DE69204340D1 - Verbesserte Glaskeramik-Kupfer-Verklebung. - Google Patents

Verbesserte Glaskeramik-Kupfer-Verklebung.

Info

Publication number
DE69204340D1
DE69204340D1 DE69204340T DE69204340T DE69204340D1 DE 69204340 D1 DE69204340 D1 DE 69204340D1 DE 69204340 T DE69204340 T DE 69204340T DE 69204340 T DE69204340 T DE 69204340T DE 69204340 D1 DE69204340 D1 DE 69204340D1
Authority
DE
Germany
Prior art keywords
glass ceramic
copper bonding
improved glass
improved
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69204340T
Other languages
English (en)
Other versions
DE69204340T2 (de
Inventor
Nunzio Dipaolo
Ananda Hosakere Kumar
Lovell Berry Wiggins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69204340D1 publication Critical patent/DE69204340D1/de
Publication of DE69204340T2 publication Critical patent/DE69204340T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/251—Al, Cu, Mg or noble metals
    • C03C2217/253—Cu
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/27—Mixtures of metals, alloys
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/17—Deposition methods from a solid phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
DE69204340T 1991-04-04 1992-03-13 Verbesserte Glaskeramik-Kupfer-Verklebung. Expired - Fee Related DE69204340T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/680,227 US5215610A (en) 1991-04-04 1991-04-04 Method for fabricating superconductor packages

Publications (2)

Publication Number Publication Date
DE69204340D1 true DE69204340D1 (de) 1995-10-05
DE69204340T2 DE69204340T2 (de) 1996-03-21

Family

ID=24730261

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69204340T Expired - Fee Related DE69204340T2 (de) 1991-04-04 1992-03-13 Verbesserte Glaskeramik-Kupfer-Verklebung.

Country Status (4)

Country Link
US (1) US5215610A (de)
EP (1) EP0507719B1 (de)
JP (1) JP2571323B2 (de)
DE (1) DE69204340T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3553157B2 (ja) * 1994-09-16 2004-08-11 新日本製鐵株式会社 高精度加工性に優れた精密機械用セラミックス構造部材
JP3553155B2 (ja) * 1994-09-16 2004-08-11 新日本製鐵株式会社 高精度加工性に優れた精密機械用セラミックス部材の製造方法
US6270601B1 (en) * 1998-11-02 2001-08-07 Coorstek, Inc. Method for producing filled vias in electronic components
US7393309B2 (en) * 2006-02-28 2008-07-01 Webber Randall T Dual action weightlifting machine
EP3140838B1 (de) 2014-05-05 2021-08-25 3D Glass Solutions, Inc. Induktives gerät in einer fotodefinierbaren glasstruktur
US20190177213A1 (en) * 2016-01-31 2019-06-13 3D Glass Solutions, Inc. Multi-Layer Photo Definable Glass with Integrated Devices
EP3420571A4 (de) 2016-02-25 2020-03-25 3D Glass Solutions, Inc. 3d-kondensator und kondensatoranordnung zur herstellung photoaktiver substrate
WO2017177171A1 (en) 2016-04-08 2017-10-12 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
KR102420212B1 (ko) 2017-04-28 2022-07-13 3디 글래스 솔루션즈 인코포레이티드 Ｒｆ 서큘레이터
JP6995891B2 (ja) 2017-07-07 2022-01-17 スリーディー グラス ソリューションズ，インク パッケージ光活性ガラス基板内のｒｆシステムのための２ｄ及び３ｄのｒｆ集中素子デバイス
US10854946B2 (en) 2017-12-15 2020-12-01 3D Glass Solutions, Inc. Coupled transmission line resonate RF filter
CA3082624C (en) 2018-01-04 2022-12-06 3D Glass Solutions, Inc. Impedance matching conductive structure for high efficiency rf circuits
US11076489B2 (en) 2018-04-10 2021-07-27 3D Glass Solutions, Inc. RF integrated power condition capacitor
WO2019231947A1 (en) 2018-05-29 2019-12-05 3D Glass Solutions, Inc. Low insertion loss rf transmission line
KR102322938B1 (ko) 2018-09-17 2021-11-09 3디 글래스 솔루션즈 인코포레이티드 접지면을 갖는 고효율 컴팩트형 슬롯 안테나
KR102493538B1 (ko) 2018-12-28 2023-02-06 3디 글래스 솔루션즈 인코포레이티드 광활성 유리 기판들에서 ｒｆ, 마이크로파, 및 ｍｍ 파 시스템들을 위한 이종 통합
EP3903339A4 (de) 2018-12-28 2022-08-31 3D Glass Solutions, Inc. Kondensator für hochfrequenz-, mikrowellen- und mm-wellensysteme
CA3135975C (en) 2019-04-05 2022-11-22 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
WO2020214788A1 (en) 2019-04-18 2020-10-22 3D Glass Solutions, Inc. High efficiency die dicing and release
KR20220164800A (ko) 2020-04-17 2022-12-13 3디 글래스 솔루션즈 인코포레이티드 광대역 인덕터

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676292A (en) * 1970-10-07 1972-07-11 Olin Corp Composites of glass-ceramic-to-metal,seals and method of making same
US3725091A (en) * 1971-04-12 1973-04-03 Corning Glass Works Glass-ceramic metal cermets and method
JPS5752417B2 (de) * 1973-05-04 1982-11-08
JPS5189518A (en) * 1975-02-04 1976-08-05 Garasuseramitsukusu kinzokufukugoseihinno seizohoho
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
US4301324A (en) * 1978-02-06 1981-11-17 International Business Machines Corporation Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
GB2139248A (en) * 1983-05-04 1984-11-07 Gen Electric Co Plc Copper alloy solderable contact pad produced by vapour deposition
US4594181A (en) * 1984-09-17 1986-06-10 E. I. Du Pont De Nemours And Company Metal oxide-coated copper powder
US4840654A (en) * 1985-03-04 1989-06-20 Olin Corporation Method for making multi-layer and pin grid arrays
US4871608A (en) * 1986-12-10 1989-10-03 Ngk Spark Plug Co., Ltd. High-density wiring multilayered substrate
US4861646A (en) * 1987-08-13 1989-08-29 Ceramics Process Systems Corp. Co-fired metal-ceramic package
US4816615A (en) * 1987-08-20 1989-03-28 General Electric Company Thick film copper conductor inks
JPH0812953B2 (ja) * 1988-11-07 1996-02-07 株式会社日立製作所 ガラスセラミックス多層回路基板焼結体

Also Published As

Publication number Publication date
DE69204340T2 (de) 1996-03-21
JPH04367575A (ja) 1992-12-18
JP2571323B2 (ja) 1997-01-16
EP0507719B1 (de) 1995-08-30
US5215610A (en) 1993-06-01
EP0507719A1 (de) 1992-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee