EP0452009A3 - Water soluble solder flux and paste - Google Patents
Water soluble solder flux and paste Download PDFInfo
- Publication number
- EP0452009A3 EP0452009A3 EP19910302799 EP91302799A EP0452009A3 EP 0452009 A3 EP0452009 A3 EP 0452009A3 EP 19910302799 EP19910302799 EP 19910302799 EP 91302799 A EP91302799 A EP 91302799A EP 0452009 A3 EP0452009 A3 EP 0452009A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- paste
- water soluble
- solder flux
- soluble solder
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US508740 | 1990-04-12 | ||
US07/508,740 US5011546A (en) | 1990-04-12 | 1990-04-12 | Water soluble solder flux and paste |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0452009A2 EP0452009A2 (en) | 1991-10-16 |
EP0452009A3 true EP0452009A3 (en) | 1992-11-19 |
Family
ID=24023881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19910302799 Ceased EP0452009A3 (en) | 1990-04-12 | 1991-03-28 | Water soluble solder flux and paste |
Country Status (3)
Country | Link |
---|---|
US (1) | US5011546A (en) |
EP (1) | EP0452009A3 (en) |
JP (1) | JPH0775788B2 (en) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07121468B2 (en) * | 1990-10-03 | 1995-12-25 | メック株式会社 | Flux for soldering |
US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
JP3104606B2 (en) | 1995-03-24 | 2000-10-30 | 株式会社デンソー | Method of connecting substrate to connected material, connection structure thereof, and auxiliary material for connection |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
DE19647044A1 (en) * | 1996-11-14 | 1998-05-20 | Degussa | Paste for stoving layers |
US6017634A (en) * | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
US5985456A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits |
US6752309B1 (en) | 1999-07-22 | 2004-06-22 | Oatey Co. | Water soluble fluxes and methods of using the same |
JP3785435B2 (en) * | 1998-08-27 | 2006-06-14 | 株式会社デンソー | Solder paste and surface mount electronic device |
JP3649087B2 (en) | 1999-07-28 | 2005-05-18 | 株式会社デンソー | Adhesive method and adhesive structure for thermoplastic resin material |
DE10138505A1 (en) * | 2000-09-06 | 2002-03-14 | Gen Electric | Stable, non-volatile, non-toxic binder for alloy solder particles used on jet engine components comprises water and polyethylene oxide |
US7740713B2 (en) * | 2004-04-28 | 2010-06-22 | International Business Machines Corporation | Flux composition and techniques for use thereof |
US7052558B1 (en) * | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
JP5064379B2 (en) * | 2005-04-20 | 2012-10-31 | フィブロ−テック,インコーポレイテッド | Method for producing copper powder, method for producing metal powder, and method for producing nickel powder |
DE102005053553A1 (en) * | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Solder pastes with resin-free flux |
US8070047B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
US8070043B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
US8070044B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Polyamine flux composition and method of soldering |
US9620318B2 (en) * | 2011-08-12 | 2017-04-11 | Littlefuse, Inc. | Reflowable circuit protection device |
US8430294B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
US8434667B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
US8430293B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable amine, carboxylic acid flux composition and method of soldering |
US8430295B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US8434666B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
US10367126B2 (en) * | 2014-07-18 | 2019-07-30 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Light-emitting device |
US10730150B2 (en) * | 2017-08-07 | 2020-08-04 | Honeywell International Inc. | Flowable brazing compositions and methods of brazing metal articles together using the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE841097C (en) * | 1950-09-26 | 1952-06-13 | Fritz Koehler | Solder |
FR2168072A1 (en) * | 1972-01-14 | 1973-08-24 | Lake Chemical Co | |
US4153482A (en) * | 1977-11-15 | 1979-05-08 | Chevron Research Company | Process for soldering using a phosphorus-containing liquid flux |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4298407A (en) * | 1980-08-04 | 1981-11-03 | E. I. Du Pont De Nemours And Company | Flux treated solder powder composition |
US4428780A (en) * | 1983-02-07 | 1984-01-31 | Lake Chemical Co. | Solutions for use in bonding plates of storage batteries to connecting systems |
US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
US4557767A (en) * | 1983-10-31 | 1985-12-10 | Scm Corporation | Fusible powdered metal paste |
-
1990
- 1990-04-12 US US07/508,740 patent/US5011546A/en not_active Expired - Lifetime
-
1991
- 1991-03-12 JP JP3070310A patent/JPH0775788B2/en not_active Expired - Lifetime
- 1991-03-28 EP EP19910302799 patent/EP0452009A3/en not_active Ceased
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE841097C (en) * | 1950-09-26 | 1952-06-13 | Fritz Koehler | Solder |
FR2168072A1 (en) * | 1972-01-14 | 1973-08-24 | Lake Chemical Co | |
US4153482A (en) * | 1977-11-15 | 1979-05-08 | Chevron Research Company | Process for soldering using a phosphorus-containing liquid flux |
Also Published As
Publication number | Publication date |
---|---|
US5011546A (en) | 1991-04-30 |
EP0452009A2 (en) | 1991-10-16 |
JPH04228289A (en) | 1992-08-18 |
JPH0775788B2 (en) | 1995-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
|
17P | Request for examination filed |
Effective date: 19911219 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
|
17Q | First examination report despatched |
Effective date: 19940907 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 19961107 |