DE69204263D1 - Stapelbares Wärmerohr für eine dreidimensionale kompakte Anordnung von elektronischen Bauteilen. - Google Patents

Stapelbares Wärmerohr für eine dreidimensionale kompakte Anordnung von elektronischen Bauteilen.

Info

Publication number
DE69204263D1
DE69204263D1 DE69204263T DE69204263T DE69204263D1 DE 69204263 D1 DE69204263 D1 DE 69204263D1 DE 69204263 T DE69204263 T DE 69204263T DE 69204263 T DE69204263 T DE 69204263T DE 69204263 D1 DE69204263 D1 DE 69204263D1
Authority
DE
Germany
Prior art keywords
electronic components
heat pipe
compact arrangement
dimensional compact
stackable heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69204263T
Other languages
English (en)
Other versions
DE69204263T2 (de
Inventor
Howard L Davidson
Satyanarayana Nishtala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of DE69204263D1 publication Critical patent/DE69204263D1/de
Application granted granted Critical
Publication of DE69204263T2 publication Critical patent/DE69204263T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/20—Fastening; Joining with threaded elements
    • F28F2275/205—Fastening; Joining with threaded elements with of tie-rods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69204263T 1991-12-02 1992-11-09 Stapelbares Wärmerohr für eine dreidimensionale kompakte Anordnung von elektronischen Bauteilen. Expired - Fee Related DE69204263T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/801,672 US5181167A (en) 1991-12-02 1991-12-02 Stacking heatpipe for three dimensional electronic packaging

Publications (2)

Publication Number Publication Date
DE69204263D1 true DE69204263D1 (de) 1995-09-28
DE69204263T2 DE69204263T2 (de) 1996-02-01

Family

ID=25181762

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69204263T Expired - Fee Related DE69204263T2 (de) 1991-12-02 1992-11-09 Stapelbares Wärmerohr für eine dreidimensionale kompakte Anordnung von elektronischen Bauteilen.

Country Status (4)

Country Link
US (1) US5181167A (de)
EP (1) EP0545563B1 (de)
JP (1) JPH0715964B2 (de)
DE (1) DE69204263T2 (de)

Families Citing this family (45)

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US5469331A (en) * 1994-04-07 1995-11-21 Conway; Harry E. Cooling system for modular power supply device
US5583749A (en) * 1994-11-30 1996-12-10 Altera Corporation Baseboard and daughtercard apparatus for reconfigurable computing systems
JPH09210582A (ja) * 1995-12-01 1997-08-12 Fujikura Ltd ヒートパイプ
US6333849B1 (en) 1996-07-01 2001-12-25 Compaq Computer Corporation Apparatus for liquid cooling of specific computer components
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
AU6534298A (en) * 1997-02-05 1998-09-08 Penn State Research Foundation, The Apparatus and method of protecting electronics
FR2765067B1 (fr) * 1997-06-19 1999-07-16 Alsthom Cge Alcatel Module d'electronique de puissance et un dispositif d'electronique de puissance pourvu de tels modules
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
US6108228A (en) * 1997-12-02 2000-08-22 Micron Technology, Inc. Quad in-line memory module
FR2773941B1 (fr) * 1998-01-19 2000-04-21 Ferraz Echangeur di-phasique pour au moins un composant electronique de puissance
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US5986887A (en) * 1998-10-28 1999-11-16 Unisys Corporation Stacked circuit board assembly adapted for heat dissipation
DE19919781A1 (de) * 1999-04-30 2000-11-09 Wuerth Elektronik Gmbh Leiterplatte und Verfahren zu ihrer Anbringung
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
FR2845821B1 (fr) 2002-10-11 2005-12-02 Thales Sa Substrat electronique d'un module electronique a trois dimensions a fort pouvoir de dissipation thermique et module electronique
US7698815B2 (en) * 2003-04-14 2010-04-20 Thermal Corp. Method for forming a heat dissipation device
US6717813B1 (en) 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe
ES2288653T3 (es) * 2004-07-12 2008-01-16 Haberlein-Lehr, Ulla Sistema modular de montaje para el alojamiento seguro de modulos fotovoltaicos apilados horizontalmente durante el transporte.
US7617696B2 (en) * 2004-11-12 2009-11-17 Tecumseh Products Company Compact refrigeration system and power supply unit including dynamic insulation
US7478541B2 (en) * 2004-11-01 2009-01-20 Tecumseh Products Company Compact refrigeration system for providing multiple levels of cooling
US7068515B2 (en) * 2004-11-24 2006-06-27 Hewlett-Packard Development Company, L.P. Multi-chip module with stacked redundant power
US7623349B2 (en) * 2005-03-07 2009-11-24 Ati Technologies Ulc Thermal management apparatus and method for a circuit substrate
KR20080067328A (ko) 2005-09-06 2008-07-18 비욘드 블라데스 리미티드 3ｄｍｃ 아키텍처
JP4733092B2 (ja) * 2007-09-28 2011-07-27 富士フイルム株式会社 放射線画像撮影装置
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
CN102752987B (zh) * 2012-07-13 2015-07-08 北京控制工程研究所 一种应用于航天飞行器星敏感器的线路盒
FR3002411B1 (fr) * 2013-02-20 2015-03-06 Bull Sas Dissipateur thermique pour processeur
US9863716B2 (en) 2013-07-26 2018-01-09 Hamilton Sundstrand Corporation Heat exchanger with embedded heat pipes
US9253871B2 (en) 2013-10-31 2016-02-02 General Electric Company Circuit card assembly and method of fabricating the same
CZ305373B6 (cs) * 2014-02-14 2015-08-19 České vysoké učení technické v Praze, Ústav technické a experimentální fyziky Uspořádání přenosného zobrazovacího systému pro detekci záření
US10660236B2 (en) * 2014-04-08 2020-05-19 General Electric Company Systems and methods for using additive manufacturing for thermal management
US9521782B2 (en) 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
DE102014012826A1 (de) * 2014-08-28 2016-03-03 Diehl Aerospace Gmbh Modulare Baugruppe
US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
US10178800B2 (en) * 2017-03-30 2019-01-08 Honeywell International Inc. Support structure for electronics having fluid passageway for convective heat transfer
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
CN110300509A (zh) * 2019-06-29 2019-10-01 联想(北京)有限公司 一种散热装置
US12040690B2 (en) 2020-08-31 2024-07-16 General Electric Company Cooling a stator housing of an electric machine
US11839054B1 (en) * 2021-09-22 2023-12-05 Meta Platforms Technologies, Llc Stack-PCB design and midplane architecture
CN114405763B (zh) * 2022-02-10 2022-11-22 深圳市飞翼科技有限公司 一种触摸屏生产用点胶机及点胶方法
US20240098877A1 (en) * 2022-06-23 2024-03-21 Meta Platforms Technologies, Llc Stack-pcb architecture with embedded vapor chamber

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
US4631636A (en) * 1984-03-26 1986-12-23 Harris Corporation High density packaging technique for electronic systems
US4631573A (en) * 1985-05-24 1986-12-23 Sundstrand Corporation Cooled stack of electrically isolated semiconductors
DE3522127A1 (de) * 1985-06-20 1987-01-02 Siemens Ag Kuehlbare einrichtung zur aufnahme von elektrischen baugruppen
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
US5053856A (en) * 1990-09-04 1991-10-01 Sun Microsystems, Inc. Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices

Also Published As

Publication number Publication date
JPH0621290A (ja) 1994-01-28
JPH0715964B2 (ja) 1995-02-22
US5181167A (en) 1993-01-19
EP0545563A1 (de) 1993-06-09
EP0545563B1 (de) 1995-08-23
DE69204263T2 (de) 1996-02-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee