DE69211828T2 - Verfahren zum Verdrahten eines Laserarrays - Google Patents

Verfahren zum Verdrahten eines Laserarrays

Info

Publication number
DE69211828T2
DE69211828T2 DE69211828T DE69211828T DE69211828T2 DE 69211828 T2 DE69211828 T2 DE 69211828T2 DE 69211828 T DE69211828 T DE 69211828T DE 69211828 T DE69211828 T DE 69211828T DE 69211828 T2 DE69211828 T2 DE 69211828T2
Authority
DE
Germany
Prior art keywords
wiring
laser array
laser
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69211828T
Other languages
English (en)
Other versions
DE69211828D1 (de
Inventor
Pascal Roustin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Hybrides
Original Assignee
Thomson Hybrides
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Hybrides filed Critical Thomson Hybrides
Publication of DE69211828D1 publication Critical patent/DE69211828D1/de
Application granted granted Critical
Publication of DE69211828T2 publication Critical patent/DE69211828T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
DE69211828T 1991-12-20 1992-12-14 Verfahren zum Verdrahten eines Laserarrays Expired - Fee Related DE69211828T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9115899A FR2685561B1 (fr) 1991-12-20 1991-12-20 Procede de cablage d'une barrette de lasers et barrette cablee par ce procede.

Publications (2)

Publication Number Publication Date
DE69211828D1 DE69211828D1 (de) 1996-08-01
DE69211828T2 true DE69211828T2 (de) 1996-11-28

Family

ID=9420304

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69211828T Expired - Fee Related DE69211828T2 (de) 1991-12-20 1992-12-14 Verfahren zum Verdrahten eines Laserarrays

Country Status (6)

Country Link
US (1) US5307360A (de)
EP (1) EP0549405B1 (de)
JP (1) JPH05243681A (de)
CA (1) CA2084918A1 (de)
DE (1) DE69211828T2 (de)
FR (1) FR2685561B1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729563A (en) * 1994-07-07 1998-03-17 Hewlett-Packard Company Method and apparatus for optically and thermally isolating surface emitting laser diodes
JP4462657B2 (ja) * 1998-06-04 2010-05-12 ソニー株式会社 半導体発光素子およびその製造方法
DE10353679A1 (de) * 2003-11-17 2005-06-02 Siemens Ag Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module
JP7023154B2 (ja) * 2018-03-28 2022-02-21 芝浦メカトロニクス株式会社 電子部品実装装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3531735A (en) * 1966-06-28 1970-09-29 Gen Electric Semiconductor laser having grooves to prevent radiation transverse to the optical axis
CA1267468A (en) * 1983-11-21 1990-04-03 Hideaki Nishizawa Optical device package
JPS63318188A (ja) * 1987-06-19 1988-12-27 Sharp Corp 半導体レ−ザアレイ装置
JPH01136385A (ja) * 1987-11-24 1989-05-29 Canon Inc 半導体レーザ装置
JPH0448674A (ja) * 1990-06-14 1992-02-18 Rohm Co Ltd 半導体レーザ

Also Published As

Publication number Publication date
DE69211828D1 (de) 1996-08-01
US5307360A (en) 1994-04-26
FR2685561A1 (fr) 1993-06-25
JPH05243681A (ja) 1993-09-21
CA2084918A1 (fr) 1993-06-21
EP0549405A1 (de) 1993-06-30
FR2685561B1 (fr) 1994-02-04
EP0549405B1 (de) 1996-06-26

Similar Documents

Publication Publication Date Title
DE69215130D1 (de) System zum Einführen eines Gefässerweiterungsgerätes
DE59406372D1 (de) Verfahren zum herstellen eines dredidimensionalen objekts
DE59607837D1 (de) Verfahren zum kontinuierlichen ersintern eines granulats
DE68923247T2 (de) Verfahren zum Erzeugen eines Fotolackmusters.
DE69334194D1 (de) Verfahren zum Erzeugen einer Halbleitervorrichtung
DE69615924D1 (de) Verfahren zum Planen eines modularen Druckgeräts
DE69225853T2 (de) Verfahren zum Erzeugen eines allseitig wirkenden Abtastmusters
DE69218682D1 (de) Verfahren zum austesten eines softwareprogramms
DE69408862D1 (de) Vorrichtung zum verdrahten eines verbinders
ATA104688A (de) Verfahren zum biegen eines werkstueckes
DE59402318D1 (de) Verfahren zum erzeugen eines anregesignals
DE59205110D1 (de) Verfahren zum Montieren eines Anschlusselementes
DE69215050D1 (de) Verfahren zum Aktivieren eines Katalysators
DE69616735D1 (de) Verfahren zum schrittbetrieb eines roboters
DE69215855T2 (de) Verfahren zum laserdurchbohren
DE69211828D1 (de) Verfahren zum Verdrahten eines Laserarrays
DE69216814D1 (de) Verfahren zum steuern eines roboters
DE69419055T2 (de) Vorrichtung zum Erzeugen eines Synchronisierungssignals
DE69103203T2 (de) Verfahren zum Beschichten eines Werkstücks.
DE59003171D1 (de) Verfahren zum gegenläufigen biegen eines bleches.
DE69312952T2 (de) Verfahren zum Reinigen eines Thermokopfes
DE59200756D1 (de) Verfahren zum Zünden eines Vergasungsreaktors.
DE59308270D1 (de) Vorrichtung zum Erfassen eines Signales
ATA273388A (de) Verfahren zum schweissen
DE69213443D1 (de) Vorrichtung zum Verbinden eines Werkstücks

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee