 1994-06-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee