DE69128667T2 - Positionsbestimmungsmethode - Google Patents

Positionsbestimmungsmethode

Info

Publication number
DE69128667T2
DE69128667T2 DE69128667T DE69128667T DE69128667T2 DE 69128667 T2 DE69128667 T2 DE 69128667T2 DE 69128667 T DE69128667 T DE 69128667T DE 69128667 T DE69128667 T DE 69128667T DE 69128667 T2 DE69128667 T2 DE 69128667T2
Authority
DE
Germany
Prior art keywords
positioning method
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69128667T
Other languages
English (en)
Other versions
DE69128667D1 (de
Inventor
Kenji Saitoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69128667D1 publication Critical patent/DE69128667D1/de
Publication of DE69128667T2 publication Critical patent/DE69128667T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
DE69128667T 1990-07-23 1991-07-23 Positionsbestimmungsmethode Expired - Fee Related DE69128667T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2195337A JPH0480762A (ja) 1990-07-23 1990-07-23 位置検出装置及びその検出方法

Publications (2)

Publication Number Publication Date
DE69128667D1 DE69128667D1 (de) 1998-02-19
DE69128667T2 true DE69128667T2 (de) 1998-05-07

Family

ID=16339499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69128667T Expired - Fee Related DE69128667T2 (de) 1990-07-23 1991-07-23 Positionsbestimmungsmethode

Country Status (4)

Country Link
US (1) US5285259A (de)
EP (1) EP0468741B1 (de)
JP (1) JPH0480762A (de)
DE (1) DE69128667T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10315086A1 (de) * 2003-04-02 2004-10-21 Infineon Technologies Ag Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585923A (en) * 1992-11-14 1996-12-17 Canon Kabushiki Kaisha Method and apparatus for measuring positional deviation while correcting an error on the basis of the error detection by an error detecting means
JP3428705B2 (ja) * 1993-10-20 2003-07-22 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
US5625453A (en) * 1993-10-26 1997-04-29 Canon Kabushiki Kaisha System and method for detecting the relative positional deviation between diffraction gratings and for measuring the width of a line constituting a diffraction grating
DE69428327T2 (de) * 1993-10-29 2002-07-04 Canon Kk Verfahren und System zur Detektion einer Winkelabweichung unter Verwendung eines periodischen Musters
JPH07135168A (ja) * 1993-11-11 1995-05-23 Canon Inc アライメント方法及びそれを用いた位置検出装置
JPH0886612A (ja) * 1994-09-19 1996-04-02 Canon Inc 光ヘテロダイン干渉を利用した位置ずれ検出装置
JPH1022213A (ja) * 1996-06-28 1998-01-23 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
JPH11241908A (ja) 1997-12-03 1999-09-07 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
TW358156B (en) * 1998-08-18 1999-05-11 United Microelectronics Corp Alignment detector
US6717685B1 (en) * 1999-09-24 2004-04-06 Bae Systems Information In situ proximity gap monitor for lithography
JP4480009B2 (ja) * 2004-12-06 2010-06-16 Ｈｏｙａ株式会社 欠陥検査装置及び方法、並びにフォトマスクの製造方法
JP5633021B2 (ja) * 2009-06-29 2014-12-03 株式会社ブイ・テクノロジー アライメント方法、アライメント装置及び露光装置
JP6248401B2 (ja) * 2013-03-19 2017-12-20 富士電機株式会社 半導体装置の製造方法およびそれに用いられる露光マスク

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4704033A (en) * 1986-03-06 1987-11-03 Micronix Corporation Multiple wavelength linear zone plate alignment apparatus and method
EP0355496A3 (de) * 1988-08-15 1990-10-10 Sumitomo Heavy Industries Co., Ltd. Positionsdetektor mit sektorieller fresnelscher Zonenplatte
US4862318A (en) * 1989-04-04 1989-08-29 Avx Corporation Method of forming thin film terminations of low inductance ceramic capacitors and resultant article

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10315086A1 (de) * 2003-04-02 2004-10-21 Infineon Technologies Ag Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung
DE10315086B4 (de) * 2003-04-02 2006-08-24 Infineon Technologies Ag Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung
US7268877B2 (en) 2003-04-02 2007-09-11 Infineon Technologies Ag Method and apparatus for orienting semiconductor wafers in semiconductor fabrication

Also Published As

Publication number Publication date
EP0468741B1 (de) 1998-01-14
US5285259A (en) 1994-02-08
JPH0480762A (ja) 1992-03-13
EP0468741A1 (de) 1992-01-29
DE69128667D1 (de) 1998-02-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee