DE69126943D1 - Wasserlösliche Lötpaste - Google Patents

Wasserlösliche Lötpaste

Info

Publication number
DE69126943D1
DE69126943D1 DE69126943T DE69126943T DE69126943D1 DE 69126943 D1 DE69126943 D1 DE 69126943D1 DE 69126943 T DE69126943 T DE 69126943T DE 69126943 T DE69126943 T DE 69126943T DE 69126943 D1 DE69126943 D1 DE 69126943D1
Authority
DE
Germany
Prior art keywords
water
solder paste
soluble solder
soluble
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69126943T
Other languages
English (en)
Other versions
DE69126943T2 (de
Inventor
Raymond L Turner
Kirk E Johnson
Larry L Kimmel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DE69126943D1 publication Critical patent/DE69126943D1/de
Publication of DE69126943T2 publication Critical patent/DE69126943T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cosmetics (AREA)
  • Grain Derivatives (AREA)
DE69126943T 1990-10-31 1991-10-29 Wasserlösliche Lötpaste Expired - Fee Related DE69126943T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/608,041 US5141568A (en) 1990-05-15 1990-10-31 Water-soluble soldering paste

Publications (2)

Publication Number Publication Date
DE69126943D1 true DE69126943D1 (de) 1997-09-04
DE69126943T2 DE69126943T2 (de) 1997-11-27

Family

ID=24434772

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69126943T Expired - Fee Related DE69126943T2 (de) 1990-10-31 1991-10-29 Wasserlösliche Lötpaste

Country Status (4)

Country Link
US (1) US5141568A (de)
EP (1) EP0483763B1 (de)
KR (1) KR960002115B1 (de)
DE (1) DE69126943T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5312027A (en) * 1993-02-16 1994-05-17 Hughes Aircraft Company Precleaning of soldered circuit cards to prevent white residue
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
US6752309B1 (en) * 1999-07-22 2004-06-22 Oatey Co. Water soluble fluxes and methods of using the same
MXPA03000255A (es) * 2003-01-09 2005-02-14 Vargas Martinez Mauricio Removedor univeresal de componentes electronicos, pasta desoldadora para retirar componentes electronicos de montaje superficial discretos y convencionales.
EP1642670A4 (de) * 2003-06-09 2006-11-29 Senju Metal Industry Co Lötpaste
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
JP2005183904A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品
CN101342649B (zh) * 2008-08-25 2010-06-02 杨嘉骥 一种提高表面绝缘电阻的助焊剂
US7956114B2 (en) * 2009-03-09 2011-06-07 Raytheon Company Water immiscible rosin mildly activated flux
US8887981B2 (en) 2013-03-15 2014-11-18 Raytheon Company Temporary adhesive for component bonding

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1402644A (en) * 1920-09-23 1922-01-03 Passalacqua Augusto Soldering of aluminum
FR936050A (fr) * 1946-11-08 1948-07-07 Produit pour effectuer des soudures et soudo-brasures
US3305406A (en) * 1964-04-06 1967-02-21 Western Electric Co Method of fluxing an article to be soldered with noncorrosive fluxing compositions
US3684533A (en) * 1970-05-28 1972-08-15 Du Pont Screen printable solder compositions
SU460965A1 (ru) * 1973-06-11 1975-02-25 Предприятие П/Я Г-4816 Флюс дл пайки
US3925112A (en) * 1974-02-19 1975-12-09 Hercules Chemical Co Inc Solder fluxes
US4113525A (en) * 1977-06-30 1978-09-12 Chevron Research Company Carboxylic acid-containing wax fluxes
US4218248A (en) * 1978-04-21 1980-08-19 Scm Corporation Process for the manufacture of metal joining paste
ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
US4290824A (en) * 1979-12-10 1981-09-22 Cobar Resources, Inc. Water soluble rosin flux
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
US4478650A (en) * 1983-10-19 1984-10-23 At&T Technologies, Inc. Water soluble flux
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
US4738732A (en) * 1987-02-04 1988-04-19 Hughes Aircraft Co. Self cleaning liquid solder flux
US4872928A (en) * 1988-06-07 1989-10-10 Johnson Matthey Inc. Solder paste
EP0384627A1 (de) * 1989-02-22 1990-08-29 Ashraf Jafri Weichlötflussmittelzusammensetzungen

Also Published As

Publication number Publication date
EP0483763A3 (en) 1992-09-23
US5141568A (en) 1992-08-25
EP0483763A2 (de) 1992-05-06
DE69126943T2 (de) 1997-11-27
KR960002115B1 (ko) 1996-02-10
KR920007736A (ko) 1992-05-27
EP0483763B1 (de) 1997-07-23

Similar Documents

Publication Publication Date Title
DE69431001D1 (de) Lötpaste
DE69224014D1 (de) Weichlötpasta
DE69131712D1 (de) Lottragender anschlussdraht
FI941884A0 (fi) Vesiliukoinen pakkaus
FI982185A0 (fi) Vesiliukoiset kamtotesiinijohdokset
KR900012125A (ko) Ccd 카메라
DE69531138D1 (de) Dickschichtpaste
DE69117553D1 (de) Ausgangsschaltung
EP0452009A3 (en) Water soluble solder flux and paste
DE69226968D1 (de) Lottragender anschlussdraht
DE69519812D1 (de) Weichlotpastemischung
DE69115109D1 (de) Leitfähige Pastenzusammensetzung.
ATA193788A (de) Loetverbindung
DE69026551D1 (de) Integratorschaltung
DE69108336D1 (de) Lötmittelaufbringung.
DE69125522D1 (de) Photoelektrischer Schaltkreis
DE69112164D1 (de) Aufbringen einer Lötpaste.
DE69126943D1 (de) Wasserlösliche Lötpaste
DE59204995D1 (de) Anschlussklemme
DE69028184D1 (de) Wasserlösliches Lotflussmittel
DE69122204D1 (de) Lötgerät
FI931156A0 (fi) Antiproliferativa substituerade naftalenfoereningar
DE69210431D1 (de) Wasserlösliche Lötpaste
DE69126725D1 (de) Örtlich begrenzte Lötstation
DE69127226D1 (de) Wasserlöslisches Weichlötflussmittel

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: RAYTHEON CO. (N.D.GES.D. STAATES DELAWARE), LEXING

8339 Ceased/non-payment of the annual fee