DE69108336D1 - Lötmittelaufbringung. - Google Patents

Lötmittelaufbringung.

Info

Publication number
DE69108336D1
DE69108336D1 DE69108336T DE69108336T DE69108336D1 DE 69108336 D1 DE69108336 D1 DE 69108336D1 DE 69108336 T DE69108336 T DE 69108336T DE 69108336 T DE69108336 T DE 69108336T DE 69108336 D1 DE69108336 D1 DE 69108336D1
Authority
DE
Germany
Prior art keywords
solder application
solder
application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69108336T
Other languages
English (en)
Other versions
DE69108336T2 (de
Inventor
Christopher A Hicks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69108336D1 publication Critical patent/DE69108336D1/de
Publication of DE69108336T2 publication Critical patent/DE69108336T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/16—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/17—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control infeed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/16—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/17—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control infeed
    • Y10T408/172—Responsive to Tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/306776—Axially
    • Y10T409/306832—Axially with infeed control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/306776—Axially
    • Y10T409/306832—Axially with infeed control means energized in response to activator stimulated by condition sensor
    • Y10T409/306888—In response to cutter condition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/307224—Milling including means to infeed rotary cutter toward work with infeed control means energized in response to activator stimulated by condition sensor
    • Y10T409/30728—In response to cutter condition

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manipulator (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
DE69108336T 1990-09-24 1991-09-13 Lötmittelaufbringung. Expired - Fee Related DE69108336T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/586,653 US5119759A (en) 1990-09-24 1990-09-24 Apparatus for solder nozzle height sensing

Publications (2)

Publication Number Publication Date
DE69108336D1 true DE69108336D1 (de) 1995-04-27
DE69108336T2 DE69108336T2 (de) 1995-10-12

Family

ID=24346610

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69108336T Expired - Fee Related DE69108336T2 (de) 1990-09-24 1991-09-13 Lötmittelaufbringung.

Country Status (4)

Country Link
US (1) US5119759A (de)
EP (1) EP0478192B1 (de)
JP (1) JP2582967B2 (de)
DE (1) DE69108336T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5457367A (en) * 1993-08-06 1995-10-10 Cycle Time Corporation Tool center point calibration apparatus and method
US5507872A (en) * 1994-11-22 1996-04-16 International Business Machines Corporation Contact sensor-based microdispensing tool
US5768104A (en) * 1996-02-22 1998-06-16 Cray Research, Inc. Cooling approach for high power integrated circuits mounted on printed circuit boards
JP3278714B2 (ja) * 1996-08-30 2002-04-30 東京エレクトロン株式会社 塗布膜形成装置
US5910719A (en) * 1996-09-17 1999-06-08 Cycle Time Corporation Tool center point calibration for spot welding guns
US6093251A (en) * 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
US6018865A (en) * 1998-01-20 2000-02-01 Mcms, Inc. Method for calibrating the Z origin position
US6366461B1 (en) 1999-09-29 2002-04-02 Silicon Graphics, Inc. System and method for cooling electronic components
DE10137195C1 (de) * 2001-07-31 2003-05-22 Bosch Gmbh Robert Vorrichtung zum Aufbringen eines fließfähigen Mediums auf eine Oberfläche eines Substrats
DE10144256B4 (de) * 2001-09-03 2011-12-01 Newfrey Llc Kurzzeit-Lichtbogenschweißsystem und -verfahren
DE10258555B4 (de) * 2002-12-14 2005-04-28 Leica Mikrosysteme Gmbh Wien Verfahren und System zum Anstellen und Schneiden eines Präparaten in einer Schneideeinrichtung
US8800482B2 (en) * 2005-12-29 2014-08-12 Exatec Llc Apparatus and method of dispensing conductive material with active Z-axis control
US7457686B2 (en) * 2007-03-14 2008-11-25 Ortho—Clinical Diagnostics, Inc. Robotic arm alignment
CN103909743B (zh) 2007-12-31 2017-01-11 埃克阿泰克有限责任公司 用于打印三维物品的装置和方法
US20110303737A1 (en) * 2009-06-04 2011-12-15 Panasonic Corporation Jet soldering device and soldering method
JP6227992B2 (ja) * 2013-12-11 2017-11-08 株式会社パラット 半田付け装置および方法
EP2962767B1 (de) * 2014-06-30 2017-04-12 ABB Schweiz AG System und Verfahren zur Ermittlung von Prozessparametern für die roboterbasierte Spritzapplikation von viskosen Fluiden
JP6380160B2 (ja) * 2015-02-25 2018-08-29 三菱電機株式会社 真空ピンセット及び半導体装置の製造方法
CN109366492A (zh) * 2018-10-24 2019-02-22 武汉理工大学 基于机器人的铸件打磨轨迹在线补偿系统及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3074264A (en) * 1960-04-27 1963-01-22 Sheffield Corp Gaging device
NL274071A (de) * 1961-01-27
US3809308A (en) * 1969-08-16 1974-05-07 Messer Griesheim Gmbh Machine for maintaining constant the distance of a cutting or welding torch from the work piece
JPS4894093U (de) * 1972-02-10 1973-11-10
US4425061A (en) * 1981-09-14 1984-01-10 Colt Industries Operating Corp Tool setting device for machining center
JPS6110913U (ja) * 1984-06-26 1986-01-22 日産ディーゼル工業株式会社 車両用エンジンのオイルレベルゲ−ジ
JPS61236462A (ja) * 1985-04-11 1986-10-21 Yamazaki Mazak Corp 光学式工具長測定装置
JPH0239720Y2 (de) * 1985-04-25 1990-10-24
US4661368A (en) * 1985-09-18 1987-04-28 Universal Instruments Corporation Surface locating and dispensed dosage sensing method and apparatus
US4745557A (en) * 1986-02-13 1988-05-17 Ltv Aerospace & Defense Company Machine tool control system
JPS63215373A (ja) * 1987-03-05 1988-09-07 Toshiba Corp クリ−ムはんだ塗布装置
US4762578A (en) * 1987-04-28 1988-08-09 Universal Instruments Corporation Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
US4914460A (en) * 1987-05-29 1990-04-03 Harbor Branch Oceanographic Institution Inc. Apparatus and methods of determining distance and orientation
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
JPH01274981A (ja) * 1988-04-26 1989-11-02 Fuji Heavy Ind Ltd 工業用ロボットの位置補正装置
JPH0737895B2 (ja) * 1988-12-16 1995-04-26 ジューキ株式会社 直接描画方法
JPH02100759U (de) * 1989-01-27 1990-08-10
JP3346983B2 (ja) * 1996-06-17 2002-11-18 松下電器産業株式会社 バンプボンディング装置及び方法

Also Published As

Publication number Publication date
DE69108336T2 (de) 1995-10-12
EP0478192B1 (de) 1995-03-22
US5119759A (en) 1992-06-09
JP2582967B2 (ja) 1997-02-19
EP0478192A3 (en) 1993-03-10
EP0478192A2 (de) 1992-04-01
JPH04226854A (ja) 1992-08-17

Similar Documents

Publication Publication Date Title
DE69112037T2 (de) Waferträger.
DE69108336T2 (de) Lötmittelaufbringung.
DE69105684T2 (de) Löteinrichtung.
DE69111876T2 (de) Ophthalmometer.
FI86263B (fi) Skaer- och slipanordning foer en glasskivkant.
FI86244B (fi) Bakugn-spisugnkombination.
DE59104521D1 (de) Polkern.
FI87009B (fi) Skovelhjul foer centrifugalpumpar.
FI910493A0 (fi) Spaerrbom.
DE69100071D1 (de) Kaefigmutter.
FI912962A (fi) Ljusoeverfoeringssystem.
FI912017A0 (fi) Katalytkompositioner.
ATE124392T1 (de) 8-sulfamylmethylen-2-aminotetraline.
FI902811A (fi) Ariadnetraoden.
FI900028A (fi) Belaeggningsmaterial.
DE59103525D1 (de) Honmachine.
DE69104797D1 (de) 2-Substituierte-1-Hydroxyindole.
DE59100113D1 (de) Rollcontainer.
ES1013471Y (es) Formulario sobre-carta.
FI901392A0 (fi) Form.
FI905657A (fi) Form.
FI901976A0 (fi) Stoedben (hydrauliskt) foer husvagn.
FI902997A (fi) Loegndetektor.(rislix)
NO900035D0 (no) Forplater (provitamineral).
ES1013685Y (es) Tureno pirotecnico.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee