DE69210622D1 - Zusammensetzung zum stabilisieren anorganischer peroxidlösungen - Google Patents
Zusammensetzung zum stabilisieren anorganischer peroxidlösungenInfo
- Publication number
- DE69210622D1 DE69210622D1 DE69210622T DE69210622T DE69210622D1 DE 69210622 D1 DE69210622 D1 DE 69210622D1 DE 69210622 T DE69210622 T DE 69210622T DE 69210622 T DE69210622 T DE 69210622T DE 69210622 D1 DE69210622 D1 DE 69210622D1
- Authority
- DE
- Germany
- Prior art keywords
- composition
- inorganic peroxide
- peroxide solutions
- stabilizing inorganic
- stabilizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- ing And Chemical Polishing (AREA)
- Detergent Compositions (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI912845A IT1251431B (it) | 1991-10-25 | 1991-10-25 | Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali |
PCT/EP1992/002442 WO1993008317A1 (fr) | 1991-10-25 | 1992-10-23 | Composition stabilisante de solutions de peroxydes inorganiques |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69210622D1 true DE69210622D1 (de) | 1996-06-13 |
DE69210622T2 DE69210622T2 (de) | 1996-11-28 |
Family
ID=11360958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69210622T Expired - Fee Related DE69210622T2 (de) | 1991-10-25 | 1992-10-23 | Zusammensetzung zum stabilisieren anorganischer peroxidlösungen |
Country Status (11)
Country | Link |
---|---|
US (1) | US5538152A (de) |
EP (1) | EP0609342B1 (de) |
JP (1) | JPH07500378A (de) |
KR (1) | KR100249061B1 (de) |
BR (1) | BR9206668A (de) |
CA (1) | CA2121691A1 (de) |
DE (1) | DE69210622T2 (de) |
ES (1) | ES2089573T3 (de) |
FI (1) | FI100727B (de) |
IT (1) | IT1251431B (de) |
WO (1) | WO1993008317A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2247593T3 (es) * | 1994-09-26 | 2006-03-01 | Steris, Inc. | Tratamiento acido de acero inoxidable. |
CA2266535A1 (en) * | 1996-09-18 | 1998-03-26 | Inna A. Novicova | Hydrogen peroxide disinfecting and sterilizing compositions |
US5958147A (en) * | 1997-05-05 | 1999-09-28 | Akzo Nobel N.V. | Method of treating a metal |
US6068879A (en) * | 1997-08-26 | 2000-05-30 | Lsi Logic Corporation | Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing |
US6649081B1 (en) | 1998-03-24 | 2003-11-18 | Henkel Corporation | Aqueous liquid deoxidizing composition and process for aluminum, with low foaming tendency |
EP1150341A4 (de) * | 1998-12-28 | 2005-06-08 | Hitachi Chemical Co Ltd | Materialien für metallpolierflüssigkeit, metallpolierflüssigkeit, ihre herstellung und poliermethode |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
AU2002252617B2 (en) | 2001-04-09 | 2007-05-31 | Ak Steel Properties, Inc. | Hydrogen peroxide pickling scheme for stainless steel grades |
MXPA03009217A (es) * | 2001-04-09 | 2005-03-07 | Ak Properties Inc | Aparato y metodo para remover peroxido de hidrogeno del licor de bano quimico para limpiar metales gastado. |
ATE309397T1 (de) | 2001-04-09 | 2005-11-15 | Ak Steel Properties Inc | Wasserstoffperoxid-beizen von siliciumhaltigen elektrostrahlqualitäten |
TW591089B (en) * | 2001-08-09 | 2004-06-11 | Cheil Ind Inc | Slurry composition for use in chemical mechanical polishing of metal wiring |
US6953389B2 (en) * | 2001-08-09 | 2005-10-11 | Cheil Industries, Inc. | Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching |
DE10156624B4 (de) * | 2001-11-17 | 2005-10-27 | Robert Bosch Gmbh | Verfahren und Beizlösung zum Abreinigen von Belägen eines Stahl-Werkstückes |
KR20030050026A (ko) * | 2001-12-18 | 2003-06-25 | 백운규 | 화학기계적 연마용 슬러리, 이들 슬러리의 제조방법 및이들 슬러리를 이용한 화학기계적 연마방법 |
DE10346192B4 (de) * | 2003-10-02 | 2009-08-06 | Thyssenkrupp Presta Teccenter Ag | Verfahren zum Entrosten von Formteilen und Verwendung des Verfahrens |
KR100795364B1 (ko) * | 2004-02-10 | 2008-01-17 | 삼성전자주식회사 | 반도체 기판용 세정액 조성물, 이를 이용한 세정 방법 및도전성 구조물의 제조 방법 |
KR20050110470A (ko) * | 2004-05-19 | 2005-11-23 | 테크노세미켐 주식회사 | 반도체 기판용 세정액 조성물, 이를 이용한 반도체 기판세정방법 및 반도체 장치 제조 방법 |
EP1793016A1 (de) * | 2005-12-01 | 2007-06-06 | Elpochem AG | Polier- und Entgratungsmittel für Werkstücke aus Kohlenstoffstahl und Verfahren zum chemischen Polieren und Entgraten |
CN102762708B (zh) * | 2009-07-06 | 2015-03-04 | 布拉斯通产品公司 | 清洁具有铝组件的传热系统的方法和组合物 |
GB2508827A (en) | 2012-12-11 | 2014-06-18 | Henkel Ag & Co Kgaa | Aqueous compositions and processes for passivating and brightening stainless steel surfaces |
CN117941706A (zh) * | 2017-01-31 | 2024-04-30 | 三菱瓦斯化学株式会社 | 杀菌用过氧化氢水溶液 |
US11678433B2 (en) | 2018-09-06 | 2023-06-13 | D-Wave Systems Inc. | Printed circuit board assembly for edge-coupling to an integrated circuit |
US11647590B2 (en) | 2019-06-18 | 2023-05-09 | D-Wave Systems Inc. | Systems and methods for etching of metals |
US12033996B2 (en) | 2019-09-23 | 2024-07-09 | 1372934 B.C. Ltd. | Systems and methods for assembling processor systems |
CA3081989A1 (en) | 2020-06-05 | 2021-12-05 | Fluid Energy Group Ltd. | Stable nitric acid blends and uses thereof |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE710733C (de) * | 1937-10-16 | 1941-09-19 | Schering Ag | Verfahren zum Beizen von Eisen und Eisenlegierungen |
DE1190292B (de) * | 1959-08-04 | 1965-04-01 | Huettenwerk Oberhausen Ag | Verfahren und Vorrichtung zum Polieren von Schliffen fuer metallographische Untersuchungen |
JPS5221460B1 (de) * | 1971-04-26 | 1977-06-10 | ||
JPS5120972B1 (de) * | 1971-05-13 | 1976-06-29 | ||
JPS5332341B2 (de) * | 1973-03-27 | 1978-09-07 | ||
US3945865A (en) * | 1974-07-22 | 1976-03-23 | Dart Environment And Services Company | Metal dissolution process |
SE400575B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for betning av koppar och dess legeringar |
SE400581B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for kemisk polering av koppar och dess legeringar |
ZA80996B (en) * | 1979-02-22 | 1981-04-29 | Wellcome Found | Imidazole derivatives and salts thereof,their synthesis,and pharmaceutical formulations |
FR2513258A1 (fr) * | 1981-09-21 | 1983-03-25 | Dart Ind Inc | Solution aqueuse de peroxyde d'hydrogene stabilisee au 3-amino-1,2,4-triazole et son procede de stabilisation |
JPS58197277A (ja) * | 1982-05-08 | 1983-11-16 | Mitsubishi Gas Chem Co Inc | 金属の化学的溶解処理液 |
US4462861A (en) * | 1983-11-14 | 1984-07-31 | Shipley Company Inc. | Etchant with increased etch rate |
US4510018A (en) * | 1984-02-21 | 1985-04-09 | The Lea Manufacturing Company | Solution and process for treating copper and copper alloys |
US4915781A (en) * | 1988-07-27 | 1990-04-10 | E. I. Du Pont De Nemours And Company | Stabilized hydrogen peroxide compositions |
US4875972A (en) * | 1988-07-27 | 1989-10-24 | E. I. Du Pont De Nemours And Company | Hydrogen peroxide compositions containing a substituted oxybenzene compound |
US4875973A (en) * | 1988-07-27 | 1989-10-24 | E. I. Du Pont De Nemours And Company | Hydrogen peroxide compositions containing a substituted aminobenzaldehyde |
JP2800020B2 (ja) * | 1989-04-18 | 1998-09-21 | 東海電化工業株式会社 | 錫又は錫合金の化学溶解剤 |
JP2995667B2 (ja) * | 1990-11-27 | 1999-12-27 | 東海電化工業株式会社 | 銅を含む酸性過酸化水素水溶液の安定化法 |
-
1991
- 1991-10-25 IT ITMI912845A patent/IT1251431B/it active IP Right Grant
-
1992
- 1992-10-23 US US08/211,964 patent/US5538152A/en not_active Expired - Fee Related
- 1992-10-23 DE DE69210622T patent/DE69210622T2/de not_active Expired - Fee Related
- 1992-10-23 EP EP92922319A patent/EP0609342B1/de not_active Expired - Lifetime
- 1992-10-23 BR BR9206668A patent/BR9206668A/pt not_active Application Discontinuation
- 1992-10-23 JP JP5507462A patent/JPH07500378A/ja active Pending
- 1992-10-23 WO PCT/EP1992/002442 patent/WO1993008317A1/fr active IP Right Grant
- 1992-10-23 CA CA002121691A patent/CA2121691A1/fr not_active Abandoned
- 1992-10-23 ES ES92922319T patent/ES2089573T3/es not_active Expired - Lifetime
- 1992-10-23 KR KR1019940701353A patent/KR100249061B1/ko not_active IP Right Cessation
-
1994
- 1994-04-22 FI FI941893A patent/FI100727B/fi active
Also Published As
Publication number | Publication date |
---|---|
WO1993008317A1 (fr) | 1993-04-29 |
FI941893A (fi) | 1994-06-01 |
US5538152A (en) | 1996-07-23 |
CA2121691A1 (fr) | 1993-04-29 |
FI941893A0 (fi) | 1994-04-22 |
JPH07500378A (ja) | 1995-01-12 |
BR9206668A (pt) | 1995-10-24 |
EP0609342B1 (de) | 1996-05-08 |
IT1251431B (it) | 1995-05-09 |
ES2089573T3 (es) | 1996-10-01 |
DE69210622T2 (de) | 1996-11-28 |
KR100249061B1 (ko) | 2000-04-01 |
FI100727B (fi) | 1998-02-13 |
ITMI912845A1 (it) | 1993-04-25 |
ITMI912845A0 (it) | 1991-10-25 |
EP0609342A1 (de) | 1994-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |