DE69209939T2 - Erhöhte Metall-Metall-Antischmelzsicherungsstrukturen und Verfahren zu deren Herstellung - Google Patents

Erhöhte Metall-Metall-Antischmelzsicherungsstrukturen und Verfahren zu deren Herstellung

Info

Publication number
DE69209939T2
DE69209939T2 DE69209939T DE69209939T DE69209939T2 DE 69209939 T2 DE69209939 T2 DE 69209939T2 DE 69209939 T DE69209939 T DE 69209939T DE 69209939 T DE69209939 T DE 69209939T DE 69209939 T2 DE69209939 T2 DE 69209939T2
Authority
DE
Germany
Prior art keywords
metal
making
methods
elevated
fuse structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69209939T
Other languages
English (en)
Other versions
DE69209939D1 (de
Inventor
Frank W Hawley
John L Mccollum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsemi SoC Corp
Original Assignee
Actel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actel Corp filed Critical Actel Corp
Application granted granted Critical
Publication of DE69209939D1 publication Critical patent/DE69209939D1/de
Publication of DE69209939T2 publication Critical patent/DE69209939T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE69209939T 1991-08-26 1992-08-03 Erhöhte Metall-Metall-Antischmelzsicherungsstrukturen und Verfahren zu deren Herstellung Expired - Fee Related DE69209939T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74986691A 1991-08-26 1991-08-26

Publications (2)

Publication Number Publication Date
DE69209939D1 DE69209939D1 (de) 1996-05-23
DE69209939T2 true DE69209939T2 (de) 1996-10-31

Family

ID=25015546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69209939T Expired - Fee Related DE69209939T2 (de) 1991-08-26 1992-08-03 Erhöhte Metall-Metall-Antischmelzsicherungsstrukturen und Verfahren zu deren Herstellung

Country Status (3)

Country Link
EP (1) EP0529820B1 (de)
JP (1) JPH05343527A (de)
DE (1) DE69209939T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614756A (en) 1990-04-12 1997-03-25 Actel Corporation Metal-to-metal antifuse with conductive
US5780323A (en) 1990-04-12 1998-07-14 Actel Corporation Fabrication method for metal-to-metal antifuses incorporating a tungsten via plug
US5468680A (en) * 1994-03-18 1995-11-21 Massachusetts Institute Of Technology Method of making a three-terminal fuse
US5572050A (en) * 1994-12-06 1996-11-05 Massachusetts Institute Of Technology Fuse-triggered antifuse
US5789764A (en) * 1995-04-14 1998-08-04 Actel Corporation Antifuse with improved antifuse material
CA2196557A1 (en) 1995-06-02 1996-12-05 Frank W. Hawley Raised tungsten plug antifuse and fabrication process

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914055A (en) * 1989-08-24 1990-04-03 Advanced Micro Devices, Inc. Semiconductor antifuse structure and method
US5006673A (en) * 1989-12-07 1991-04-09 Motorola, Inc. Fabrication of pad array carriers from a universal interconnect structure

Also Published As

Publication number Publication date
EP0529820B1 (de) 1996-04-17
EP0529820A1 (de) 1993-03-03
JPH05343527A (ja) 1993-12-24
DE69209939D1 (de) 1996-05-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee