DE69121747D1 - Einrichtung zum Halten eines Substrats - Google Patents

Einrichtung zum Halten eines Substrats

Info

Publication number
DE69121747D1
DE69121747D1 DE69121747T DE69121747T DE69121747D1 DE 69121747 D1 DE69121747 D1 DE 69121747D1 DE 69121747 T DE69121747 T DE 69121747T DE 69121747 T DE69121747 T DE 69121747T DE 69121747 D1 DE69121747 D1 DE 69121747D1
Authority
DE
Germany
Prior art keywords
holding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69121747T
Other languages
English (en)
Other versions
DE69121747T2 (de
Inventor
Mitsuji Marumo
Kazunori Iwamoto
Nobutoshi Mizusawa
Takao Kariya
Shunichi Uzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69121747D1 publication Critical patent/DE69121747D1/de
Application granted granted Critical
Publication of DE69121747T2 publication Critical patent/DE69121747T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69121747T 1990-03-23 1991-03-18 Einrichtung zum Halten eines Substrats Expired - Fee Related DE69121747T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2071886A JPH03273663A (ja) 1990-03-23 1990-03-23 基板保持装置

Publications (2)

Publication Number Publication Date
DE69121747D1 true DE69121747D1 (de) 1996-10-10
DE69121747T2 DE69121747T2 (de) 1997-01-23

Family

ID=13473464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69121747T Expired - Fee Related DE69121747T2 (de) 1990-03-23 1991-03-18 Einrichtung zum Halten eines Substrats

Country Status (4)

Country Link
US (1) US5160961A (de)
EP (1) EP0448316B1 (de)
JP (1) JPH03273663A (de)
DE (1) DE69121747T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168018B2 (ja) * 1991-03-22 2001-05-21 キヤノン株式会社 基板吸着保持方法
US5298939A (en) * 1991-11-04 1994-03-29 Swanson Paul A Method and apparatus for transfer of a reticle pattern onto a substrate by scanning
JPH05235154A (ja) * 1992-02-24 1993-09-10 Mitsubishi Electric Corp ウエハ把持装置
JP3224157B2 (ja) * 1992-03-31 2001-10-29 キヤノン株式会社 Ｘ線マスクとその製造方法、並びに該ｘ線マスクを用いたデバイス製造方法とｘ線露光装置
JP3173928B2 (ja) * 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
JP3332425B2 (ja) * 1992-11-10 2002-10-07 キヤノン株式会社 基板保持装置、並びにこれを用いた露光装置と半導体デバイス製造方法
DE69505448T2 (de) * 1994-03-15 1999-04-22 Canon Kk Maske und Maskenträger
JP3208000B2 (ja) * 1994-03-28 2001-09-10 キヤノン株式会社 基板保持システム
JP3247554B2 (ja) * 1994-07-19 2002-01-15 キヤノン株式会社 基板搬送装置およびこれを用いた露光装置
DE29518578U1 (de) * 1995-11-23 1996-01-18 Kodak Ag Vorrichtung zur Entnahme plattenförmiger Gegenstände von einem Stapel
DE19544684A1 (de) * 1995-11-30 1997-06-05 Kodak Ag Vorrichtung zur Entnahme und Überführung plattenförmiger Gegenstände von einem Stapel mit einer Ansaugvorrichtung
US5854819A (en) * 1996-02-07 1998-12-29 Canon Kabushiki Kaisha Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same
US5883703A (en) * 1996-02-08 1999-03-16 Megapanel Corporation Methods and apparatus for detecting and compensating for focus errors in a photolithography tool
JP3266515B2 (ja) * 1996-08-02 2002-03-18 キヤノン株式会社 露光装置、デバイス製造方法およびステージ装置
WO1999028220A1 (fr) 1997-12-03 1999-06-10 Nikon Corporation Dispositif et procede de transfert de substrats
JP2000040728A (ja) 1998-07-22 2000-02-08 Nippon Asm Kk ウェハ搬送機構
JP2001345248A (ja) * 2000-05-31 2001-12-14 Canon Inc 露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法
US7032287B1 (en) * 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
JP2004165439A (ja) * 2002-11-13 2004-06-10 Canon Inc ステージ装置
TWI245170B (en) * 2003-07-22 2005-12-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
KR100712551B1 (ko) * 2006-02-09 2007-05-02 삼성전자주식회사 스핀 유닛의 위치 재현성 실현이 가능한 스핀너 장비 및 그 운용 방법
US11175309B2 (en) * 2014-12-24 2021-11-16 Qualitau, Inc. Semi-automatic prober

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
US4820930A (en) * 1984-06-20 1989-04-11 Canon Kabushiki Kaisha Photomask positioning device
DE3620969A1 (de) * 1985-06-24 1987-01-02 Canon Kk Praezisionszufuehrmechanismus
US4757355A (en) * 1985-10-29 1988-07-12 Canon Kabushiki Kaisha Mask storing mechanism
JPH01281231A (ja) * 1987-10-22 1989-11-13 Fujitsu Ltd 試料保持装置
JP2631485B2 (ja) * 1988-01-28 1997-07-16 キヤノン株式会社 位置決め装置
JPH0243519A (ja) * 1988-08-03 1990-02-14 Fuji Electric Co Ltd 表示パネルの組立方法
JP2748127B2 (ja) * 1988-09-02 1998-05-06 キヤノン株式会社 ウエハ保持方法
JP2631395B2 (ja) * 1988-09-09 1997-07-16 キヤノン株式会社 露光装置の制御方法

Also Published As

Publication number Publication date
EP0448316A3 (en) 1992-03-04
EP0448316A2 (de) 1991-09-25
EP0448316B1 (de) 1996-09-04
JPH03273663A (ja) 1991-12-04
DE69121747T2 (de) 1997-01-23
US5160961A (en) 1992-11-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee