DE69208812D1 - Dynamische Leistungskompensation - Google Patents

Dynamische Leistungskompensation

Info

Publication number
DE69208812D1
DE69208812D1 DE69208812T DE69208812T DE69208812D1 DE 69208812 D1 DE69208812 D1 DE 69208812D1 DE 69208812 T DE69208812 T DE 69208812T DE 69208812 T DE69208812 T DE 69208812T DE 69208812 D1 DE69208812 D1 DE 69208812D1
Authority
DE
Germany
Prior art keywords
dynamic power
power compensation
compensation
dynamic
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69208812T
Other languages
English (en)
Other versions
DE69208812T2 (de
Inventor
Masaharu Goto
Chris Koener
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69208812D1 publication Critical patent/DE69208812D1/de
Publication of DE69208812T2 publication Critical patent/DE69208812T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1906—Control of temperature characterised by the use of electric means using an analogue comparing device
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microcomputers (AREA)
  • Logic Circuits (AREA)
  • Amplifiers (AREA)
  • Control Of Temperature (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
DE69208812T 1991-11-01 1992-10-27 Dynamische Leistungskompensation Expired - Fee Related DE69208812T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/786,655 US5324916A (en) 1991-11-01 1991-11-01 System and method for dynamic power compensation

Publications (2)

Publication Number Publication Date
DE69208812D1 true DE69208812D1 (de) 1996-04-11
DE69208812T2 DE69208812T2 (de) 1996-07-25

Family

ID=25139230

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208812T Expired - Fee Related DE69208812T2 (de) 1991-11-01 1992-10-27 Dynamische Leistungskompensation

Country Status (4)

Country Link
US (1) US5324916A (de)
EP (1) EP0540287B1 (de)
JP (1) JP3369608B2 (de)
DE (1) DE69208812T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664118A (en) * 1994-03-28 1997-09-02 Kabushiki Kaisha Toshiba Computer system having detachable expansion unit
US6463396B1 (en) 1994-05-31 2002-10-08 Kabushiki Kaisha Toshiba Apparatus for controlling internal heat generating circuit
US5930110A (en) * 1994-03-28 1999-07-27 Kabushiki Kaisha Toshiba Computer system having detachable expansion unit
US5752011A (en) * 1994-06-20 1998-05-12 Thomas; C. Douglas Method and system for controlling a processor's clock frequency in accordance with the processor's temperature
US6489793B2 (en) 1996-10-21 2002-12-03 Delta Design, Inc. Temperature control of electronic devices using power following feedback
US6476627B1 (en) 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing
DE19983376T1 (de) 1998-07-14 2001-06-28 Schlumberger Technologies Inc Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen
AU4991799A (en) * 1998-07-14 2000-02-07 Schlumberger Technologies, Inc. Temperature control of electronic devices using power following feedback
US6518782B1 (en) 2000-08-29 2003-02-11 Delta Design, Inc. Active power monitoring using externally located current sensors
US6809538B1 (en) * 2001-10-31 2004-10-26 Intel Corporation Active cooling to reduce leakage power
GB0613832D0 (en) * 2006-07-12 2006-08-23 Univ Keele Virtual human interaction system
US8762097B2 (en) * 2006-08-04 2014-06-24 Apple Inc. Method and apparatus for a thermal control system based on virtual temperature sensor
US8344475B2 (en) 2006-11-29 2013-01-01 Rambus Inc. Integrated circuit heating to effect in-situ annealing
US11244727B2 (en) 2006-11-29 2022-02-08 Rambus Inc. Dynamic memory rank configuration
WO2008067494A1 (en) * 2006-11-29 2008-06-05 Rambus Inc. Integrated circuit with built-in heating circuitry to reverse operational degeneration
US8086358B2 (en) 2007-07-11 2011-12-27 International Business Machines Corporation Method for pre-heating high power devices to enable low temperature start-up and operation
US8785823B2 (en) * 2007-07-11 2014-07-22 International Business Machines Corporation Extending the operating temperature range of high power devices
US8378271B2 (en) * 2007-07-11 2013-02-19 International Business Machines Corporation Utilization of overvoltage and overcurrent compensation to extend the usable operating range of electronic devices
EP2191473A2 (de) 2007-09-05 2010-06-02 Rambus Inc. Verfahren und vorrichtung zur reperatur von defekten in nichtflüchtigen halbleiterspeicheranordnungen
US9419621B1 (en) * 2015-09-18 2016-08-16 Freescale Semiconductor, Inc. System on chip and method of operating a system on chip

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4284872A (en) * 1978-01-13 1981-08-18 Burr-Brown Research Corporation Method for thermal testing and compensation of integrated circuits
JPS57121268A (en) * 1981-01-20 1982-07-28 Matsushita Electric Ind Co Ltd Semiconductor device
FR2507353B1 (fr) * 1981-06-05 1985-08-30 Cepe Cellule de couplage thermique entre un element calorifique et un element thermo-sensible et enceinte thermostatee pour cristal piezo-electrique comportant une telle cellule
JPS60152045A (ja) * 1984-01-20 1985-08-10 Toshiba Corp 半導体装置
US4593258A (en) * 1985-02-13 1986-06-03 Gerald Block Energy conserving apparatus for regulating temperature of monitored device
JPS6274457A (ja) * 1985-09-30 1987-04-06 Toshiba Corp 恒温装置

Also Published As

Publication number Publication date
EP0540287A2 (de) 1993-05-05
EP0540287A3 (en) 1993-05-26
JP3369608B2 (ja) 2003-01-20
EP0540287B1 (de) 1996-03-06
DE69208812T2 (de) 1996-07-25
JPH05276008A (ja) 1993-10-22
US5324916A (en) 1994-06-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8339 Ceased/non-payment of the annual fee